BACK CONTACT RESISTOR Search Results

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.

Contextual Info: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment

Contextual Info: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment

F0306

Contextual Info: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment

Contextual Info: TX CALIFORNIA MICRO DEVICES Back-Contact Thin Film Resistor Series California Micro Devices TX Series back contact 20 mil resistor chips offer the superior properties of Tantalum Nitride material in a single-bond design. Conductive epoxy or eutectic die-attachment to an active substrate

Contextual Info: TX CALIFORNIA MICRO DEVICES Back-Contact Thin Film Resistor Series California Micro Devices TX Series back contact 20 mil resistor chips offer the superior properties of Tantalum Nitride material in a single-bond design. Conductive epoxy or eutectic die-attachment to an active substrate

Contextual Info: MINI-SYSTEMS INC llllM BACK CONTACT RESISTORS L517&5D OOOO'ifib 327 S7E I> MSBC SERIES The MSBC series back contact chip resistor offers designers a space-saving design in a .020" * .020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the

Contextual Info: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The M S B C series back contact chip resistor offers designers a space-saving design in a . 0 2 0 " x . 0 2 0 " size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the

Contextual Info: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi­

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value

electrofilms back contact

Abstract: bcr resistor
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

BCP 39

Abstract: WBCR-008
Contextual Info: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact S Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi­

WBCR-008

Abstract: bcr efi electrofilms back contact
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.

Contextual Info: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor With Part Mark FEATURES Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip requires

Contextual Info: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip

Contextual Info: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip

Contextual Info: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip

Contextual Info: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip

Contextual Info: FEATURES The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assembly time. They are manufactured in the smallest chip size available. BCR SERIES THIN-FILM BACK-CONTACT These chips are manufactured using state-of-the-art thin-film techniques, are

Contextual Info: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip

Contextual Info: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip

tantalum nitride

Abstract: bcr electrofilms back contact resistor
Contextual Info: ELECTRO-FILMS INC/ SEMI- 3ME 3101535 QQGQ174 b THIN-FILM BACK-CONTACT RESISTOR tFEA T U R ES t ì o The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assem bly time. They are manufactured in the sm allest chip size available.