BGA L Search Results
BGA L Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy | 
|---|---|---|---|---|---|
| 84512-202LF |   | 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free | |||
| 74221-201LF |   | 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free | |||
| 84500-002 |   | 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array | |||
| 84500-102 |   | 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array | |||
| 84517-001 |   | 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array | 
BGA L Price and Stock
| Texas Instruments AWR2943ABGALTQ1SENSOR RADAR CAN/GPIO/I2C OUT | |||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|   | AWR2943ABGALTQ1 | Tray | 168 | 1 | 
 | Buy Now | |||||
|   | AWR2943ABGALTQ1 | 671 | 
 | Buy Now | |||||||
| Texas Instruments AWR1843ARBGALPQ1IC RADAR SENSOR | |||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|   | AWR1843ARBGALPQ1 | Tray | 126 | 1 | 
 | Buy Now | |||||
| Texas Instruments AWR2944LBGALTRQ1AUTOMOTIVE 76-GHZ TO 81-GHZ SING | |||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|   | AWR2944LBGALTRQ1 | Reel | 1,000 | 
 | Buy Now | ||||||
| KEMET Corporation C1206C432JBGALTUCAP CER 1206 | |||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|   | C1206C432JBGALTU | Reel | 2,500 | 
 | Buy Now | ||||||
|   | C1206C432JBGALTU | Reel | 2,500 | 
 | Buy Now | ||||||
|   | C1206C432JBGALTU | Reel | 2,500 | 
 | Buy Now | ||||||
| Texas Instruments AWR6843ARBGALPQ1SENSOR RADAR CAN/GPIO/I2C OUT | |||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|   | AWR6843ARBGALPQ1 | Tray | 126 | 
 | Buy Now | ||||||
|   | AWR6843ARBGALPQ1 | 105 | 1 | 
 | Buy Now | ||||||
BGA L Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
| reflow temperature rohs bga
Abstract: 0.65mm pitch BGA 
 | Original | ||
| BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200 
 | Original | ||
| 0.65mm pitch BGA
Abstract: ASTM-B-488 157 BGA socket 
 | Original | ||
| Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) | Original | ||
| led matrix circuits
Abstract: 256-pin Plastic BGA BGA-256P-M02 
 | Original | BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02 | |
| led matrix circuitsContextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01) | Original | BGA-480P-M01 480-pin BGA-480P-M01) BGA480001SC-2-1 led matrix circuits | |
| led matrix circuits
Abstract: fujitsu FUJITSU SEMICONDUCTOR 
 | Original | BGA-480P-M02 480-pin BGA-480P-M02) BGA480002SC-2-1 led matrix circuits fujitsu FUJITSU SEMICONDUCTOR | |
| led matrix circuits
Abstract: BGA-420P 
 | Original | BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P | |
| led matrix circuits
Abstract: BGA-420P 
 | Original | BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P | |
| 256-pin BGA
Abstract: 24 pin MATRIX led matrix circuits 256-pin 
 | Original | BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits | |
| 256-pin BGA
Abstract: led matrix circuits 256-pin 
 | Original | BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits | |
| bga PCB footprintContextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board | Original | ||
| BGA 731
Abstract: bga thermal cycling reliability material for ball grid array packaging 
 | Original | ||
| BGA-416P
Abstract: BGA-416P-M02 T0-50 416-PIN 
 | Original | BGA-416P-M02 50mil 416-pin BGA-416P-M02) BGA416002SC-1-1 BGA-416P BGA-416P-M02 T0-50 | |
|  | |||
| BGA-352
Abstract: 352-PIN 
 | Original | BGA-352P-M02 50mil 352-pin BGA-352P-M02) BGA352003SC-1-1 BGA-352 | |
| T0-50Contextual Info: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M01 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.20(1.378±.008)SQ 31.75±0.20(1.250±.008) INDEX C1.0 (.039) 1.27±0.20 | Original | BGA-352P-M01 50mil 352-pin BGA-352P-M01) BGA352002SC-1-1 T0-50 | |
| S 576 BContextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC To Top / Package Lineup / Package Index BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ | Original | BGA-576P-M01 576-pin BGA-576P-M01) BGA576001SC-2-1 S 576 B | |
| 416-PINContextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC To Top / Package Lineup / Package Index BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ | Original | BGA-416P-M02 416-pin BGA-416P-M02) BGA416002SC-2-2 | |
| 272-PinContextual Info: BALL GRID ARRAY PACKAGE 272 PIN PLASTIC BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01) 29.00±0.20(1.142±.008)SQ 28.50±0.20(1.122±.008)SQ 1.67(.066) 28.50(1.122) | Original | BGA-272P-M01 50mil 272-pin BGA-272P-M01) BGA272001SC-1-2 | |
| led matrix circuits
Abstract: 352-PIN matrix led 
 | Original | BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1 led matrix circuits matrix led | |
| HeatsinksContextual Info: Kühlkörper für BGA’s Dissipateurs pour BGA – convient particulièrement pour les Ball Grid Arrays – dimensions du dissipateur correspondent au type de BGA respectif – à coller directement sur le composant BGA RW 35 [K/W] 30 10 10 25 1,8 ICK BGA 10 x 10 | Original | ||
| 352-pin
Abstract: led matrix circuits 
 | Original | BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1 led matrix circuits | |
| led matrix circuits
Abstract: BGA-352P-M03 
 | Original | BGA-352P-M03 352-pin BGA-352P-M03) BGA352004SC-1-1 led matrix circuits BGA-352P-M03 | |
| BGA-352P-M03
Abstract: 352-PIN 
 | Original | BGA-352P-M03 50mil 352-pin BGA-352P-M03) BGA352004SC-1-1 BGA-352P-M03 | |