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    BU-6574 Search Results

    BU-6574 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68657-414HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. PDF
    68657-402HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. PDF
    68657-426HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. PDF
    68657-417HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. PDF
    68657-409HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. PDF
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    BU-6574 Price and Stock

    ROHM Semiconductor

    ROHM Semiconductor BU6574FV-E2

    IC AFE 16BIT 20-SSOP-B
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    DigiKey BU6574FV-E2 Tape & Reel
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