BCR EFI Search Results

WBCR-008

Abstract: bcr efi electrofilms back contact
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value

electrofilms back contact

Abstract: bcr resistor
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

bcr20

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10  to 1 M • Oxidized silicon substrate for good power dissipation

Contextual Info: SIEMENS BCP 54 . BCP 56 NPN Silicon AF Transistors • • • • For AF driver and output stages High collector current Low collector-emitter saturation voltage Complementary types: BCR 51 . BCP 53 PNP Type Marking Ordering Code (tape and reel) Pin Configuration

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10  to 1 M • Oxidized silicon substrate for good power dissipation

Waffle Pack Packaging

Contextual Info: Waffle Pack Packaging www.vishay.com Vishay Electro-Films VISHAY ELECTRO-FILMS WAFFLE PACK QUANTITY PER PRODUCT FAMILY 2 inch x 2 inch PRODUCT FAMILY CC1CC2CC3CC4CC5CC6CC7CC8SFC SFM SFP SFN SFX SC3 QFM QFN QFX BCR PWA PWB CTT CTA CCC CTR CTN CTM CTQ CCB

WBCR02750000F

Abstract: BCR50000FKAHWS
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

WBCR02750000F

Abstract: bcr resistor bcr efi ElectroFilm
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

Contextual Info: V i sh ay I n t e rt e ch n o l o g y, I n c . I INNOVAT AND TEC O L OGY BCR N HN Thin Film Resistor O 19 62-2012 Resistors - Space Saving, Back Contact Thin Film, Back Contact Resistor Key Benefits • • • • • Requires only one wire bond, thus saving space

one wire

Contextual Info: PRODUCT SHEET V I S H A Y I N T E R T E C H N O L O G Y, I N C . RESISTORS Model BCR Thin Film, Back Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chips can be attached either eutectically or with conductive epoxy

Vishay Power resistor

Abstract: bcr efi one wire bcr resistor
Contextual Info: Thin Film, Back-Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chip can be attached either eutectically or with conductive epoxy • Smaller footprint than alternative configurations

Contextual Info: Chip Resistors Features EFI offers the broadest line of thin-film chip resistors for hybrid circuit or chip-on-board applications from a single manufacturer. Both chip and wire or solder/conductive epoxy versions are available. Several variations each of single resistor, center-tapped, back contact, high resistance, and high frequency types are

ACSR30

Abstract: pcs71 p51 apple p66 apple ice UARTO W65C802 65C26 DF-45 65C265S W65C265S
Contextual Info: WDC THE WESTERN DESIGN CENTER, INC. W65C265S S E C T IO N 1 W 65C 265S F U N C T IO N D E S C R IP T IO N 1.1 The W 65C 816S Static 8-and 16-bit M icroprocessor Core The W65C816S 16-bit microprocessor is the fully static may be stopped when PHI2 is high or low version of

Contextual Info: WDC THE WESTERN DESIGN CENTER, INC. W65C265S IN T R O D U C T IO N The W D C W 65C265S m icrocom puter is a com plete fully static 16-bit com puter fabricated on a single chip using a H i-R el low pow er CM OS process. T he W 65C265S com plem ents an established and

ROY TODD

Abstract: DF27 555 timer W65C802 1203 6d df20 p661 t40 p521 65C02 W65C02S
Contextual Info: WDC THE WESTERN DESIGN CENTER, INC. W65C265S IN T R O D U C T IO N The W D C W 65C 265S m icrocom puter is a com plete fully static 16-bit com puter fabricated on a single chip using a H i-Rel low pow er CM O S process. The W 65C265S com plem ents an established and grow ing line

Contextual Info: V ishay I ntertechnolog y, I nc . I INNOVAT AND TEC O L OGY Vishay Electro-Films N HN WIRE BONDABLE PASSIVE COMPONENTS O 19 62-2012 Resistors - High-Reliability Components Full Range of Wire Bondable Passive Components INTRODUCTION Vishay Electro-Films EFI offers a full range of wire bondable passive components that includes

Contextual Info: ► in t e i  I M K i O M F Û fô G M T T O !*!] UPI-452 CHMOS PROGRAMMABLE I/O PROCESSOR 83C452 - 8K x 8 Mask Programmable Internal ROM 80C452 - External ROM/EPROM Two 16-Bit Timer/Counters Boolean Processor Bit Addressable RAM 8 Interrupt Sources Programmable Full Duplex Serial

military passive component

Contextual Info: V i s h ay I n t e r t e c h n o l o g y, I n c . V ishay Ele c tro - Films P A S S I V E C OM P ONENT S Wire Bondable Passive ComponentS Product Family P ROD U C T O V ER V IE W w w w. v i s h a y. c o m INTRODUCTION Vishay Electro-Films EFI offers a full range of wire bondable passive components that includes thin film resistors, MOS