BREAK OVER DIODE Search Results

db3 c

Abstract: break glass unit
Contextual Info: DB3-DB3TG Pb 350mW Bi-directional trigger diodes DO-35 RoHS COMPLIANCE Features Vbo : 32V Version Low break-over current. DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and terminals are readily solderable

ADG200-series

Abstract: ADG200CJ MIL-STO-883
Contextual Info: 01CMOS ProtectedDualSPSTAnalogSwitch ADG200 ANALOG W DEVICES FEATURES latch.Proof DI CMOS Overvoltage.Proof: VSUPPL Y :!:25V Superior DG-200 Replacement Break-Before-MakeSwitching Action RON: 100n max over Full Temperature Range Direct TTl/CMOS Interface OBS

Contextual Info: DB3-DB3TG 150mW Bi-directional Trigger Diodes Features • • • • • • • • • • VBO : 32V Version Low break-over current DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and

Contextual Info: DB3-DB3TG 350mW Bi-directional Trigger Diodes Features • • • • • • • • • • VBO : 32V Version Low break-over current DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and

DB3TG

Contextual Info: DB3-DB3TG 150mW Bi-directional Trigger Diodes Features • • • • • • • • • • VBO : 32V Version Low break-over current DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and

C22nF

Contextual Info: LLDB3-LLDB3TG Pb RoHS COMPLIANCE 150mW Bi-direction trigger diodes MINIMELF Features — — — — — — — — — — — Vbo : 32V Version Low break-over current. LL-34 Mini-MELF package Hermetically sealed glass Compression bonded construction All external surfaces are corrosion

dg506abr

Abstract: 5202 GE SL4 diode DS5B
Contextual Info: SSSSS DG506A/507A 16-Channel and Dual 8-Channel CMOS Analog Multiplexers FEATURES BENEFITS APPLICATIONS • TTL & CMOS Direct Control Over Military Temperature Range • Easily Interfaced • Reduced Power Consumption • Low Power 30 mW typ. • Break-Before-Make Switching

DG508ACK

Abstract: DG508AAK DG509ADY iC-MG
Contextual Info: DG508A/509A 8-Channel/Dual 4-Channel CMOS Analog Multiplexers JETS» FEATURES BENEFITS APPLICATIONS • TTL & CMOS Direct Control Over Military Temperature Range • Low Power 30 mW typ. • Break-Before-Make Switching • 44 V Power Supply Rating • •

DG200BP

Abstract: 200BP S18A ADG20
Contextual Info: AN ALO G D E V IC E S □ Dl CMOS Protected Dual SPST Analog Switch FEATURES Latch-Proof Dl CMOS Overvoltage-Proof: ^ supply ± 25V Superior DG-200 Replacement Break-Before-Make Switching Action Ron: 100n max over Full Temperature Range Direct TTL/CMOS Interface

MAX466

Abstract: MAX4664 MAX4664CPE MAX4664CSE MAX4664EPE MAX4664ESE MAX4665 MAX4666 5V SPST Reed Relay
Contextual Info: 19-1504; Rev 0; 7/99 5Ω, Quad, SPST, CMOS Analog Switches Features ♦ Low On-Resistance 5Ω max ♦ Guaranteed RON Match Between Channels (0.5Ω max) ♦ Guaranteed RON Flatness over Specified Signal Range (0.5Ω max) ♦ Guaranteed Break-Before-Make (MAX4666)

MAX466

Abstract: MAX4664 MAX4664CPE MAX4664CSE MAX4664EPE MAX4664ESE MAX4665 MAX4666
Contextual Info: 19-1504; Rev 0; 7/99 5Ω, Quad, SPST, CMOS Analog Switches Features ♦ Low On-Resistance 5Ω max ♦ Guaranteed RON Match Between Channels (0.5Ω max) ♦ Guaranteed RON Flatness over Specified Signal Range (0.5Ω max) ♦ Guaranteed Break-Before-Make (MAX4666)

sil 9002

Abstract: DG506ABR iC-MHA MN 5198 K VAJI DG506A DG506AAK DG506ABK DG507A DG536
Contextual Info: üSSSfö DG 506A /507A 16-Channel and Dual 8-Channel C M O S Analog Multiplexers FEATURES BENEFITS APPLICATIONS • TTL & CMOS Direct Control Over Military Temperature Range • Low Power 30 mW typ. • Break-Before-Make Switching • ESD Protection > ± 2500 V

5c2 zener diode

Abstract: zener 5c2 zener DIODE 5c2 ADG200CJ ADG200BP 310s ADG200AA 5c2 zener ADG200 ADG200BA
Contextual Info: DI CMOS Protected Dual SPST Analog Switch ANALOG DEVICES FEATURES Latch Proof Dl CMOS Overvoltage-Proof: V s u pply ± 2 5 V Superior DG 200 Replacement Break-Before-Make Switching Action Rq n • 100Î2 max over Full Temperature Range Direct TTL/CM O S Interface

HI-303-5

Abstract: HI1-0303-2 HI1-0303-5 HI-303 HI3-0303-5 HI9P0303-9 HI-303-2
Contextual Info: HI-303 Data Sheet August 2003 FN3125.9 Dual, SPDT CMOS Analog Switch Features The HI-303 switch is a monolithic device fabricated using CMOS technology and the Intersil dielectric isolation process. This switch features break-before-make switching, low and nearly constant ON resistance over the full analog

Fiber-Bragg-Grating in EDWA

Abstract: HI1060 fibre pump laser UC974A UC960 Fiber Bragg Grating Fiber-Bragg-Grating UC960A UC980A 60825-1Edition
Contextual Info: Data sheet 980 nm Pump Laser Module, Un-cooled Features • Operating temperature range from 0°C to 70°C case • >120 mW linear power over full temperature range Bookham Technology’s UC9*A 980 nm Pump Laser Module is a break-through product enabling low-cost, highly reliable

IH6216CPI

Abstract: DG507 S14B s24b IH6216 s25b AD7507 HI507 IH6216CDI IH6216MDI
Contextual Info: IH6216 8-Channel Differential C M O S A n alog M ultiplexer OffffiEÜ^DIL FEATURES GENERAL DESCRIPTION • Pin compatible with HI507, DG507 & AD7507 • ± 11V analog signal range • r o s o n < 700 ohms over full signal and temperature range • Break before make switching

C101

Abstract: IEC-61000-4-2 IEC61340-3-2 JESD22 STG4158 STG4158BJR marking 158
Contextual Info: STG4158 Low voltage 0.6 Ω typ single SPDT switch with break-before-make feature and 15 kV ESD protection Features • Power-off and over-voltage protection ■ Wide operating voltage range: VCC opr = 1.65 to 4.5 V ■ Low ON resistance VIN = 0 V: – RON = 0.85 Ω (max) at VCC = 4.5 V

diac N413

Abstract: N413 N413M n413m diac diac bidirectional diode ht 40 diac VB01 diac diac with triac DIAC DO35
Contextual Info: DIAC N413 SILICON BIDIRECTIONAL TRIGGER DIODE FEATURES Suitable fo r T R I AC trigger • DO-35 package MAXIMUM RATINGS PACKAGE DIMENSIONS U nit • mm ITEM SYMBOL Peak Current *P Storage Temperature Tstg Junction Temperature Ti 0 2.2 MAX. RATING U N IT

V23134-A1052-X299

Abstract: "Power Relay"
Contextual Info: Power relay F4 V23134-A1052-X299 Data sheet change over with bracket and diode in parallel to the coil 3D40HB30.WMF Issued: 2005-11-14, Ed 02 Power relay F4 V23134-A1052-X299 02 max Dimensional drawing m ax Latching tab area max max Flat terminal similar

diac db3 specifications

Abstract: diac db3 DIAC 220v DIAC application db3 diac diac db3 applications DB3-22 db3 22 DIAC DATASHEET 220v break glass unit
Contextual Info: Continental Device India Limited An ISO/TS16949 and ISO 9001 Certified Company SILICON DIAC BIDIRECTIONAL TRIGGER DIODE GLASS PASSIVATED PNPN DEVICE DIAC DB3-22 DO-35 Glass Axial Package Marking C DB3 -22 APPLICATIONS For Triggering TRIACs, SCRs, Industrial and Commercial Equipments, Lamp Dimmer Circuits, Universal Motor

diac db3 specifications

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company SILICON DIAC BIDIRECTIONAL TRIGGER DIODE GLASS PASSIVATED PNPN DEVICE DIAC DB3-22 DO-35 Glass Axial Package Marking C DB3 -22 APPLICATIONS For Triggering TRIACs, SCRs, Industrial and Commercial Equipments, Lamp Dimmer Circuits, Universal Motor

DB3-22

Abstract: DIAC DB3 specifications diac db3 DIAC 220v 220v dimmer diac
Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company SILICON DIAC BIDIRECTIONAL TRIGGER DIODE GLASS PASSIVATED PNPN DEVICE DIAC DB3-22 DO-35 Glass Axial Package Marking C DB3 -22 APPLICATIONS For Triggering TRIACs, SCRs, Industrial and Commercial Equipments, Lamp Dimmer Circuits, Universal Motor

CPCI-204-1203

Abstract: CPCI-204-1203M ERNI CPCI DPCI-204-1203 DPCI-204-1203M DIN 41612 connector 48 pin condor B5 204m
Contextual Info: CompactPCI SYSTEM POWER SUPPLIES CPCI SERIES 200 Watts, Ac Input with PFC DPCI SERIES 200 Watts, 48 Vdc Input EXECUTIVE MEMBER FEATURES: • • • • • • • 200 W in 3U x 8HP, Fully compliant with PICMG CompactPCI® specifications Current sharing and internal OR-ing diodes for N+1 redundancy

MIL-STD-1580B

Abstract: Microsemi cross Three bond tungsten slug glass diode
Contextual Info: MicroNote #030 by: Metallurgical Bond Evaluation Methods for Diodes Metallurgical bond evaluations of diodes have been a subject of interest for many years. It has stimulated the use of additional evaluation tools and methods over the last decade that are still evolving. This MicroNOTE will provide some added