BGA PACKAGE WEIGHT Search Results

PCN0214

Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
Contextual Info: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:

GE863-GPS

Contextual Info: wireless solutions wireless solutions GE 863-GPS Embedded SiRF Powered The new GE863-GPS is the smallest combined GPRS/GPS module on the market! BGA Package The unique Ball-Grid-Array BGA package enables a very low profile and small product size to design extremely compact applications using location technology.

BGA-320P-M06

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs

Contextual Info: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).

MCP 256M nand toshiba

Abstract: TY80009000AMGF toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9
Contextual Info: TY80009000AMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY80009000AMGF is a mixed multi-chip package containing a 268,435,456-bit Low Power Synchronous DRAM and a 553,648,128-bit Nand E2PROM. The TY80009000AMGF is available in a 149-pin BGA package

TPA2000D1PW

Abstract: TPA2000D1PWR 2512067007Y3 GRM235-Y5V106Z16 SCD0703T TPA2000D1 TPA2000D1GQCR
Contextual Info: TPA2000D1 2-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS328E – JUNE 2000 – REVISED MAY 2003 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options

SLLA229

Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

Contextual Info: TPA2000D1 2-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS328D – JUNE 2000 – REVISED NOVEMBER 2002 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options

TPA2001D1

Abstract: TPA2001D1PW TPA2001D1PWR GRM235-Y5V106Z16 TPA005Dxx
Contextual Info: TPA2001D1 1-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS338B – SEPTEMBER 2000 – REVISED AUGUST 2002 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options

144-TERMINAL

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

Contextual Info: 2 x 2.5 mm MOSFET BGA Package Dimensions 2 x 2.5 mm FS PKG Code Z1 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: millimeters Part Weight per unit (gram): 0.019 ã 1998 Fairchild Semiconductor Corporation 2002 Fairchild Semiconductor Corporation

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

Contextual Info: Preliminary GS82582QT06/11/20/38E-500/450/400/375 288Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

Contextual Info: Preliminary GS8342TT06/11/20/38BD-550/500/450/400/350 36Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 Clock Latency • Simultaneous Read and Write SigmaDDRTM Interface • JEDEC-standard pinout and package

st LD33

Abstract: ld33 st LD33 LD33 data sheet LD33 V ld33 linear st st ld50 Architecture of TMS320C4X FLOATING POINT PROCESSED CLC146 ld33 ST ELECTRONIC
Contextual Info: NM6403 Digital Signal Processor 431282.001D3 Features General Description 40 MIPS, 25 ns Instruction Rate. CMOS 0,5µm Technology. 256-pin BGA Package. Low Voltage Supply, 3.0V to 3.6V. Memory Address Space - 16 Gbytes. Scalar and Vector Data Format: 32-bit Scalar Data,

Toshiba emmc

Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
Contextual Info: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.

Contextual Info: Preliminary GS8342T06/11/20/38BD-550/500/450/400/350 36Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 Clock Latency • Simultaneous Read and Write SigmaDDRTM Interface • JEDEC-standard pinout and package

Contextual Info: Preliminary GS8342T06/11/20/38BD-550/500/450/400/350 36Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.5 Clock Latency • Simultaneous Read and Write SigmaDDRTM Interface • JEDEC-standard pinout and package

Contextual Info: Preliminary GS8342QT07/10/19/37BD-357/333/300/250/200 36Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

Contextual Info: GS8182T19/37BD-435M 165-Bump BGA Military Temp 18Mb SigmaDDR-II+TM Burst of 2 SRAM Features • Military Temperature Range • 2.0 Clock Latency • Simultaneous Read and Write SigmaDDR-II+ Interface • Common I/O bus • JEDEC-standard pinout and package

LVDS83C

Abstract: lvds83
Contextual Info: SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com FLATLINK TRANSMITTER Check for Samples: SN75LVDS83C FEATURES 1 • 2 • • • • • • LVDS Display Serdes Interfaces Directly to LCD Display Panels with Integrated LVDS Package: 4.5mm x 7mm BGA

LVDS83C

Contextual Info: SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com FLATLINK TRANSMITTER Check for Samples: SN75LVDS83C FEATURES 1 • 2 • • • • • • LVDS Display Serdes Interfaces Directly to LCD Display Panels with Integrated LVDS Package: 4.5mm x 7mm BGA

l 7251 3.1

Abstract: ft03e
Contextual Info: int ! MOBILE PENTIUM Il PROCESSOR IN BGA PACKAGE AT 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ Available at 266PE MHz, 300PE MHz, 333 MHz and 366 MHz Fully compatible with previous Intel microprocessors Supports the Intel Architecture with Dynamic Execution