BGA SOLDER BALL 0.6MM Search Results

entek Cu-56

Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
Contextual Info: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array

BGA PROFILING

Abstract: pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte
Contextual Info: Surface Laminar Circuit SLC Ball Grid Array (BGA) Lead-free Surface Mount Assembly Application Note 5363 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-HT surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array

BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Contextual Info: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to

sn63pb37 solder wire

Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
Contextual Info: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen

SF-BGA128C-B-62

Contextual Info: 10mm [0.394"] Top View 0.6mm [0.024"] Ordering Information: 0.6mm [0.024"] Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 0.8mm typ. Detail A 8.8mm square [0.346"] Side View 0.89mm [0.035"] 2.48mm [0.098"]

SF-BGA144J-B-62

Contextual Info: Top View 10mm [0.394"] 0.6mm [0.024"] Ordering Information: 0.6mm [0.024"] Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 0.8mm typ. Detail A 8.8mm square [0.346"] Side View 0.89mm [0.035"] 2.48mm [0.098"]

bga 484 0.8mm pitch

Abstract: SF-BGA484E-B-62
Contextual Info: 18mm [0.709"] Top View Ordering Information: Solder Ball Alloy 0.6mm [0.024"] Part Number Suffix Sn63Pb37 0.6mm [0.024"] -62 Sn96.5Ag3.0Cu0.5 *RoHS Compliant -62F* 18mm [0.709"] 0.8mm typ. Detail A 0.89mm [0.035"] 2.83mm [0.112"] 16.8mm square [0.661"] Side View

SF-BGA136C-B-62

Contextual Info: 14mm [0.551"] Top View 0.6mm [0.024"] 0.8mm typ. 0.6mm [0.024"] 10mm [0.394"] 8.8mm [0.346"] Ordering Information: Solder Ball Alloy 12.8mm [0.504"] Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 -62F* Side View 2 Detail A *RoHS Compliant 2.83mm [0.112"]

SF-BGA240N-B-62F

Contextual Info: 18mm [0.709"] Top View RoHS COMPLIANT 0.6mm [0.024"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm [0.661"] 0.89mm [0.035"] Detail A Side View 16.8mm [0.661"] 0.89mm [0.035"] 0.89mm [0.035"] Detail A 2.83mm [0.112"] 2 2.48mm [0.098"] 1 3 0.36mm± 0.05mm [0.014"± 0.002"]

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

7086

Abstract: BGA Solder Ball 0.6mm 0.35mm BGA SG-BGA-7086 BGA Solder Ball 0.35mm
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View Compression plate distributes forces evenly Easily removable swivel socket lid

BGA Solder Ball 0.6mm

Abstract: SF-BGA240N-B-61F
Contextual Info: 0.6mm [0.024"] 18mm [0.709"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm square [0.661"] Top View 0.2mm dia. [0.008"] 2 1 3.87mm ± 0.254mm [0.152"±0.010"] 0.8mm typ. 3 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non

SF-BGA304A-B-05

Contextual Info: Top View 38.73mm [1.525"] 2.5mm [0.098"] 27.94mm [1.100"] 3.27mm [0.129"] 2.5mm [0.098"] 2.54mm [0.100"] 2.89mm [0.114"] 33.72mm [1.328"] 38.73mm [1.525"] 27.94mm [1.100"] 1.27mm typ. [0.050"] 5.08mm [0.200"] 0-80 Threaded Insert Ø 0.6mm typ. [Ø 0.024"]

EA-190-H125-T710

Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
Contextual Info: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow

fcBGA PACKAGE thermal resistance

Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
Contextual Info: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5

taiyo PSR4000

Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

fBGA package tray 12 x 19

Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

NET2272REV1A-LF

Abstract: ph12 diode usb to rj45 extenders ADSP-BF537BBCZ 27.4x27.4 tmc* usb R11u 749010010 PH12 footprint PF48F2000P0ZBQ0S
Contextual Info: Hardware User Manual TCM-BF537 V1.1 Including BGA and Border Pad Versions PRELIMINARY www.tinyboards.com Maximum Power at Minimum Size Bluetechnix www.tinyboards.com Maximum Power at Minimum Size Contact Bluetechnix Mechatronische Systeme GmbH Waidhausenstr. 3/19

Contextual Info: 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •

MS-026

Abstract: MT55L256L32F MT55L256L36F MT55L256V32F MT55L256V36F MT55L512L18F MT55L512V18F micron 100 ball BGA
Contextual Info: 8Mb: 512K x 18, 256K x 32/36 FLOW-THROUGH ZBT SRAM MT55L512L18F, MT55L512V18F, MT55L256L32F, MT55L256V32F, MT55L256L36F, MT55L256V36F 8Mb ZBT SRAM 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • •

MS-026

Abstract: MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256L18P1 MT55L256V18P1
Contextual Info: 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •

Contextual Info: PRELIMINARY 4Mb: 256K x 18, 128K x 32/36 3.3V I/O PIPELINED, DCD SYNCBURST SRAM 4Mb SYNCBURST SRAM MT58L256L18D1, MT58L128L32D1, MT58L128L36D1 3.3V VDD, 3.3V I/O, Pipelined, DoubleCycle Deselect FEATURES 100-Pin TQFP1 • Fast clock and OE# access times

MS-026

Abstract: MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512L18P MT55L512V18P
Contextual Info: 8Mb: 512K x 18, 256K x 32/36 PIPELINED ZBT SRAM 8Mb ZBT SRAM MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • • •

Contextual Info: 4Mb: 256K x 18, 128K x 32/36 FLOW-THROUGH ZBT SRAM 4Mb ZBT SRAM MT55L256L18F1, MT55L128L32F1, MT55L128L36F1; MT55L256V18F1, MT55L128V32F1, MT55L128V36F1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •