BY THERMAL PERFORMANCE Search Results

The Effect of Forced Air Cooling on Heat Sink Thermal Ratings

Contextual Info: zpero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which

MOTOROLA POWER TRANSISTOR

Abstract: working of astable multivibrator circuit bipolar transistor tester mje13008 motorola AN1033 BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS Tektronix 7603 tester SCR DL111/D AN569
Contextual Info: by'ANI 083/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA AN1083 Basic Thermal Management of Power Semiconductors BY AL PSHAENICH MOTOROLA SEMICONDUCTOR PRODUCTS SECTOR Thermal management of power semiconductors is often overlooked by design engineers, either through oversight,

"exposed pad" PCB via

Abstract: "thermal via" thermal pcb guidelines AIC1573 copper thermal
Contextual Info: Thermal Design Considerations of Exposed Pad IC As the miniaturization of electronic devices, the small area and close proximity of ICs in these modules demands small packages with excellent thermal properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design.

TO-268

Contextual Info: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion

NCS5650

Abstract: AND8402
Contextual Info: AND8402 Thermal Considerations for the NCS5650 Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview Note 1 . On the other hand, because of the small footprint of the package, board−to−ambient thermal resistance (which

AN1010

Abstract: BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BCM8320 BDN14-6CB EXTRUDED ALUMINUM
Contextual Info: Application Note AN1010 Cooling Critical Components Introduction Design engineers are routinely faced with applications that require special thermal management attention. A CTS customer recently solved its thermal concern by selecting a CTS/IERC extruded aluminum “Peel and

conductivity meter circuit

Abstract: Gas Meter CH4 gas detector Rain alarm methane CO2 suction pump ZAF-3 AC100 SUS304 linear solenoid valve circuit diagram
Contextual Info: THERMAL CONDUCTIVITY GAS ANALYZER <THERMOMAT> DATA SHEET ZAF-3 Thermal conductivity gas analyzer is a gas analyzer which quantitatively measures gas concentration by utilizing a causal relationship that the temperature of a heated platinum wire changes with gas concentration.

SEFUSE SF226e

Abstract: SEFUSE SF240E SF169E SF152E SEFUSE SF214E SEFUSE SEFUSE SF129E SF139E SF214E SF240E
Contextual Info: DATA S H E E T Thermal Cutoff SEFUSETM SF/E SERIES ORGANIC THERMAL SENSITIVE PELLET TYPE 10 AMPERES RATED CURRENT NEC's thermal cutoff SE/E series is small, solid and reliable product which can be used under 10 amperes of rated current. It protects home appliances and industrial equipment from fire by opening of electrical circuit if it

Contextual Info: MOTOROLA Freescale Semiconductor, Inc. Order this document by MRF5S21090L/D SEMICONDUCTOR TECHNICAL DATA MRF5S21090LR3 and MRF5S21090LSR3 replaced by MRF5S21090HR3 and MRF5S21090HSR3. “H” suffix indicates lower thermal resistance package. MRF5S21090LR3 MRF5S21090LSR3

SE3004-DC70A

Abstract: thermal transfer printhead
Contextual Info: SE3004-DC70A Printhead Under development High speed thermal printhead with thermal historical control SE3004-DC70A High speed, high quality, and high durability are achieved by using step free structure with high performance partial glaze and highly conductive overcoat layer. SE300*-DC70A series are lined up which can accommodate with all types of

SE2004-DC70A

Contextual Info: SE2004-DC70A Printheads Under development High speed thermal printhead with thermal historical control SE2004-DC70A High speed, high quality, and high durability are achieved by using step free structure with high performance partial glaze and highly conductive overcoat layer. SE200*-DC70A series are lined up which can accommodate with all types of

SE2003-DC70A

Contextual Info: SE2003-DC70A Printheads Under development High speed thermal printhead with thermal historical control SE2003-DC70A High speed, high quality, and high durability are achieved by using step free structure with high performance partial glaze and highly conductive overcoat layer. SE200*-DC70A series are lined up which can accommodate with all types of

thermistor 3950k

Abstract: SE3003-DC70A TM1-8 thermal printhead
Contextual Info: SE3003-DC70A Printheads Under development High speed thermal printhead with thermal historical control SE3003-DC70A High speed, high quality, and high durability are achieved by using step free structure with high performance partial glaze and highly conductive overcoat layer. SE300*-DC70A series are lined up which can accommodate with all types of

SE2002-DC70A

Contextual Info: SE2002-DC70A Printheads Under development High speed thermal printhead with thermal historical control SE2002-DC70A High speed, high quality, and high durability are achieved by using step free structure with high performance partial glaze and highly conductive overcoat layer. SE200*-DC70A series are lined up which can accommodate with all types of

845GL

Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
Contextual Info: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

CS-8101

Contextual Info: Application Note Thermal Management for Linear Regulators by Kieran OÕMalley The thermal characteristics of regulators depend on their operating environment and the systemÕs load requirements. Because irreversible changes occur at a faster rate in packaged devices at elevated temperatures, it is essential that the regulatorÕs operating temperature be minimized. This article reviews thermal calculations for single and dual output regulators, the effect of

Contextual Info: MOTOROLA Freescale Semiconductor, Inc. Order this document by MRF5S19130/D SEMICONDUCTOR TECHNICAL DATA MRF5S19130R3 and MRF5S19130SR3 replaced by MRF5S19130HR3 and MRF5S19130HSR3. “H” suffix indicates lower thermal resistance package. MRF5S19130R3 RF Power Field Effect Transistors MRF5S19130SR3

sanken c6011

Abstract: 2SC4832 c6011 2SC6011 c6011 transistor NPN c6011 2SA2151 sanken audio "Sanken Rectifiers" "Sanken Electric"
Contextual Info: 2SC6011 Audio Amplification Transistor Features and Benefits Description ▪ ▪ ▪ ▪ By adapting the Sanken unique wafer-thinner technique, these NPN power transistors achieve power-up by decreasing thermal resistance, and provide higher voltage avalanche breakdown

transistor a2151

Abstract: A2151 2sa2151 equivalent for 2sa1668 sanken a2151 2sc6011 sanken audio sanken transistors mold "Sanken Rectifiers"
Contextual Info: 2SA2151 Audio Amplification Transistor Features and Benefits Description ▪ ▪ ▪ ▪ By adapting the Sanken unique wafer-thinner technique, these PNP power transistors achieve power-up by decreasing thermal resistance, and provide higher voltage avalanche breakdown

MRF1507

Abstract: thermal analysis pld 1.5 "thermal via" AN4005 EB209
Contextual Info: MOTOROLA Order this document by AN4005/D SEMICONDUCTOR APPLICATION NOTE AN4005 Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Prepared by: Jeanne Pavio and Mike McCloskey Motorola SPS Communications Technology Center

Contextual Info: 25 to 45 Watt UW Series Features • Ultra Wide Input Voltage Range ■ Low Noise, Highly Regulated Single Outputs ■ No Derating to 80°C Case Temperature ■ Six-Sided Shielded Low Thermal Gradient Copper Case ■ Overvoltage Protected Output ■ Pulse by Pulse Digital Current Limiting Thermal

lb1271

Abstract: LB1721M MFP20 3036C-MFP20
Contextual Info: Ordering number:ENN3178A Monolithic Digital IC LB1721M Thermal Head-Use, 8-Channel Transistor Array Overview Package Dimensions The LB1721M is an 8-channel transistor array that has a low output saturation voltage and can be driven by a CMOS IC. It is especially suited for use in thermal head, LED drive

cafs-220

Abstract: Seasonic ss series Seventeam power supply Thermotron ST-251HR SS-235PS teac fd 235hf testo anemometer teac FD 5.25 seasonic
Contextual Info: Thermal Considerations for the Pentium III processor at 550MHz Heatsinks & Airflow in ATX chassis May 1999 Order Number: 245184-001 Thermal Considerations for the Pentium® III processor Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

Contextual Info: Chip tantalum capacitors with Fail-safe open structure type TCFG series C Case Features 1) Safety design by open function built - in. 2) Wide capacitance range 3) Screening by thermal shock. Dimensions (Unit : mm) Anode mark (Unit : mm) Dimensions