BEND Search Results

optocoupler P 521

Abstract: 521 optocoupler 731 OPTOCOUPLER 64 LEAD DIP OUTLINE toshiba tlp
Contextual Info: 5 -2 Standard Lead Forming 5-2-1) SURFACE MOUNT LEAD BEND OPTIONS LF1) (LF4) (LF5) “ LF5 H f» Outline 8 pin 4 pin 4 • J t I A_a_a_a n a y uuy 3 1 4 16pin 6 pin • 5 4 Pi f l FI ¿ .a fi n n n n a U S“ B i u u u u u u u u > 3 i e oT he photocoupler line-up with lead ben­

Contextual Info: SUBMINIATURE SOLID STATE LAMP Part Number: AM2520SRC09-RV Super Bright Red Features Description zSubminiature package. The Super Bright Red source color devices are made with zZ-bend lead. Gallium Aluminum Arsenide Red Light Emitting Diode. zLong life - solid state reliability.

Contextual Info: SUBMINIATURE SOLID STATE LAMP Part Number: AM2520MGC09 Mega Green Features Description z Subminiature package. The Mega Green source color devices are made with Al- z Z-bend lead. GaInP on GaAs substrate Light Emitting Diode. z Long life - solid state reliability.

cable h1000

Abstract: ansi h35 UL 486A H150 H9500 lt 908 UL 486A ferrules
Contextual Info: Ferrules INDUSTRY STANDARD FERRULES Insulated Industry Standard Ferrules insure reliable electrical connections when terminating stranded flexible wire in terminal blocks, circuit breakers or other control devices. Insulated ferrules prevent conductor breakage due to bending,

KM-27CGCK-10

Contextual Info: SUBMINIATURE SOLID STATE LAMP Part Number: KM-27CGCK-10 Green Features Description z SUBMINIATURE PACKAGE. The Green source color devices are made with InGaAlP on z WIDE VIEWING ANGLE. GaAs substrate Light Emitting Diode. z RIGHT ANGLE BEND. z LONG LIFE-SOLID STATE RELIABILITY.

KM2520SURC09

Contextual Info: SUBMINIATURE SOLID STATE LAMP PRELIMINARY SPEC Part Number: KM2520SURC09 Hyper Red Features Description z SUBMINIA TURE PACKAGE. The Hyper Red source color devices are made with z WIDE VIEWING ANGLE. InGaAlP on GaAs substrate Light Emitting Diode. z Z-BEND LEAD.

KM-27SURC-09

Contextual Info: SUBMINIATURE SOLID STATE LAMP PRELIMINARY SPEC Part Number: KM-27SURC-09 Hyper Red Features Description z SUBMINIATURE PACKAGE. The Hyper Red source color devices are made with z WIDE VIEWING ANGLE. InGaAlP on GaAs substrate Light Emitting Diode. z Z-BEND LEAD.

AM27SGC09

Contextual Info: SUBMINIATURE SOLID STATE LAMP Part Number: AM27SGC09 Super Bright Green Features Description z SUBMINIATURE PACKAGE. The Super Bright Green source color devices are made with z WIDE VIEWING ANGLE. Gallium Phosphide Green Light Emitting Diode. z Z-BEND LEAD.

KM-27SECK-10

Contextual Info: SUBMINIATURE SOLID STATE LAMP Part Number: KM-27SECK-10 Super Bright Orange Features Description z SUBMINIATURE PACKAGE. The Super Bright Orange device is made with InGaAlP z WIDE VIEWING ANGLE. on GaAs substrate light emitting diode chip. z RIGHT ANGLE BEND.

Contextual Info: product P -P W A M M F I r LMAlNINtL F M W A M f 'f M iT M T I tN M A N L tM tN -100V. -12A, o.3n SDF9130 SDF9130 JAA JAB M H C M U b FEATURES • RUGGED PACKAGE • H I - R E L CONSTRUCTION • CERAMIC EYELETS • LEAD BENDING OPTIONS • COPPER CORED 52 ALLOY PINS

Contextual Info: PRODUCT CATTALO' N-CHANNEL ENHANCEMENT MOS 500V, 4.5A, 1.5Q SDF430 SDF430 SDF430 JAA JAB JDA FEATURES • RUGGED PACKAGE • HI-REL CONSTRUCTION • CERAMIC EYELETS:J A A .JAB • L E A D BENDING OPTIONS • COPPER CORED 52 ALLOY PINS • LOW IR LOSSES • LOW THERMAL RESISTANCE

Contextual Info: V1SHAY Vishay Telefunken ▼ Assembly Instructions on the ratio of component’s mass to an As-Irradiated surface. General Optoelectronic semiconductor mounted in any position. devices can be Connecting wires of less than 0.5 mm diameter may be bent, provided the bend is not less than 1.5 mm

Contextual Info: PRODUCT C A T A L O G _ . ^ S l i t r o i l ogy,^ ,nc \K7 :{%f N-CHANNEL ENHANCEMENT MOS FET 400V, 25A, 0.2 1Q 5DF360 SDF360 SDF360 5DF360 PARAMETER JEA JEB JEC JED • RUGGED PACKAGE •H I - R E L CONSTRUCTION • CERAMIC EYELETS • LEAD BENDING OPTIONS

Contextual Info: PRODUCT CÂTÂLO' Æ llt r o n 1177 BLUE T E L: 4 0 7 N-CHANNEL ENHANCEMENT MOS FE T 200A, o.onn 100V, SDF200NA10 HE • • • • • • • • RUGGED PACKAGE HI-REL CONSTRUCTION CERAMIC EYELETS LEAD BENDING OPTIONS COPPER CORED 52 ALLOY PINS LOW IR LOSSES

Contextual Info: flì S u p ertex inc. Package Options (N6 , (NA), (J), (P) (N7),(P), (C), (D) (N8) (NW) (ND, X) Ceramic LCC (NF) (LG, TG) (WG) Plastic (PG) Plastic (PG) Ceramic (DG) Plastic (PC), (PJ) Ceramic (DJ) Ceramic Leaded Chip Carrier Std. Bend (CS) Gullwing Plastic (PG)

Contextual Info: C ÂTÂLÛ Q _Æ \\tx a n PRODUCT Dm Œ S.mc. N-CHANNEL ENHANCEMENT MOS FET 500V, 8 6 A , 0.07Q A B SO LU TE SDF85NA50 HI SDF85NA50 JD PARAM ETER FEATURES • • • • • • • • RUGGED PACKAGE HI-REL CONSTRUCTION CERAMIC EYELETS LEAD BENDING OPTIONS

AM2520SYCK09

Contextual Info: SUBMINIATURE SOLID STATE LAMP Part Number: AM2520SYCK09 Super Bright Yellow Features Description z Subminiature package. The Super Bright Yellow device is made with AlGaInP on z Z-bend lead. GaAs substrate light emitting diode chip. z Long life - solid state reliability.

1D13A

Contextual Info: PRODUCT CÄTALQQ_ Æ t\\tTan „F>lffS 1Nr N-CHANNEL ENHANCEMENT MOS FET 400V, 150A, 0 . 035n SDF150NA40 HE FEATURES • RUGGED PACKAGE • H I - R E L CONSTRUCTION • CERAMIC EYELETS • LEAD BENDING OPTIONS • COPPER CORED 52 ALLOY PINS • L O W IR LOSSES

PS8601

Abstract: PS8601L PS8601L1 PS8601L2 PS8601L-E3 VDE0884 NEC ps8601
Contextual Info: DATA SHEET PHOTOCOUPLER PS8601,PS8601L HIGH SPEED ANALOG OUTPUT TYPE 8-PIN PHOTOCOUPLER −NEPOC TM Series− DESCRIPTION The PS8601 and PS8601L are 8-pin high speed photocouplers containing a GaAIAs LED on input side and a P-N photodiode and a high speed amplifier transistor on output side on one chip. The PS8601 is in a plastic DIP Dual Inline Package . The PS8601L is lead bending type (Gull wing) for surface mount.

Contextual Info: American Opto Plus LED L-980-LYC-TR-X Axial Flat Top Z Bend Lead LED MAIN FEATURES - ROHS COMPLIANCE GULL WING AXIAL FLAT TOP LED WIDE VIEWING ANGLE PACKAGE DIMENSIONS Recommended Pad Layout DIMENSIONS ARE IN MILLIMETERS TOLERANCE IS ± 0.2mm 0.008” UNLESS OTHERWISE NOTED

Contextual Info: 1.5SMCSeries Vishay Semiconductors formerly General Semiconductor Surface Mount TRANSZORB Transient Voltage Suppressors DO-214AB SMC J-Bend Cathode Band 0.245 (6.22) 0.220 (5.59) 0.126 (3.20) 0.114 (2.90) ed e* d n Extee Rang g a t l Vo V(BR) Unidirectional

Contextual Info: SMBJ5.0 thru 188CA Vishay Semiconductors formerly General Semiconductor Surface Mount TRANSZORB Transient Voltage Suppressors DO-214AA SMB J-Bend Cathode Band 0.155 (3.94) 0.130 (3.30) 0.086 (2.20) 0.077 (1.95) 0.180 (4.57) 0.160 (4.06) Stand-off Voltage 5.0 to 188V

transzorb marking code GEM

Abstract: gfx 77 TRANSZORB gem 307 GDE gde 103 106 35K 528 156 35K 943 bdw 51 52 GDE TVS gdm 57
Contextual Info: SMCJ5.0 thru 188CA Surface Mount TRANSZORB Transient Voltage Suppressors Stand-off Voltage 5.0 to 188V Peak Pulse Power 1500W DO-214AB SMC J-Bend Cathode Band d e d n nge e t x E e Ra g a t l Vo Mounting Pad Layout 0.245 (6.22) 0.220 (5.59) 0.126 (3.20)

10-74696-1

Abstract: 10-74696-6 10-40565 10-40793 10-40564 10-74696-2 10-40557 bendix 6 pin 10-40792 10-40553
Contextual Info: QWL crimp contacts Machined from copper alloys and silver-plated for maximum corrosion resis­ tance, with a minimum millivolt drop and a maximum current carrying capacity, the size 16 and 12 socket contacts are of the closed entry design. Crimp contacts are available for all MS insert arrangements and are identified with a Bendix