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    B2/1107 Search Results

    B2/1107 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    98401-107-08LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 08 Positions, 2.54mm (0.100in) Pitch. PDF
    54121-107151050LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch. PDF
    10114829-11107LF
    		Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 7 Positions PDF
    54121-107031050LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. PDF
    54121-107030800LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. PDF

    B2/1107 Datasheets (5)

    Bipolar Integrated Technology
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    B2110-70
    		Bipolar Integrated Technology Floating Point ChipSet Scan PDF 2.18MB 44
    B2110-70
    		Bipolar Integrated Technology TTL Floating Point Chip Set Scan PDF 4.05MB 40
    B2110-70B
    		Bipolar Integrated Technology TTL Floating Point Chip Set Scan PDF 4.05MB 40
    B2110-70E
    		Bipolar Integrated Technology TTL Floating Point Chip Set Scan PDF 4.05MB 40
    B2110-70S
    		Bipolar Integrated Technology TTL Floating Point Chip Set Scan PDF 4.05MB 40