BGA 180 PACKAGE Search Results

1152 BGA tray

Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.

36AB-180

Abstract: GS842Z18AB-180I GS842Z18A GS842Z36A
Contextual Info: Preliminary GS842Z18/36AB-180/166/150/100 119-Bump BGA Commercial Temp Industrial Temp MHz 4Mb Pipelined and Flow Through 180 MHz–100 3.3 V VDD Synchronous NBT SRAMs 2.5 V and 3.3 V VDDQ Features Functional Description • 256K x 18 and 128K x 36 configurations

dp 104c

Contextual Info: GS842Z18/36AB-180/166/150/100 4Mb Pipelined and Flow Through Synchronous NBT SRAMs 119-Bump BGA Commercial Temp Industrial Temp Features 180 MHz–100 MHz 3.3 V VDD 2.5 V and 3.3 V VDDQ Because it is a synchronous device, address, data inputs, and read/ write control inputs are captured on the rising edge of the

B180

Contextual Info: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application

GS841E18A

Abstract: GS841E18AT-180 256k x 18 119bga TS/103/02 B180
Contextual Info: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application

B180

Contextual Info: GS841E18AT/B-180/166/150/130/100 TQFP, BGA Commercial Temp Industrial Temp 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application

B180

Abstract: GS841E18A GS841E18AT-180
Contextual Info: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application

B180

Contextual Info: GS841E18AT/B-180/166/150/130/100 180 MHz–100 MHz 3.3 V VDD 3.3 V and 2.5 V I/O 256K x 18 Sync Cache Tag TQFP, BGA Commercial Temp Industrial Temp Features • 3.3 V +10%/–5% core power supply, 2.5 V or 3.3 V I/O supply • Dual Cycle Deselect DCD • Intergrated data comparator for Tag RAM application

Contextual Info: GS76024AB BGA Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 24 6Mb Asynchronous SRAM Features 119-bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation: 260/210/180 mA at minimum cycle time

tray datasheet bga

Abstract: tray bga
Contextual Info: 180°C MAX NX BG1422 2.0 0712 8 REV.A A' 18.40 12.75 A 14.2 110.4 135.9 UNIT : mm 22.2 24.40 268.4 23.30 315.0 322.6 SECTION A – A' 5.52 (6.35) 7.62 22.2 Applied Package Quantity (pcs) 119-pin Plastic BGA (14x22) MAX. 84 Tray Material NX BG1422 2.0 Carbon PES

GS76024AB-12

Abstract: GS76024AB-8I 76024A
Contextual Info: GS76024AB BGA Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 24 6Mb Asynchronous SRAM Features 119-bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation: 260/210/180 mA at minimum cycle time

GS76024A

Abstract: GS76024AB
Contextual Info: GS76024AB BGA Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 256K x 24 6Mb Asynchronous SRAM Features 119-bump Ball Grid Array Package • Fast access time: 8, 10, 12 ns • CMOS low power operation: 260/210/180 mA at minimum cycle time

tray datasheet bga

Contextual Info: UNIT : mm A' 29.26 180°C MAX TBGA 29 x 29 × 1.7mm 31.40 20.85 29.26 31.60 31.10 252.8 315.0 322.6 SECTION A – A' 29.26 5.82 7.62 6.35 135.9 94.2 A Applied Package 272-pin • Plastic BGA ( Quantity (pcs) 29) MAX. 36 Tray Material Heat Proof Temp. Surface resistance

Contextual Info: Preliminary GS840H18/32/36AT/B-200/180/166 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.

GS840E18A

Abstract: GS840E32A GS840E36A
Contextual Info: Preliminary GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GS840E18A

Abstract: GS840E32A GS840E36A B180
Contextual Info: Preliminary GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GS840E18A

Abstract: GS840E32A GS840E36A
Contextual Info: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GS84018A

Abstract: GS84018AT-190 GS84032A GS84036A
Contextual Info: Preliminary GS84018/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation

Contextual Info: Preliminary GS840H18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipeline operation • Single Cycle Deselect SCD Operation

Contextual Info: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GS840H18A

Abstract: GS840H32A GS840H36A
Contextual Info: Preliminary GS840H18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipeline operation • Single Cycle Deselect SCD Operation

Contextual Info: Preliminary GS88418/36B-200/180/166 512K x 18, 256K x 36 8Mb S/DCD Sync Burst SRAMs 119-Bump BGA Commercial Temp Industrial Temp Features LBO input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance.

GS842Z18A

Abstract: GS842Z36A
Contextual Info: Preliminary GS842Z18/36AB-200/180/166/150/100 119-Bump BGA Commercial Temp Industrial Temp MHz 4Mb Pipelined and Flow Through 200 MHz–100 3.3 V VDD Synchronous NBT SRAMs 2.5 V and 3.3 V VDDQ Features Functional Description • 256K x 18 and 128K x 36 configurations

180I

Abstract: GS842Z18A GS842Z18AB-166 GS842Z18AB-180 GS842Z36A
Contextual Info: GS842Z18/36AB-180/166/150/100 119-Bump BGA Commercial Temp Industrial Temp 4Mb Pipelined and Flow Through Synchronous NBT SRAMs Features • 256K x 18 and 128K x 36 configurations • User configurable Pipeline and Flow Through mode • NBT No Bus Turn Around functionality allows zero wait