BP 109 Search Results

A771

Abstract: b774 equivalent A361 A362 A511 A641 A642 A643 B641 D551
Contextual Info: CD 135 BP Series 4 000h at 85°C longer life CD 136 PK • Standard at 85°C · High Ripple Current · Power Supplies & Inverters CD 139 BL 105°C 105°C longer life CD 135 BP CD 138 PC highest voltage Item CD 137 PX Characteristics Operating Temperature Range °C

Contextual Info: Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index 144 detail X 37 1 36 v M A ZD wM bp e D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline QFP144: plastic quad flat package; 144 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm SOT573-1 c y X A 108 73 72 ZE 109 e E HE A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index 144 37 36 1 ZD wM bp e v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

8 Position 16 Pin SPST dip switch

Abstract: DIP SWITCH 8 positions 4 Position 16 Pin SPST dip switch
Contextual Info: BP Series Side Actuated DIP Switches Features/Benefits • Side actuated contacts for right angle applications • When actuated, contacts remain Typical Applications • Address switch for industrial controls • Logic switching for computers and I Specifications

BP 109 transistor

Abstract: LQFP144
Contextual Info: JEITA Package Code P-LQFP144-20x20-0.50 RENESAS Code PLQP0144KC-A Previous Code FP-144H/FP-144HV MASS[Typ.] 1.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE Reference

LQFP216

Abstract: 216P6R-B BP 109 BP 109 transistor
Contextual Info: JEITA Package Code P-LQFP216-24x24-0.40 RENESAS Code PLQP0216LA-A Previous Code 216P6R-B MASS[Typ.] 1.7g HD *1 D 162 109 163 108 bp NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c c1 b1 Reference

BP 109 transistor

Abstract: LQFP144
Contextual Info: JEITA Package Code P-LQFP144-20x20-0.50 RENESAS Code PLQP0144KB-A Previous Code FP-144F/FP-144FV MASS[Typ.] 1.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE Reference

BP 109 transistor

Abstract: BP 109 QFP144 PQFP-144 PRQP0144KA-A
Contextual Info: JEITA Package Code P-QFP144-20x20-0.50 RENESAS Code PRQP0144KA-A Previous Code FP-144G/FP-144GV MASS[Typ.] 2.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE Reference

arinc 629

Abstract: ARINC629 ARINC 629 sim ARINC-629 MT24076 ARINC-629 Protocol "Micro Circuit Engineering" MT24061 PA10 PA11
Contextual Info: HT24Ô76 ARINC629 PROTOCOL Micro Qicuit Engineering a s u ts tìa r y d f Smiths IndustriesPutìcLimiadCompany Note: This Device Supercedes MT24061. FEATURES SUPPORTS BOTH SYSTEMS. BP AND CP DATA BUS CONTAINS DUAL PROTOCOL LOGIC CIRCUITS WITH CROSS-MONITORING.

BP 109 transistor

Abstract: BP 109 QFP144 PRQP0144KB-A
Contextual Info: JEITA Package Code P-QFP144-20x20-0.50 RENESAS Code PRQP0144KB-A Previous Code FP-144J/FP-144JV MASS[Typ.] 2.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 108 73 109 72 bp c c1 HE *2 E b1

Contextual Info: MIL-PRF-55681/Chips Part Number Example CDR01 thru CDR06 MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example example L W D t CDR01 BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance T Rated Voltage Capacitance Tolerance Termination Finish

0.01 micro farad capacitor

Contextual Info: MIL-PRF-55681/Chips Part Number Example CDR01 thru CDR06 MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example CDR01 L W D t BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance T Rated Voltage Capacitance Tolerance Termination Finish Failure Rate

BP 109 transistor

Abstract: capacitor 104 104 capacitor GHP4478SS capacitor 22uF 35V
Contextual Info: 1/1 Thermal Print Heads For Barcode and Label Printers GHP4478SS FEATURES • "Preference" Series 3.3V or 5.0V power supply circuit can be selected. • Normal type with no heat history control type [SS type] • New-BP protective layer with excellent abrasion resistance is

hand soldering of CDR32

Abstract: capacitor cross reference hand soldering of CDR33 CDR31 CDR32 CDR33 CDR35 capacitor 47 nano
Contextual Info: MIL-PRF-55681/Chips Part Number Example CDR31 thru CDR35 MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example example L W t D CDR31 BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance T Rated Voltage Capacitance Tolerance Termination Finish

Contextual Info: MIL-PRF-55681/Chips Part Number Example CDR31 thru CDR35 MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example example L W t D CDR31 BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance T Rated Voltage Capacitance Tolerance Termination Finish

Contextual Info: MIL-PRF-55681/Chips Part Number Example CDR31 thru CDR35 MILITARY DESIGNATION PER MIL-PRF-55681 Part Number Example example L W t D CDR31 BP 101 B K S M MIL Style Voltage-temperature Limits Capacitance T Rated Voltage Capacitance Tolerance Termination Finish

capacitor 104

Abstract: vending machine GHP5411SS CAPACITOR 2.2UF
Contextual Info: 1/1 Thermal Print Heads For Barcode and Label Printers GHP5411SS FEATURES • "Preference" Series 3.3V or 5.0V power supply circuit can be selected. • Normal type with no heat history control type [SS type] • New-BP protective layer with excellent abrasion resistance is

Contextual Info: Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-3 c y exposed die pad X A Dh 73 72 108 109 ZE e Eh E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36

Contextual Info: Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-4 c y exposed die pad X Dh A 108 73 109 72 ZE e Eh E HE A A2 A3 A1 θ w M Lp bp pin 1 index 144 detail X L 37 1 36

Contextual Info: Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-2 c y exposed die pad X Dh A 73 72 108 109 ZE e Eh E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36

c mac ocxo

Abstract: stp ocxo C-MAC OCXO STP C-MAC ocxo
Contextual Info: Reference 44 avenue de la Glacière - BP 165 95105 ARGENTEUIL CEDEX - FRANCE Tel. : 33 0 39 98 36 00 E_mail : FirstnameSurname@cmac.com Fax : 33 ( 0 ) 39 98 36 90 TECHNICAL OCXO SPECIFICATION STP 2270 Page 1/2 Date Visa 16 Oct.02 Claude Trialoup « Stratum 3E» OCXO

la 2206

Contextual Info: Reference 44 avenue de la Glacière - BP 165 95105 ARGENTEUIL CEDEX - FRANCE 33 0 1 39 98 36 00 Tel. : cfp@france.cfpwww.com E-mail : 33 (0) 1 39 98 36 60 Fax : TECHNICAL OCXO STP 2206 Page 1/2 Date Visa 07 Nov.01 Claude SPECIFICATION BASIC OSCILLATOR TYPE CFPO5 A 4

CAMERA MOD CCP2 SMIA 85

Abstract: IHI Rotary Encoder Samsung Nexus S JTAG pins sharp CMOS Camera Module CSI lm 741 using schmitt trigger Nexus S camera SCR FIR 3 D LCD MIPI PANEL sharp mmu ericsson Camera mod ccp2
Contextual Info: STn8815A12 Mobile multimedia application processor Features • Smart video accelerator – MPEG-4 Simple Profile L5 encoding/decoding up to SDTV 30 fps – DVB-H class C H264 BP L2 2Mbps CIF 30fps – DVB-H class B VC1 SP 384kbps QVGA 20fps – H.264 decode resolution up to VGA bit-rate

sil6400

Abstract: STS7500 s520 SSF4500 s7302
Contextual Info: Temic S e m i c « n il u c t o r s Genera] Information Alphanumeric Index T>pe . Type . BP 1 0 4 . . 6 .2 0 7 B P W 8 5 . . . . 320 T E M T 2 2 0 0 . . . 4 ,3 9 8 TSIP7601 . . . . B P V 1 0 . . 5 ,2 0 3