BGA 81 Search Results

reflow temperature rohs bga

Abstract: 0.65mm pitch BGA
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

BGA 731

Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

0.65mm pitch BGA

Abstract: ASTM-B-488 157 BGA socket
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

bga PCB footprint

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

BGA 731

Abstract: bga thermal cycling reliability material for ball grid array packaging
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board

BGA reflow guide

Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
Contextual Info: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to

gk 7031

Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

W2639A

Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

bobbins

Abstract: 770-424-4888 SW80B SODER-WICK
Contextual Info: m SODER-WICK FINE BRAID Soder-Wick BGA Desoldering Braid The most effective, economical way to safely and completely remove solder from BGA pads and chips. ► Why Soder-Wick BGA Desoldering Braid? Key Product Characteristics: • Optimized rosin flux content

40 pin ide to 44 pin ide adapter cable

Abstract: ide cable pin 40 pin ide cable intel ssd LPT 25 pin ide cable lpt port 44 pin ide to 40 pin ide Intel BGA cpu intel
Contextual Info: Ethernet µFC-BGA SBC83685 Board ID CompactFlash 2 USB CRT PCI Intel µFC-BGA Embedded SBC with 4 Ethernet Microsoft ® Windowsxp WindowsCE FDD Conn. Features IDE 2 Port Fanless IDE 1 Port Intel µFC-BGA ULP/LP CPU ® PCI Expansion DIMM CompactFlash™

BGA-3000

Abstract: BGA-3500 Metcal CSP 3502 Metcal BGA-3591 CSP-3500 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop
Contextual Info: BGA & CSP Rework System BGA-3590 Series CSP-3500 Series USER GUIDE Precision Systems for the Electronics Bench www.metcal.com P/N 7000-1251, Ver. A , 9/01 ii BGA-3500 Series Manual 5/01 TABLE OF CONTENTS PREFACE Specifications 2 System Part Numbers 3 Environmental Conditions

Contextual Info: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers

337 BGA

Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –

N5426A

Abstract: N5451A PC Oscilloscope Probe W3630A W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630
Contextual Info: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers and

pci riser

Abstract: SBC83683VEA-650 EM60320 SBC83683VEA-400 bga intel intel microsoft AX8907 AX8502
Contextual Info: CompactFlash Ethernet µFC-BGA SBC83683 AC'97 Audio Board ID CRT PCI Intel µFC-BGA Embedded SBC with Multiple I/O Features Microsoft ® Windowsxp WindowsCE Power Conn. FDD Conn. Features IDE 2 Port ™ Fanless IDE 1 Port Intel µFC-BGA ULP/LP CPU ®

196-pin

Abstract: DSP56300 EB360
Contextual Info: Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196pin Plastic Ball Grid Array (PBGA) packages. The MAP - BGA

DSP56300

Abstract: EB362
Contextual Info: Freescale Semiconductor Engineering Bulletin EB362 Rev. 1, 10/2005 Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages This document describes the differences between the 252-pin MAP-BGA Mold Array Process-Ball Grid Array and the 252pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

AS 108-120

Abstract: EPM7128B 144-FI 95 g4
Contextual Info: EPM7128B Dedicated Pin-Outs ver. 1.0 Dedicated Pin 48-Pin VTQFP 49-Pin Ultra FineLine BGA 100-Pin TQFP 100-Pin 144-Pin FineLine BGA TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 1 TMS (1) TCK (1) TDO (1) VREFA (2)

BLVDS-25

Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
Contextual Info: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)