BERG DIN Search Results

VARELCO 10

Abstract: varelco D 2580 1 module berg connector Berg 14 pin IDC
Contextual Info: Series 21 8502 DIN Cable Product Standard DIN BT D 2580 222 Receptacle IDC Discrete Wire Connector PRODUCT DESCRIPTION Series 8502 connectors are specifically designed to BT D 2580 (222) specification and compatible with BERG Backpanel system. The receptacle

din 4124

Abstract: 8502 D2580
Contextual Info: Se rieslO 8502 Standard DIN BT D 2580 222 Plug Discrete Connector DIN Discrete Produci PRODUCT DESCRIPTION Series 8502 connectors are specifically designed to BTD2580 (222) specifications and compatible with the BERG Backpanel system. The plug connector is avai lable in 2 1 ,4 5 ,6 9 and 96

siplace

Abstract: 1.14.002 siplace nozzle rafi 1.14.002
Contextual Info: Data Sheet 1.14.002.-MICON 5 Short-travel Keyswitches Data Sheet MICON 5 Short-travel Keyswitches and Accessories Preliminary technical data, subject to modification. 3D data in step or igs format available on request. RAFI GmbH & Co. KG Ravensburger Str. 128-134, D-88276 Berg/Ravensburg

Contextual Info: AI rights stncty reserved. Reproduction or issue to ttwd porties in any form Property of flERC El£CTROMCS Copyright BERG ElECIKONICS INC E R G sous quelque ferme que es soit sons outernotion écrite du propietaire. •LICTKQNICS — ic Propriété de©BERG afCIUCNKS.

berg din

Contextual Info: I PR O D U C T NU M BER SEE SH EE T 2 OF I" • I f I ~1 I 1 I 2 c b a f T m . i i i □ - U - CN fO 1 1— > r.at'L code See n o te to terà'xes uriess einer wuespecified 1 CUSTOMER COPY projection angle: BERG E L E CTRONI CS B.P. FEMALE REV. procfcjct fa U y

mc14507p

Abstract: Augat ict socket NSH-03SB-S2-TG30 16KX8 DSP56002 JG11 waferscale intergration MCM6290 berg pga C330C474M5R5CA
Contextual Info: CHAPTER 8 DSP56002 APPLICATION DEVELOPMENT MODULE HARDWARE DESCRIPTION 8.1 BOARD ARCHITECTURE The DSP56002 ADM has various options to facilitate evaluation of the different features of the chip. These options are outlined in this chapter with a statement on the default factory jumpers the ADM will be shipped with.

mini-link

Abstract: Ericsson microwave antenna MINI-LINK ericsson Ericsson mini-link ericsson gsm antenna mini link ericsson Ericsson Base Station mini-link E BERG Electronics MINI-LINK bas
Contextual Info: N OV E M B E R 19 9 9 Nästa steg i utvecklingen – med ny organisation mot framtiden TIDNING FÖR PERSONAL INOM ERICSSON MICROWAVE SYSTEMS AB e LEDARE Henrik Brehmer, informationschef Nästa steg i EMW:s utveckling ricsson Microwave går in i 2000-talet

Contextual Info: 16.55 15.75 14.95 14.35 Mafl H dimensions H 114475 114474 114473 114472 Ident-Nr. I.D.number 24 x 2 = 48 2 18 9x2= 49,9 Consider protection memo from DIN 34 2 a Index Date 04.11.1999 All rights reserved. Only for information. To insure that this is the latest

Contextual Info: 14.35 Mafl H dimensions H I.D.number 14.95 114468 114467 15.75 114469 Ident-Nr. 16.55 114470 2 10 x 2 = 20 8 10 x 2 = 20 2 18 9x2= 49,9 Consider protection memo from DIN 34 2 a Index Date 19.10.1999 All rights reserved. Only for information. To insure that this is the latest

DIN 34

Contextual Info: 10 x 2 = 20 2 18 9x2= 24,55 Consider protection memo from DIN 34 2 a Index Date 04.11.1999 All rights reserved. Only for information. To insure that this is the latest version of this drawing, please contact one of the ERNI companies before using. Information:

10 pin BERG female connector

Abstract: berg 92325 BERG female connector
Contextual Info: ~~i r D etail o f optio nal P ro d u c t n u m b e r see kin ked legs see n ote 5 n e xt sheet 8.5 0 .6 x 4 5 ' K ¥ l A p rin tin g o re o see note 2 ! T □0.6 ko— A Notes: 1. M ate rial body: Glass fib e r file d p olye ste r M a te ria l c o n ta c t: P h o s p h o r b ronze

ERG INC 1715

Abstract: tw 104 94v-0 68751 mrc 437 berg din EMT 248 nl 234
Contextual Info: PRODUCT NUMBER SE E TABLE 0 .01 0/.25 F ® G ® AT BA SE 0 .016/.41 ® F ® G ® AT T IP S $ ( S) (S )(g > (S ) ( $ (3) ® . 100 8 .5 4 J ^ '200 I 5 . 0 8 K“ fr 10 .010/.25 ® | f I . 03 MAX 0 .B F L A S H •260 i _ r _ i 6 .60 I—9—I . 05

Contextual Info: I I I ~1— I D e ta i l T" of o p tio n a l k in ked le g s see note 5 ”1 0 .3 5 ± 0 .1 P rodu ct number see next sheet X o \ ¿ Z , i i i / D e to il s c a l e 5:1 0.6x45’ 0.1 55 B I |- = - 0 .1 A ± ± ± ± ± ± + + + + + 'f + ; £ + + + + + + + + +>

DSP56156

Abstract: LM358J 74FACT00 ICA-143-SCO-TG30 DIN-96CPC-SR1-TR NSH-32SB-S2-TG30 DSP56166 JG11 ADM processor ads56156
Contextual Info: CHAPTER 7 DSP56156/166 APPLICATION DEVELOPMENT MODULE HARDWARE DESCRIPTION 7.1 BOARD ARCHITECTURE The DSP56156/166 ADM has various options to facilitate evaluation of the different features of the chip. This chapter describes these options and gives electrical information

berg contact 75231-013

Abstract: 48051-002 47439-002 47750-000 d2580d 47715-000 482320 4823 47565 4n240
Contextual Info: FCI - Product datasheet Page 1 o f 2 1 1 11 Discrete Crimp-to Wire Contacts m Product Inform ation b 47745-001 H m I H I 2.54 mm 0.100 in. Centerline Crimp-to-Wire Mini-PV Receptacle F e a tu r FCI catalog • search by • m ■ b m b m x m m ru te *

ICT-083-S-TG

Abstract: ADS56002 nsh-08db NSH-10DB-S2 RST555 ws57c43 Augat A08 BERG RS232 MALLORY DISTRIBUTOR mc14507p
Contextual Info: DSP56002ADM User’s Manual Motorola, Incorporated Semiconductor Products Sector 6501 William Cannon Drive West Austin, TX 78735-8598 Introduction This document supports the DSP56002 Application Development Module DSP56002ADM , including a description of its basic structure and operation, the

ITW Pancon 100-032-033

Abstract: 100-348-033 amphenol C133 714A 96P Panduit 120-964-455 100-096-023 BPS3B96ACROFOZ1 100-096-023 panduit ITW Pancon Panduit 120-964-435 C143012A96S
Contextual Info: AVX DIN41612 Cross-Reference 3M/Robinson Nugent 3M 3M 3M 3M 3M 3M 3M 3M 3M 3M 3M 3M 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT 3M/ROB.NUGENT

ptpm754

Abstract: ibm trackpoint TPM754 PTPM754DB 80C51 LMC6034 MAX202 RS-232 trackball touchpad schematic ibm trackpoint ptpm754
Contextual Info: Philips Semiconductors Preliminary specification Microcontroller with TrackPoint microcode from IBM The Philips Semiconductors TPM754 is a small package, low cost, ROM-coded 80C51 with IBM’s TrackPoint pointing algorithms and control code. TrackPoint is the result of years of human factors

berg din

Contextual Info: \ FO R PRODUCT NUM BER SEE SH EET i~ i T — r~ i -i— I I P .C . 2 /2 M OU N TIN G H O LE O PTIO N AL, SEE PATTERN NOTE 5 0 .5 r''. I o 2 .9 6 REF. NO TES: 1 M ATERIAL PIN 2 M ATERIAL BO DY: : PH O SPH O R 3 4 C O LO U R : GREY, FLAM E RETARDANT PE R U L - 9 4 - V 0

wabash relay

Abstract: 1820-3145 1826-0346 Rohm op amp tkf 28 1826-0180 Caddell-Burns Manufacturing e1420 5053HD619K0F GRM3195C1H102JD01D
Contextual Info: Agilent E1420B Component Level Information E1420B Universal Counter Component Level Information Information in this packet applies to the following assemblies: 1. E1420-68006 PC Assembly VXI Assembly 2. 53310-60008 PC Assembly (Input Board) The following is included in this packet:

PAL Decoder 16L8

Abstract: 2N3904 A31 ICT-286-S-TG 2N3904 A30 ICT-286-STG ICT-203-S-TG NSH-36SB-S2-TG30 20000000-3FFFFFFF ICE-283-S-TG P1C30
Contextual Info: CHAPTER 10 DSP96002 APPLICATION DEVELOPMENT MODULE HARDWARE DESCRIPTION 10.1 BOARD ARCHITECTURE The DSP96002 ADM has various options to facilitate evaluation of the different features of the chip. These options are outlined in this chapter with a statement on the default factory jumpers the ADM will be shipped with.

h20B

Abstract: berg din
Contextual Info: i FOR PRODUCT NUM BER SEE SHEET i r M i t i l "i 2/2 P.C. M O U N T IN G H O LE P A TTERN -f— 0 .5 D ETAIL Q S C A L E 5:1 N O T ES: 1 M A T ER IA L P IN : P H O S P H O R B R O N Z E 2 M A T ER IA L BO D Y : T H E R M O P L A S T IC P O L Y E S T E R 3 0 % F IB E R G L A S S F IL L E D

70072

Abstract: berg din 0JLS300.X
Contextual Info: i l FOR PRO DUCT N U M BER i i i: .r. S E E SH EET 2 / 2 P.C. MOUNTING HOLE PATTERN r DETAIL Y SCALE 5:1 OPTIONAL, SEE NOTE 5 NOTES: 1 MATERIAL PIN : P H O SP H O R BRO N ZE 2 MATERIAL BODY: THERMOPLASTIC PO LYESTER 3 0 % FIBER G LASS FILLED COLOUR:GREY, FLAME RETARDANT PER U L - 9 4 - V 0

berg din

Contextual Info: r J 111 I 1 ~ T "I I J I* I I I I PRODUCT NO: SE E SH EET 2 / 2 O h | lj w H! j iii o NOTES: $ 0.6 3 5 MAX 1 MATERIAL PIN: P H O SP H E R BRO N ZE 2 MATERIAL BODY: TH ERM O PLASTIC PO LYEST ER 3 0 % F IS E R G L A S FILLED COLOUR: GREY, FLAME RETARDANT PER U L - 9 4 - V 0