BGA TRAYS Search Results

vFBGA* 96 bALL

Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are

BGA Solder Ball compressive force

Abstract: bga solder ball shear
Contextual Info: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

196-pin

Abstract: DSP56300 EB360
Contextual Info: Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196pin Plastic Ball Grid Array (PBGA) packages. The MAP - BGA

DSP56300

Abstract: EB362
Contextual Info: Freescale Semiconductor Engineering Bulletin EB362 Rev. 1, 10/2005 Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages This document describes the differences between the 252-pin MAP-BGA Mold Array Process-Ball Grid Array and the 252pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The

Socket T for LGA

Contextual Info: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the

0.65mm pitch BGA

Abstract: ASTM-B-488 C17200
Contextual Info: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance

entek Cu-56

Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

0.65mm pitch BGA

Contextual Info: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the

Socket T for LGA

Abstract: 0.65mm pitch BGA socket
Contextual Info: BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Features: • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold

TLC056

Abstract: TSC056 TSC080 spansion tray 2606 tray datasheet bga TLC080 Spansion tray drawing
Contextual Info: SPANSION LLC 915 DeGuigne Drive, P.O. Box 3453 Sunnyvale, California 94088-3453, USA April 28, 2006 Advanced Change Notification No: Subject: 2606 Changes to 9x7 mm Ball Grid Array BGA Packages packed in Tray Spansion LLC is announcing changes to the 9x7 mm Ball Grid Array (BGA) packages packed in tray.

TG-175

Abstract: FREESCALE PACKING DSP56300
Contextual Info: Freescale Semiconductor, Inc. Order No.: EB360/D Rev. 0, 6/2000 MOTOROLA Semiconductor Products Sector Engineering Bulletin This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196-pin Plastic Ball Grid Array (PBGA) packages. The MAP BGA is an identical pinout and drops into a board laid out for

punch singulation for PBGA

Abstract: DSP56300
Contextual Info: Order No.: EB362/D Rev. 0, 8/2000 MOTOROLA Semiconductor Products Sector Engineering Bulletin Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages Summary of Differences . 2 Pinout and Electrical Performance . 2

DSP56300

Contextual Info: Order No.: EB360/D Rev. 0, 6/2000 MOTOROLA Semiconductor Products Sector Engineering Bulletin Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages Summary of Differences . 2 Pinout and Electrical Performance . 2

BGA PROFILING

Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

BGA PACKAGE TOP MARK intel

Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
Contextual Info: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

xcm916

Abstract: motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56F807VF80

pbga package weight

Abstract: mindspeed pbga Cold solder joint
Contextual Info: 500154B December 18, 2001 Plastic BGA Surface Mount Application Note Introduction One of the greatest advantages of the Plastic Ball Grid Array PBGA package is that it is typically placed onto printed circuit boards and assembled using existing surface mount

IPC-9701

Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Contextual Info: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the

BGA and QFP Altera Package mounting profile

Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Contextual Info: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine

Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a

INTEL 28F640

Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
Contextual Info: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any