C 2003 Search Results

Contextual Info: KMVC PART NUM BER 050 K M 1002V C 050 K M 2502V C 050 K M 5002V C 050K M 7502V C 050 K M 1003V C 050 K M 1503V C 050 K M 2003V C 050 K M 2503V C 050 K M 3303V C 121K M 1002V C 121K M 2502V C 121K M 5002V C 121K M 7502V C 121KM 1003V C 121K M 1503V C 121K M 2503V C

smd n10

Abstract: transistor smd marking CR N10 SMD n10 smd MARKING f4 smd transistor HC49 smd smd marking N10 transistor smd cr
Contextual Info: C A L IB E R E L E C T R O N IC S IN C . specifications subject to change * revision 3-2003 C, CS, CR Series B3 HC-49/US SMD Microprocessor Crystals PART NUMBERING GUIDE Environmental/Mechanical Specifications on page F5 C A 32 C 3 - 30.000MHz Package C =HC49/US SMD 4.50mm max. ht.

MO-217

Abstract: 132A-1
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm x B D b1 SOT560-1 v M C A B w M C ball A1 index area v M C A B w M C b b3 E v M C A B w M C b2 v M C A B w M C

HBCC24

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC24: plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm b1 x B D SOT564-1 v M C A B w M C v M C A B w M C b ball A1 index area b3 E v M C A B w M C b2 v M C A B w M C

HBCC16

Abstract: SOT639-2 sot639
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C v M C A B w M C

HBCC16

Contextual Info: PDF: 2003 Mar 18 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b v M C A B w M C x B D SOT639-1 terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C detail X x C

Contextual Info: As of January, 2003 0.20 C B Unit: mm 6.50 0.20 C A A 0.75 A INDEX MARK 1.375 A 0.625 B Pin#1 INDEX B D E 0.75 6.50 C F G H 6 4x 0.2 C 4 3 2 1 48 × φ0.35 ± 0.05 φ0.08 M C A B 1.2 Max 0.25 ± 0.05 C 0.10 C 5 0.15 Details of the part A Package Code JEDEC

Contextual Info: FZ000271 _ _ S : \ A M P -K a wosa kiE C \C C _ C E\E N 22_ C a d D o ta \AutoC AD \FJ 0 4 0 4 1 3 \c - 1 12 3 8 9 8 - Rev.B.dwq THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2003 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. PIN NCI.7 5

109a

Contextual Info: As of January, 2003 0.20 C B Unit: mm 10.00 0.20 C A 8 7 6 5 4 3 2 1 0.80 11 10 9 A B C D E 10.00 B F G H J K L A 1.00 4x 0.15 1.00 0.80 112 × φ0.50 ± 0.05 φ0.08 M C A B 0.2 C 1.40 Max 0.10 C 0.40 ± 0.05 C Package Code JEDEC JEITA Mass reference value

CPT20035

Abstract: CPT20040 CPT20045 CPT20050
Contextual Info: CPT20035 thru CPT20050 I n ter n a tio n a l S e m ic o n d u c to r , I n c . SCHOTTKY POWER MODULE ü Inches Min B a seplate u Com m on C athode t B aseplate A=C om m on A node -> | N 14 - -+ | Q 14 - ->1 n \+-f f V ISI P art # C P T 20035' C P T 20040 C P T 20045

BP-114

Abstract: BP114 U 114
Contextual Info: Preliminary As of January, 2003 INDEX MARK 5.50 0.20 C A A 6 5 4 3 0.80 0.20 C B Unit: mm 2 1 A Pin#1 INDEX B C D E F G H 16.00 B J K L M N P R T 0.80 U V W 4x A 0.15 0.2 C 0.75 0.80 114 × φ0.50 ± 0.10 φ0.08 M C A B 1.40 Max 0.10 C 0.40±0.05 C Details of the part A

Application Programming Guide

Abstract: J2300
Contextual Info: User Guide C-WARE DEVELOPMENT SYSTEM C-WARE DEVELOPMENT SYSTEM VERSION 2.0 CDS20UG-UG/D Rev 07 C-Ware Development System User Guide C-WARE DEVELOPMENT SYSTEM, VERSION 2.0 C-WARE SOFTWARE TOOLSET, VERSION 2.3 CDS20UG-UG/D Rev 07 Copyright 2003 Motorola, Inc. All rights reserved. No part of this documentation may

MO-220

Abstract: sot817
Contextual Info: PDF: 2003 Jun 13 Philips Semiconductors Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e y1 C v M C A B w M C

2n2 j 100

Abstract: 56n j 400 LSMH-2012 M16-100 3n3 j 100
Contextual Info: High Frequency Multilayer Chip Inductor LSMH-2012 Series C A L IB E R E L E C T R O N IC S IN C . specifications subject to change * revision 3-2003 Dimensions Remarks < 120 nH C 0.9 ± 0.2 > 120 nH 1.2 ± 0.3 0.5 ± 0.3 C 2.0 ± 0.2 0.5 ± 0.3 (Not to scale)

BUT12A

Abstract: BUT12 MGE246
Contextual Info: DISCRETE SEMICONDUCTORS BUT12; BUT12A Silicon diffused power transistors Product specification Supersedes data of February 1996 File under Discrete Semiconductors, SC06 Philips S em ico n d u cto rs I C m i n e r . c o m E l e c t r o n i c - L i b r a r y S e r v i c e C o p y R i g h t 2003

Contextual Info: Preliminary As of January, 2003 0.20 Unit: mm A 0.20 C Y 7654321 0.35 C 4x C A B C D E F G H J K L M N P R T U 1.27 18.04 22.00 14.00 11.08 1.27 2.02 ± 0.22 0.69 ± 0.08 0.15 B 119 × φ 0.88 ± 0.06 φ 0.30 M C A B φ 0.15 M C Details of the part Y Package Code

SAF-XC164CS-16F40F

Abstract: 6p1 tube BJE contact INFINEON XC164 smd diode 100-16 RN C166 SAF-XC164CS-16F20F SAF-XC164CS-16R40F SAK-XC164CS-16F20F SAK-XC164CS-16F40F
Contextual Info: Da ta S h ee t, V 2. 1, J un . 20 03 X C 1 64 C S 1 6 - B i t S i n g l e - C h i p M i c r o c o n t r o l le r M i c ro c o n t ro l l e rs N e v e r s t o p t h i n k i n g . Edition 2003-06 Published by Infineon Technologies AG, St.-Martin-Strasse 53,

crimp CuSn4

Abstract: cuzn30 169400 114180 878416-0
Contextual Info: THIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBLICATION C 2003 BY T Y C O E L E C T R O N I C S C O R P O R A T I O N . A L L R | | 3 H T $ R E S E R V E D . C OP Y R I G HT 2003 STRIP FORM - SINGLE W IRE SEAL Bandware - Emzel-Dichtung System C A B STRIP FORM - UNSEALED

smd transistor marking A7 p7

Abstract: transistor MARKING CODE 24D C166 J1850 SAF-XC161CJ-16F20F SAF-XC161CJ-16F40F SAK-XC161CJ-16F20F SAK-XC161CJ-16F40F XC161 XC166
Contextual Info: Da ta S h ee t, V 2. 2, J un . 20 03 X C 1 61 C J 1 6 - B i t S i n g l e - C h i p M i c r o c o n t r o l le r M i c ro c o n t ro l l e rs N e v e r s t o p t h i n k i n g . Edition 2003-06 Published by Infineon Technologies AG, St.-Martin-Strasse 53,

HVQFN40

Abstract: MO-220 sot618
Contextual Info: PDF: 2003 Apr 22 Philips Semiconductors Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618 -2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 1/2 y1 C v M C A B w M C

HVQFN20

Abstract: sot797
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 x 3 x 0.85 mm D B SOT797-1 A terminal 1 index area A E A1 c detail X C e1 e e 1/2 5 y1 C v M C A B w M C b

BF-NB201209

Abstract: BF-SB100505 BF-SB160808 BF-SB201209
Contextual Info: C A L IB E R General Reel Dimensions E L E C T R O N IC S IN C . specifications subject to change * revision 3-2003 Reel Dimensions D ± 0.5 13.0 ± 0.5 B±1 A±2 c±1 Dimensions in mm Not to scale Series A B C D Quantity / Reel BF-SB100505 BF-SB160808 BF-SB201209

HVQFN64

Abstract: MO-220 jedec package MO-220 64 sot804
Contextual Info: PDF: 2003 Mar 27 Philips Semiconductors Package outline HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-1 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 1/2 y1 C v M C A B w M C

MO-220

Abstract: sot684 HVQFN56
Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 28 L y y1 C v M C A B w M C