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    BGA 196 LAND PATTERN Search Results

    BGA 196 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF

    BGA 196 LAND PATTERN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    14X14

    Abstract: SF-BGA196D-B-11 pitch 0.4mm BGA
    Contextual Info: C Package Code: BGA196D D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.50mm [0.531"] 0.50mm [0.020"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"]


    Original     		BGA196D FR4/G10 14X14 SF-BGA196D-B-11 14X14 pitch 0.4mm BGA PDF

    bga 196 land pattern

    Abstract: 0.4mm pitch BGA BGA Package 14x14 1mm pitch BGA 14X14 1mm pitch BGA SF-BGA196C-B-11 14X14 pitch 0.4mm BGA BGA Solder Ball 1mm
    Contextual Info: C Package Code: BGA196C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 1.00mm pitch typ. 0.53mm [0.021"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]


    Original     		BGA196C FR4/G10 14X14 SF-BGA196C-B-11 bga 196 land pattern 0.4mm pitch BGA BGA Package 14x14 1mm pitch BGA 14X14 1mm pitch BGA 14X14 pitch 0.4mm BGA BGA Solder Ball 1mm PDF

    SF-BGA196A-B-11

    Abstract: BGA196A
    Contextual Info: D Package Code: BGA196A C 16.51mm [0.650"] See BGA pattern code to the right for actual pattern layout Y 1.91mm [0.075"] 0.76mm [0.030"] 16.51mm [0.650"] X Top View reference only 1.91mm [0.075"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA196A SF-BGA196A-B-11 BGA196A PDF

    LS-BGA196E-61

    Contextual Info: Top View 0.8mm [0.031"] 12mm [0.472"] 0.8mm [0.031"] 0.8mm typ. 12mm [0.472"] 10.4mm square 1 3.52mm [0.139"] 1.68mm [0.066"] 2 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non clad


    Original     		FR4/G10 14x14 LS-BGA196E-61 PDF

    LS-BGA196G-41

    Contextual Info: 17.00mm [0.669"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 17.00mm [0.669"] Top View 1 3.76mm [0.148"] 1.68mm [0.066"] Side View Ø 0.20mm [0.008"] ±0.0005" 2 15.00mm [0.591"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 16x16 LS-BGA196G-41 PDF

    LS-BGA196D-41

    Contextual Info: 17.00mm [0.669"] 2.00mm [0.079"] 2.00mm [0.079"] 1.00mm typ. 17.00mm [0.669"] Top View 1 Side View 3.76mm [0.148"] 1.68mm [0.066"] 2 Ø 0.20mm [0.008"] ±0.0005" 13.00mm [0.512"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 14x14 LS-BGA196D-41 PDF

    LS-BGA196F-41

    Contextual Info: 23.00mm [0.906"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 23.00mm [0.906"] Top View 1 Side View 3.76mm [0.148"] 1.68mm [0.066"] Ø 0.20mm [0.008"] ±0.0005" 2 21.00mm [0.827"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		FR4/G10 20x20 LS-BGA196F-41 PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    SF-BGA196E-B-05

    Abstract: bga 196 land pattern
    Contextual Info: 19.725mm [0.777"] 2.50mm [0.098"] 2.54mm [0.100"] 10.40mm [0.409"] 2.50mm [0.098"] 2.16mm [0.085"] Top View 2.54mm [0.100"] A1 10.40mm [0.409"] 19.725mm [0.777"] 14.725mm [0.580"] 0.80mm typ. [0.031"] 5.08mm [0.200"] Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm 025mm FR4/G10 Sn63Pb37 SF-BGA196E-B-05 bga 196 land pattern PDF

    land pattern BGA 196

    Abstract: SF-BGA196E-B-05F bga 196 land pattern
    Contextual Info: RoHS COMPLIANT 19.725mm [0.777"] 2.50mm [0.098"] 2.54mm [0.100"] 10.40mm [0.409"] 2.50mm [0.098"] 2.16mm [0.085"] 2.54mm [0.100"] A1 Top View 10.40mm [0.409"] 19.725mm [0.777"] 14.725mm [0.580"] 5.08mm [0.200"] 0.80mm typ. Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 SF-BGA196E-B-05F land pattern BGA 196 bga 196 land pattern PDF

    SF-BGA196C-B-05

    Abstract: bga 196 land pattern
    Contextual Info: 22.725mm [0.895"] 2.50mm [0.098"] 13.00mm [0.512"] 2.50mm [0.098"] 2.54mm [0.100"] 2.74mm [0.108"] 2.36mm [0.093"] 22.725mm [0.895"] 13.00mm [0.512"] 17.725mm [0.698"] 1.00mm typ. [0.039"] 5.08mm [0.200"] Top View 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 Sn63Pb37 SF-BGA196C-B-05 bga 196 land pattern PDF

    SF-BGA196J-B-05

    Abstract: 0619
    Contextual Info: 20.725mm [0.816"] 2.50mm [0.098"] 3.04mm [0.120"] 10.40mm [0.409"] 2.50mm [0.098"] 2.54mm [0.100"] 2.66mm [0.105"] Top View 10.40mm [0.409"] 20.725mm [0.816"] 15.725mm [0.619"] 0.80mm typ. [0.031"] 5.08mm [0.200"] Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		725mm FR4/G10 Sn63Pb37 SF-BGA196J-B-05 0619 PDF

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Contextual Info: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256 PDF

    FBGA-484

    Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
    Contextual Info: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly


    Original     		FBGA484 SI-SX32-ACQ256SFG484 SI-SX72-ACQ256SFG484) SI-SX72-ACQ256SFG484 CQ256 FG484 SI-SX72ACQ256SFG484) FBGA-484 A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208 PDF

    16x16 rgb led matrix

    Abstract: Diode Mark ON B14 mux ic 157 ISL59530 ISL59530IKZ ISL59530IRZ ISL59531 V356
    Contextual Info: ISL59530 Data Sheet June 3, 2008 FN6220.7 16x16 Video Crosspoint Features The ISL59530 is a 300MHz 16x16 Video Crosspoint Switch. Each input has an integrated DC-restore clamp and an input buffer. Each output has a fast On-Screen Display OSD switch (for inserting graphics or other video) and an output


    Original     		ISL59530 FN6220 16x16 ISL59530 300MHz JESD-MO220. 16x16 rgb led matrix Diode Mark ON B14 mux ic 157 ISL59530IKZ ISL59530IRZ ISL59531 V356 PDF

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets PDF

    ISL59530

    Abstract: ISL59530IKZ ISL59530IRZ ISL59531 V356
    Contextual Info: ISL59530 Data Sheet April 13, 2011 FN6220.8 16x16 Video Crosspoint Features The ISL59530 is a 300MHz 16x16 Video Crosspoint Switch. Each input has an integrated DC-restore clamp and an input buffer. Each output has a fast On-Screen Display OSD switch (for inserting graphics or other video) and an output


    Original     		ISL59530 FN6220 16x16 ISL59530 300MHz 5M-1994. MS-034/A ISL59530IKZ ISL59530IRZ ISL59531 V356 PDF