BGA L Search Results

led matrix circuits

Abstract: 256-pin Plastic BGA BGA-256P-M02
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)

led matrix circuits

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01)

led matrix circuits

Abstract: fujitsu FUJITSU SEMICONDUCTOR
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M02 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M02 480-pin plastic BGA (BGA-480P-M02)

led matrix circuits

Abstract: BGA-420P
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)

led matrix circuits

Abstract: BGA-420P
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)

256-pin BGA

Abstract: 24 pin MATRIX led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)

256-pin BGA

Abstract: led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)

led matrix circuits

Abstract: BGA-272P-M01
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)

S 576 B

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC To Top / Package Lineup / Package Index BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ

416-PIN

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC To Top / Package Lineup / Package Index BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ

led matrix circuits

Abstract: 352-PIN matrix led
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ

352-pin

Abstract: led matrix circuits
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M04 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ

led matrix circuits

Abstract: BGA-352P-M03
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M03 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ

BGA-35

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ

BGA-672P-M01

Abstract: 672pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 672 PIN PLASTIC To Top / Package Lineup / Package Index BGA-672P-M01 672-pin plastic BGA Lead pitch 50 mil Pin matrix 34 Sealing method Resin seal BGA-672P-M01 672-pin plastic BGA (BGA-672P-M01) 45.00±0.10(1.772±.004)SQ

BGA-420P

Contextual Info: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ

led matrix circuits

Abstract: bga48 48-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.

reflow soldering profile BGA

Abstract: reflow temperature bga BGA PROFILING bga rework
Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already

PCN0214

Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
Contextual Info: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:

SY68730ZC

Abstract: MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX
Contextual Info: Autoclave Pressure Pot Test + 121C / 15 PSIG (With Pre-con 3X Reflow ) MSL Pkg Lds Device D/C Process Qty Hours Rej Assembler L3 L3 L3 L3 BGA BGA BGA BGA 289 289 289 289 KS8695PX KS8695PX KS8695PX KSZ8695PX 0407 0421A 0417A 0452A TSMC .18 TSMC .18 TSMC .18

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

reflow soldering profile BGA

Abstract: BGA PROFILING solder joint bga warpage bga rework
Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed

W2639A

Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

Contextual Info: FDZ5047N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ5047N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging