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    BY THERMAL PERFORMANCE Search Results

    BY THERMAL PERFORMANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    29C863ADM/B
    		Rochester Electronics LLC AM29C863A -High Performance CMOS Bus Transceiver PDF Buy
    MG82380-20/B
    		Rochester Electronics LLC 82380 - 32 Bit High Performance DMA Controller PDF Buy
    MG87C196KC/B
    		Rochester Electronics LLC 87C196KC - 16-bit Microcontroller, high performance, MCS-96 microcontroller family PDF Buy
    MG87C196KD-16/R
    		Rochester Electronics LLC 87C196KD - 16-bit Microcontroller, high performance, MCS-96 microcontroller family PDF Buy
    N87C196KC-20
    		Rochester Electronics LLC 87C196KC - 16-bit Microcontroller, high performance, MCS-96 microcontroller family PDF Buy

    BY THERMAL PERFORMANCE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    JTP 55 diode

    Abstract: diode sod57 SOD87 sod87 package Schottky SOD87 JTP 38 diode JTp 07
    Contextual Info: Philips Semiconductors Thermal Considerations - Diodes General THERMAL CONSIDERATIONS - DIODES Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the die. Normally, both are improved by keeping the die temperature junction temperature low.


    Original     		MBH562 MGA200 JTP 55 diode diode sod57 SOD87 sod87 package Schottky SOD87 JTP 38 diode JTp 07 PDF

    base resistance for SOT23

    Abstract: MBB444
    Contextual Info: Philips Semiconductors Thermal Considerations - FETs General ,  , ,  THERMAL CONSIDERATIONS ,, , Thermal resistance 1 Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are improved by keeping the die temperature junction


    Original     		MBE242 MGC124 MBB447 base resistance for SOT23 MBB444 PDF

    The Effect of Forced Air Cooling on Heat Sink Thermal Ratings

    Contextual Info: zpero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which


    Original     		PDF

    MOTOROLA POWER TRANSISTOR

    Abstract: working of astable multivibrator circuit bipolar transistor tester mje13008 motorola AN1033 BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS Tektronix 7603 tester SCR DL111/D AN569
    Contextual Info: by'ANI 083/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA AN1083 Basic Thermal Management of Power Semiconductors BY AL PSHAENICH MOTOROLA SEMICONDUCTOR PRODUCTS SECTOR Thermal management of power semiconductors is often overlooked by design engineers, either through oversight,


    OCR Scan     		AN1083/D AN1083/D MOTOROLA POWER TRANSISTOR working of astable multivibrator circuit bipolar transistor tester mje13008 motorola AN1033 BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS Tektronix 7603 tester SCR DL111/D AN569 PDF

    "exposed pad" PCB via

    Abstract: "thermal via" thermal pcb guidelines AIC1573 copper thermal
    Contextual Info: Thermal Design Considerations of Exposed Pad IC As the miniaturization of electronic devices, the small area and close proximity of ICs in these modules demands small packages with excellent thermal properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design.


    Original     		im1573 "exposed pad" PCB via "thermal via" thermal pcb guidelines AIC1573 copper thermal PDF

    MTC1000A

    Abstract: wenzhou Thyristor 1600V
    Contextual Info: Thyristor/Thyristor Module MTC1000A 1600V Thyristor/Diode Module MFC1000A 1600V FEATURES • High voltage • Industrial standard package • Low thermal resistance • Designed and qualified for industrial level • Excellent thermal performances obtained by the usage of


    Original     		MTC1000A MFC1000A wenzhou Thyristor 1600V PDF

    MTC130A

    Abstract: wenzhou thyristor gate control circuit
    Contextual Info: Thyristor/Thyristor Module Thyristor/Diode Module MTC130A /160A MFC130A /160A FEATURES • High voltage • Industrial standard package • Low thermal resistance • Designed and qualified for industrial level • Excellent thermal performances obtained by the usage of


    Original     		MTC130A /160A MFC130A /160A wenzhou thyristor gate control circuit PDF

    tqfp 44 thermal resistance datasheet

    Abstract: tqfp 44 thermal resistance plcc junction to ambient resistance 500LFM QL12X16B QL16X24B QL24X32B QL8X12B Thermal Resistance Calculation TO
    Contextual Info: THERMAL MANAGEMENT The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external environment. This is represented in


    Original     		QL24X32B QL8X12B QL12X16B QL16X24B tqfp 44 thermal resistance datasheet tqfp 44 thermal resistance plcc junction to ambient resistance 500LFM QL12X16B QL16X24B QL24X32B QL8X12B Thermal Resistance Calculation TO PDF

    AAVID THERMALLOY COMPOUND 250

    Contextual Info: THERMAL PERFORMANCE OF INTERFACE MATERIAL IN MICROELECTRONICS PACKAGING APPLICATIONS By l Malcolm Early , Seri Lee, and Mark Pellilo Aavid Thermal Technologies, Inc. Laconia, New Hampshire 03247 As the need to dissipate heat from microelectronics packaging increases, the role of


    Original     		PDF

    TB-093

    Abstract: Heat Technology
    Contextual Info: Technical Brief High-Speed Board Design Advisor Thermal Management Introduction This document contains a step-by-step tutorial and checklist with a best-practice set of step-by-step guidelines to support users to design and review their thermal design with Stratix II GX FPGAs.


    Original     		PDF

    OTF-300

    Abstract: OTF-900 Santec otf-300 OTF-600 OTF-610 santec santec OTF OTF-640 ODL-600 OTF-20M
    Contextual Info: Features • Unique differential method using high performance optical filter PAT. PEND • Passive (no moving parts, no power supply required) • ITU grid wavelength standard • Wavelength accuracy < ±0.01nm (including polarization dependence) • Thermal stability < ±0.01nm @0-70°C (by thermal compensation)


    Original     		OWL-10 TR-NWT-000468. OWL-10 ODL-320/600/610 ODL-320/600/610 0300ps 300ps ODL-320) ODL-600/610) OTF-300 OTF-900 Santec otf-300 OTF-600 OTF-610 santec santec OTF OTF-640 ODL-600 OTF-20M PDF

    EFTEC-64

    Abstract: OPQ0014
    Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		Q1-02 HQ160 HQ208 HQ240 HQ304 MO-108DDI OPQ0021 143-FA OPQ0020 MO-143-GA EFTEC-64 OPQ0014 PDF

    Tokin ohd3

    Abstract: ohd3 OHD3 90m OHD3 75B tokin mdcs TOKIN OHD- 90 CG-L53 OHD5R tokin ohd nec 500t
    Contextual Info: CONTENTS 2 Thermal Reed Switch TRS . 4 TRS Series Approved by UL, CSA, and VDE .


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    xp1800

    Contextual Info: Product Sheets for Approval Model No. 389-3451 1. Specification 2. Specification & Dimension Heat Sink / Clip / Fan 3. Test Reports Thermal Performance Doc No. Issued Date Edition : : 01 Oct., 2008 : Audited by Page 1 Checked by Drafted by Specification 389-3451


    Original     		D-149 D-257 XP1800+ PGA-462 5500RPM GW101 5500RPM xp1800 PDF

    Melcor peltier

    Abstract: peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes
    Contextual Info: MEASURING THE EFFECTS OF ENERGY FLOW ON IC PACKAGE THERMAL PERFORMANCE APPLICATION NOTE AN-160 Integrated Device Technology, Inc. By Chris Wyland ABSTRACT Heat to Air This paper is an examination of how to model PCB conduction effects when modeling IC package thermal performance.


    Original     		AN-160 EIA/JESD51-1 MRL-92-TIR-2 EIA/JESD51-3 Melcor peltier peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes PDF

    motorola MN transistor

    Abstract: FR4 dielectric constant vs temperature AR338
    Contextual Info: AR338 METAL-BACKED BOARDS IMPROVE THERMAL PERFORMANCE OF POWER By PCIM Staff With Contributions by Herb Fick/Bergquist Company Al Pshaenich and Dave Hollander/Motorola Semiconductor Scott LindblomTexas Instruments Reprinted from Powerconversion & Intelligent Motion,


    OCR Scan     		AR338 -------AR338/D AR338/D motorola MN transistor FR4 dielectric constant vs temperature AR338 PDF

    TO-268

    Contextual Info: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion


    Original     		O-263) O-268) O-263 O-268 1-866-9-OHMITE TO-268 PDF

    resistor R1J

    Abstract: ramps 1.4
    Contextual Info: AND8214/D General Thermal Transient RC Networks Packaging Technology Development http://onsemi.com Prepared by: Roger Paul Stout, PE ON Semiconductor APPLICATION NOTE INTRODUCTION This monograph develops a generalized thermal RC network methodology suitable for generating transient


    Original     		AND8214/D resistor R1J ramps 1.4 PDF

    ssop junction to ambient resistance

    Abstract: AN2021 Package Thermal Considerations SMD Packages 74F2244 74F240 74F244 74F245 Thermal Considerations for Power Semiconductors 74F373
    Contextual Info: Philips Semiconductors Application note Thermal considerations for FAST logic products AN2021 The equation for static power dissipation is, INTRODUCTION Thermal considerations by both supplier and user require more attention as package sizes shrink and operating frequencies


    Original     		AN2021 SF00654 SF00655 ssop junction to ambient resistance AN2021 Package Thermal Considerations SMD Packages 74F2244 74F240 74F244 74F245 Thermal Considerations for Power Semiconductors 74F373 PDF

    By Thermal Performance

    Contextual Info: How to Use this Guide: This guide is a tool to help you find the right Aavid cooling solution for your design. Solutions are listed by shape and thermal performance. SynJet solutions are listed multiple times as based on thermal performance for different available settings. For


    Original     		25cm2 75cm2) L100-270 15cm2. By Thermal Performance PDF

    NCS5650

    Abstract: AND8402
    Contextual Info: AND8402 Thermal Considerations for the NCS5650 Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview Note 1 . On the other hand, because of the small footprint of the package, board−to−ambient thermal resistance (which


    Original     		AND8402 NCS5650 AND8402/D NCS5650 AND8402 PDF

    AN1010

    Abstract: BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BCM8320 BDN14-6CB EXTRUDED ALUMINUM
    Contextual Info: Application Note AN1010 Cooling Critical Components Introduction Design engineers are routinely faced with applications that require special thermal management attention. A CTS customer recently solved its thermal concern by selecting a CTS/IERC extruded aluminum “Peel and


    Original     		AN1010 BCM8320 AN1010 BGA and QFP Package 14x14 BGA Package 14x14 BGA PACKAGE thermal resistance QFP PACKAGE thermal resistance BGA 15X15 BDN14-6CB EXTRUDED ALUMINUM PDF

    MECL handbook

    Abstract: MECL System Design Handbook mc10123 MC10124 application AN720 MECL III Series MC10H160 MC10H135
    Contextual Info: SYSTEM DESIGN CONSIDERATIONS THERMAL MANAGEMENT Circuit performance and long–term circuit reliability are affected by die temperature. Normally, both are improved by keeping the IC junction temperatures low. Electrical power dissipated in any integrated circuit is a


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    AN1232

    Abstract: QFP PACKAGE thermal resistance micromechanical
    Contextual Info: MOTOROLA Order this document by AN1232/D SEMICONDUCTOR TECHNICAL DATA AN1232 Thermal Performance of Plastic Ball Grid Array PBGA Packages for Next Generation FSRAM Devices Prepared by: Shailesh Mulgaonker (APDC, Phoenix, AZ) and Bennett Joiner (APDPL, Austin, TX)


    Original     		AN1232/D AN1232 AN1232/D* AN1232 QFP PACKAGE thermal resistance micromechanical PDF