BL 0306 Search Results

T2X18

Contextual Info: t, 5 10 = CKT S IZ E 0.20 /.008 2X 157. G L A S S F I L L E D P O L Y E S T E R TO UL 9 4 v - 0 . COLOUR • BL A C K , P I N S ■( 0 . 6 5 0 ) / . 0255 SO. BRASS W I R E . P L A T E D AS P E R S H E E T S 2 TO 6. A" D IM ." B 1 ( .0.20 ") / V -0.35 j C K T

bl 0306

Abstract: PG22
Contextual Info: LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays – Tin/Lead Termination “B” SIZE PG12 0204 PG22 (0306) PGC2 (0805) Length mm (in.) Width mm (in.) Temp. Char. Working Voltage 0.50 (0.020) 1.00 (0.039) X7S (Z) 6.3 4 (6) (4) 0.76 (0.030)

bl 0306

Contextual Info: LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays – Tin/Lead Termination “B” SIZE LG12 0204 Length mm (in.) Width mm (in.) Temp. Char. Working Voltage 0.50 (0.020) 1.00 (0.039) X7S (Z) 6.3 4 (6) (4) Cap (µF) X5R (D) 6.3 4 (6) (4) LG22 (0306)

Contextual Info: LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays Land Grid Array LGA capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The innovative LGA technology sets a new standard for low inductance MLCC performance.

diode E1110

Abstract: lN4002 LN4003 ANA 618 20010 TDB 0123 km b3170 E1110 Diode UB8560D MAA723 moc 2030
Contextual Info: elektronik-bauelem ente I WT VD AVL 1 /8 7 Bl. 2 E r l ä u t e r u n g e n z u m I n h a l t und zu d e n A n g a b e n d e r B a u e l e m e n t e - V e r g l e i c h s l i s t e D ie B a u e l e m e n t e - V e r g l e i c h s l i s t e e n t h ä l t a l l e in d e r B i l a n z v e r a n t w o r t u n g d e s V E B K o m b i n a t

Contextual Info: IDC Low Inductance Capacitors RoHS 0306/0612/0508 IDC (InterDigitated Capacitors) GENERAL DESCRIPTION 0612 + + – L – – Style 3 + 0508 0306 TYPICAL IMPEDANCE Impedance (Ohms) 10 MLCC_1206 1 LICC_0612 0.1 IDC_0612 0.01 0.001 1 10 100 1000 Frequency (MHz)

0M0701-N

Abstract: LICC
Contextual Info: 0612/0508/0306 LICC Low Inductance Chip Capacitors GENERAL DESCRIPTION The total inductance of chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. Thus a 1210 chip size has a lower inductance than a 1206 chip.

TC59LM818DMBI

Abstract: VDDA14
Contextual Info: TC59LM818DMBI-37 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 I-version − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMBI is Network

Contextual Info: TC59LM818DMBI-37 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 I-version − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMBI is Network

Contextual Info: TC59LM818DMGI-37 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC Lead-Free 288Mbits Network FCRAM2 I-version − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMGI is Network

TC59LM818DMB-33

Abstract: TC59LM818DMB
Contextual Info: TC59LM818DMB-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMB is Network

TC59LM818DMG-33

Contextual Info: TC59LM818DMG-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC Lead-Free 288Mbits Network FCRAM2 − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMG is Network

Contextual Info: TC59LM818DMBI-37 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TM 4,194,304-WORDS x 4 BANKS × 18-BITS Network FCRAM DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMBI is Network FCRAMTM containing 301,989,888 memory cells. TC59LM818DMBI is organized as 4,194,304-words × 4 banks × 18

SSTL-18

Abstract: TC59LM818DMB TC59LM818DMB-30
Contextual Info: TC59LM818DMB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TM 4,194,304-WORDS x 4 BANKS × 18-BITS Network FCRAM DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMB is Network FCRAMTM containing 301,989,888 memory cells. TC59LM818DMB is organized as 4,194,304-words × 4 banks × 18

Contextual Info: TC59LM818DMBI-37 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TM 4,194,304-WORDS x 4 BANKS × 18-BITS Network FCRAM DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMBI is Network FCRAMTM containing 301,989,888 memory cells. TC59LM818DMBI is organized as 4,194,304-words × 4 banks × 18

Contextual Info: TC59LM818DMB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMB is Network

Contextual Info: TC59LM818DMG-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC Lead-Free 288Mbits Network FCRAM2 − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMG is Network

Contextual Info: TC59LM818DMB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMB is Network

TC59LM818DMB

Abstract: TC59LM818DMB-30
Contextual Info: TC59LM818DMB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 4,194,304-WORDS x 4 BANKS × 18-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM818DMB is Network

TC59LM836DKB

Abstract: TC59LM836DKB-33
Contextual Info: TC59LM836DKB-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 2,097,152-WORDS x 4 BANKS × 36-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM836DKB is Network

TC59LM836DKB

Abstract: TC59LM836DKB-30
Contextual Info: TC59LM836DKB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 2,097,152-WORDS x 4 BANKS × 36-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM836DKB is Network

Contextual Info: TC59LM836DKB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 2,097,152-WORDS x 4 BANKS × 36-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM836DKB is Network

unidirectional current controller circuit

Abstract: SSTL-18 TC59LM836DMB-30
Contextual Info: TC59LM836DMB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TM 2,097,152-WORDS x 4 BANKS × 36-BITS Network FCRAM DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM836DMB is Network FCRAMTM containing 301,989,888 memory cells. TC59LM836DMB is organized as 2,097,152-words × 4 banks × 36

Contextual Info: TC59LM836DMB-30,-33,-40 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2 − 2,097,152-WORDS x 4 BANKS × 36-BITS DESCRIPTION Network FCRAMTM is Double Data Rate Fast Cycle Random Access Memory. TC59LM836DMB is Network