BGA L Search Results

led matrix circuits

Abstract: BGA-420P
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)

led matrix circuits

Abstract: BGA-420P
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)

256-pin BGA

Abstract: 24 pin MATRIX led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)

BGA-35

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ

BGA-35

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M05 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M05 352-pin plastic BGA (BGA-352P-M05) 35.00±0.10(1.378±.004)SQ

BGA-672P-M01

Abstract: 672pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 672 PIN PLASTIC To Top / Package Lineup / Package Index BGA-672P-M01 672-pin plastic BGA Lead pitch 50 mil Pin matrix 34 Sealing method Resin seal BGA-672P-M01 672-pin plastic BGA (BGA-672P-M01) 45.00±0.10(1.772±.004)SQ

BGA-420P

Contextual Info: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ

bobbins

Abstract: 770-424-4888 SW80B SODER-WICK
Contextual Info: m SODER-WICK FINE BRAID Soder-Wick BGA Desoldering Braid The most effective, economical way to safely and completely remove solder from BGA pads and chips. ► Why Soder-Wick BGA Desoldering Braid? Key Product Characteristics: • Optimized rosin flux content

ADV9912

Abstract: MO-151 Assembly Locations
Contextual Info: CUSTOMER ADVISORY FineLine BGA Packages Altera is adding ASAT and ASE as additional sources of supply for the FineLine BGA packages currently assembled by ANAM in the Philippines and Korea. This change will affect the FineLine BGA package outline thickness*, which will result in a

T410R

Abstract: 375424b00034g
Contextual Info: 375424B00034G - heatsinks for BGA Devices Page 1 of 2 Tel toll-free : +1-855-32-AAVID Register Log in Search Home Products Solutions Aavid Design Tools & Docs Contact Company Online Store » BGA Heat Sinks 375424B00034G Need assistance? Call us: 1-855-32-AAVID

FF1152

Abstract: UG002 BG728 BF957 FG676 led flip-chip CS144 FG256 BGA Package
Contextual Info: R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: 426 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 427 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 428

Contextual Info: Ball Grid Array BGA Socketing Systems ADVANCED INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West W arwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://w ww .advintcorp.com BGA Socketing Systems

Contextual Info: SIEMENS BGA 312 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 Q-gain block • 11 dB typical gain at 1.0 GHz • 9 dBm typical P.\ ¿b at 1 0 Gl• 3 dB-bandwidth: DC to 2.0 Gl RFINoCircuit Diagram EHA07312 Type Marking Ordering Code BGA 312 BMs

bga socket

Contextual Info: Pop-Top BGA Socket Adapter Assembly ADVANCED INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West W arwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://w ww .advintcorp.com Pop-Top® BGA Socket Adapter Assembly

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

Contextual Info: White Electronic Designs EDI8L21665V 2x64Kx16 SRAM FEATURES DSP Memory Solution The EDI8L21665VxxBC is a 3.3V, 2x64Kx16 SRAM constructed with two 64Kx16 die mounted on a multi-layer laminate substrate. The device is packaged in a 74 lead, 15mm by 15mm, BGA.

Lead Free reflow soldering profile BGA

Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
Contextual Info: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array

BGA-320P-M06

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic BGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max

PowerTrench BGA

Abstract: B100 FODB100 FODB101 FODB102
Contextual Info: FODB100, FODB101, FODB102 Single Channel Microcoupler tm Features Description • Low profile package The FODB100, FODB101 and FODB102 single channel MICROCOUPLERS™ are all Pb-free, low profile miniature surface mount optocouplers in a Ball Grid Array BGA package. Each consists of an aluminum

tba 480

Abstract: e2cmos technology 492-Ball
Contextual Info: Introduction to ispLSI 8000 and 8000V Families ❑ Deterministic Performance ❑ Up to 1440 Total Registers – the Industry’s Largest CPLD! ❑ High Density 32,000 - 60,000 PLD Gates ❑ 3.3V I/O and 2.5V Outputs ❑ State-of-the-Art BGA Packaging

Contextual Info: VFB1515N Vishay Foil Resistors Ultra High Precision Z-Foil BGA Surface Mount Resistor 3R Network, Temperature Coefficient Tracking 0.1 ppm/°C and Load Life Ratio Stability to ± 0.01 % 100 ppm FEATURES INTRODUCTION Bulk Metal Z-Foil technology out-performs all other resistor

Contextual Info: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by

LVDS83C

Abstract: lvds83
Contextual Info: SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com FLATLINK TRANSMITTER Check for Samples: SN75LVDS83C FEATURES 1 • 2 • • • • • • LVDS Display Serdes Interfaces Directly to LCD Display Panels with Integrated LVDS Package: 4.5mm x 7mm BGA

LVDS83C

Contextual Info: SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com FLATLINK TRANSMITTER Check for Samples: SN75LVDS83C FEATURES 1 • 2 • • • • • • LVDS Display Serdes Interfaces Directly to LCD Display Panels with Integrated LVDS Package: 4.5mm x 7mm BGA