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86094641113765E1LF
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Amphenol Communications Solutions
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DIN Right Angle Header Solder-to-Board Style C64 ways, Class I |
PDF
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68464-140HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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86964-641
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Amphenol Communications Solutions
|
Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.00mm (0.079in) Pitch.. |
PDF
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68464-132HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68464-158HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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