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    BGA L Search Results

    BGA L Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF
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    BGA L Price and Stock

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    Texas Instruments AWR2943ABGALTQ1

    SENSOR RADAR CAN/GPIO/I2C OUT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR2943ABGALTQ1 Tray 168 1
    • 1 $57.14
    • 10 $47.09
    • 100 $44.58
    • 1000 $41.04
    • 10000 $41.04
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    Mouser Electronics AWR2943ABGALTQ1 671
    • 1 $57.14
    • 10 $47.09
    • 100 $44.18
    • 1000 $40.91
    • 10000 $40.91
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    Texas Instruments AWR1843ARBGALPQ1

    IC RADAR SENSOR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR1843ARBGALPQ1 Tray 126 1
    • 1 $57.12
    • 10 $47.07
    • 100 $44.57
    • 1000 $41.45
    • 10000 $41.45
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    Texas Instruments AWR2944LBGALTRQ1

    AUTOMOTIVE 76-GHZ TO 81-GHZ SING
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR2944LBGALTRQ1 Reel 1,000
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    • 1000 $28.64
    • 10000 $28.64
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    KEMET Corporation C1206C432JBGALTU

    CAP CER 1206
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey C1206C432JBGALTU Reel 2,500
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    • 10000 $0.23
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    Avnet Americas C1206C432JBGALTU Reel 2,500
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    • 10000 $0.22
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    Newark C1206C432JBGALTU Reel 2,500
    • 1 $0.25
    • 10 $0.25
    • 100 $0.25
    • 1000 $0.25
    • 10000 $0.23
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    Texas Instruments AWR6843ARBGALPQ1

    SENSOR RADAR CAN/GPIO/I2C OUT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AWR6843ARBGALPQ1 Tray 126
    • 1 -
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    • 1000 $39.88
    • 10000 $39.88
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    Bristol Electronics AWR6843ARBGALPQ1 105 1
    • 1 $36.38
    • 10 $36.38
    • 100 $29.83
    • 1000 $29.83
    • 10000 $29.83
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    BGA L Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    reflow temperature rohs bga

    Abstract: 0.65mm pitch BGA
    Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


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    BGA 731

    Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
    Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


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    0.65mm pitch BGA

    Abstract: ASTM-B-488 157 BGA socket
    Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


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    Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


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    led matrix circuits

    Abstract: 256-pin Plastic BGA BGA-256P-M02
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)


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    BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02 PDF

    led matrix circuits

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01)


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    BGA-480P-M01 480-pin BGA-480P-M01) BGA480001SC-2-1 led matrix circuits PDF

    led matrix circuits

    Abstract: fujitsu FUJITSU SEMICONDUCTOR
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M02 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M02 480-pin plastic BGA (BGA-480P-M02)


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    BGA-480P-M02 480-pin BGA-480P-M02) BGA480002SC-2-1 led matrix circuits fujitsu FUJITSU SEMICONDUCTOR PDF

    led matrix circuits

    Abstract: BGA-420P
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)


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    BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P PDF

    led matrix circuits

    Abstract: BGA-420P
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)


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    BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P PDF

    256-pin BGA

    Abstract: 24 pin MATRIX led matrix circuits 256-pin
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)


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    BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits PDF

    256-pin BGA

    Abstract: led matrix circuits 256-pin
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)


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    BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits PDF

    bga PCB footprint

    Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


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    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


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    BGA-416P

    Abstract: BGA-416P-M02 T0-50 416-PIN
    Contextual Info: BALL GRID ARRAY PACKAGE 416 PIN PLASTIC BGA-416P-M02 Lead pitch 50mil Pin matrix 30 Sealing method Resin seal 416-pin plastic BGA BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.20(1.575±.008)SQ 36.83±0.20(1.450±.008) INDEX C1.0 (.039) 1.27±0.20


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    BGA-416P-M02 50mil 416-pin BGA-416P-M02) BGA416002SC-1-1 BGA-416P BGA-416P-M02 T0-50 PDF

    BGA-352

    Abstract: 352-PIN
    Contextual Info: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M02 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008)


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    BGA-352P-M02 50mil 352-pin BGA-352P-M02) BGA352003SC-1-1 BGA-352 PDF

    T0-50

    Contextual Info: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M01 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.20(1.378±.008)SQ 31.75±0.20(1.250±.008) INDEX C1.0 (.039) 1.27±0.20


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    BGA-352P-M01 50mil 352-pin BGA-352P-M01) BGA352002SC-1-1 T0-50 PDF

    S 576 B

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC To Top / Package Lineup / Package Index BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ


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    BGA-576P-M01 576-pin BGA-576P-M01) BGA576001SC-2-1 S 576 B PDF

    416-PIN

    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC To Top / Package Lineup / Package Index BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ


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    BGA-416P-M02 416-pin BGA-416P-M02) BGA416002SC-2-2 PDF

    272-Pin

    Contextual Info: BALL GRID ARRAY PACKAGE 272 PIN PLASTIC BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01) 29.00±0.20(1.142±.008)SQ 28.50±0.20(1.122±.008)SQ 1.67(.066) 28.50(1.122)


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    BGA-272P-M01 50mil 272-pin BGA-272P-M01) BGA272001SC-1-2 PDF

    led matrix circuits

    Abstract: 352-PIN matrix led
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ


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    BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1 led matrix circuits matrix led PDF

    Heatsinks

    Contextual Info: Kühlkörper für BGA’s Dissipateurs pour BGA – convient particulièrement pour les Ball Grid Arrays – dimensions du dissipateur correspondent au type de BGA respectif – à coller directement sur le composant BGA RW 35 [K/W] 30 10 10 25 1,8 ICK BGA 10 x 10


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    352-pin

    Abstract: led matrix circuits
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M04 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ


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    BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1 led matrix circuits PDF

    led matrix circuits

    Abstract: BGA-352P-M03
    Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M03 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ


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    BGA-352P-M03 352-pin BGA-352P-M03) BGA352004SC-1-1 led matrix circuits BGA-352P-M03 PDF

    BGA-352P-M03

    Abstract: 352-PIN
    Contextual Info: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M03 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M03 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008)


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    BGA-352P-M03 50mil 352-pin BGA-352P-M03) BGA352004SC-1-1 BGA-352P-M03 PDF