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B02P-VL
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JST Manufacturing
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Rectangular Connectors - Headers, Male Pins, Connectors, Interconnects, CONN HEADER 2POS VL SERIES TIN |
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5 |
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B02P-VL
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JST Manufacturing
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Connector: Wire to Board Connector: HDR: 2: 6.2: CRMP: THRU |
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224.08KB |
6 |
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B02P-XL
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JST Manufacturing
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Connector: Wire to Board Connector: HDR: 2: 5: CRMP: THRU |
Original |
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135.49KB |
6 |
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B02P-XL-HDB
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JST Manufacturing
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Connector: Wire to Board Connector: HDR: 2: 5: CRMP: THRU |
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PDF
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135.49KB |
6 |
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B02P-XL-HDS
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JST Manufacturing
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Connector: Wire to Board Connector: HDR: 2: 5: CRMP: THRU |
Original |
PDF
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135.49KB |
6 |
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B02P-XL(LF)(SN)
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JST Manufacturing
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Connector: Wire to Board Connector: HDR: 2: 5: CRMP: THRU |
Original |
PDF
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135.49KB |
6 |
M88DR4DB02P/M88NR4DB02P
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Montage Technology
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M88DR4DB02P/M88NR4DB02P是一款Gen2 Plus DDR4数据缓冲器（DB）芯片，符合JEDEC DDR4DB02标准，最高支持速率DDR4-3200。该DB芯片可与澜起的M88DR4RCD02P（RCD）芯片组成套片，用于DDR4 LRDIMM或NVDIMM（非易失性双列直插内存模组）。每个DDR4 LRDIMM可采用1 * RCD + 9 * M88DR4DB02P，而每个DDR4 NVDIMM可采用1 * RCD + 9 * M88NR4DB02P。注：此处以 DDR4 LRDIMM 为例，展示了 DB 芯片在内存模组上的应用示意图。符合JEDEC DDR4DB02标准最高支持速率DDR4-3200M88NR4DB02P支持NVDIMM（非易失性双列直插内存模组）模式支持DDR4数据 (DQ) 信号双向重定时和1: 1再驱动支持通过输入时钟重新生成数据控制 (DQS) 信号DQ通路内置FIFO，支持总线接口时域和DRAM接口时域解耦支持最多四个pakcage rank总线接口支持package rank定时校准仅支持4位DRAM支持1.2 V VDD电压BCOM接口支持奇偶校验错误和顺序错误检测支持多种节电模式，如CKE低功耗模式、CK STOP模式等绿色封装: FBGA (Fine-pitch Ball Grid Array)M88DR4DB02P 应用于 DDR4 LRDIMMM88NR4DB02P 应用于 DDR4 NVDIMM |
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HSBB02P15
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Huashuo Semiconductor
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P-Ch 150V Fast Switching MOSFET with -2A continuous drain current, 780 mΩ RDS(ON), low gate charge, and high cell density trench technology for synchronous buck converters. |
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M88DR4DB02P/M88NR4DB02P
