B 632 K Search Results
B 632 K Price and Stock
Microtherm Sentronic TK32-T02-MG01-B1P-603-MICThermostats 1/2" Bi-metal / , 60C 6.3x0.8mm terminals/90 deg angle +/-3% tol. |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TK32-T02-MG01-B1P-603-MIC | 115 |
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Microtherm Sentronic TK32-T02-MG01-B1P-1253-MICThermostats 1/2" Bi-metal / , 125C 6.3x0.8mm terminals/90 deg angle +/-3% tol. |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TK32-T02-MG01-B1P-1253-MIC | 112 |
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Microtherm Sentronic TK32-T01-MG01-B1P-853-MICThermostats 1/2" Bi-metal / , 85C 6.3x0.8mm terminals/0 deg angle +/-3% tol. |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TK32-T01-MG01-B1P-853-MIC | 98 |
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Microtherm Sentronic TK32-T01-MG01-B1P-403-MICThermostats 1/2" Bi-metal / , 40C 6.3x0.8mm terminals/0 deg angle +/-3% tol. |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TK32-T01-MG01-B1P-403-MIC | 93 |
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Microtherm Sentronic TK32-T02-MG01-B1P-653-MICThermostats 1/2" Bi-metal / , 65C 6.3x0.8mm terminals/90 deg angle +/-3% tol. |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TK32-T02-MG01-B1P-653-MIC | 88 |
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B 632 K Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
MLM2902
Abstract: MC3386 mlm324 MC4141 MLM311 MC1709 MC1437 MC4741 MC1537 MC4202
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OCR Scan |
MLM111 MLM211 MLM311 MLM111 MLM211 MLM311 MC1514 MC1414 MC3471 MC4202C MLM2902 MC3386 mlm324 MC4141 MC1709 MC1437 MC4741 MC1537 MC4202 | |
J62.017
Abstract: jn1003 MIL-STD-220A pi att
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Original |
MIL-C-38999 MIL-DTL-38999 1-38V 7-46V J62.017 jn1003 MIL-STD-220A pi att | |
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Contextual Info: M MOTOROLA MC74F38 QUAD 2-INPUT NAND BUFFER, OPEN COLLECTOR QUAD 2-INPUT NAND BUFFER, OPEN COLLECTOR FAST SCHOTTKY TTL V cc A B Y nri iiai r ii rrn A B Y îtôi it i i t i J SUFFIX CERAMIC CASE 632-08 □ A LU W LU LU LU üJ B Y A B Y GND N SUFFIX JRpi ¿SE |
OCR Scan |
MC74F38 MC74FXXJ MC74FXXN MC74FXXD MC74F38 | |
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Contextual Info: QUAD 2-INPUT NAND BUFFER, OPEN COLLECTOR LIFETIME BUY FAST SCHOTTKY TTL VCC A B Y A B Y 14 13 12 11 10 9 8 J SUFFIX CERAMIC CASE 632-08 14 1 1 2 3 4 5 6 7 A B Y A B Y GND N SUFFIX PLASTIC CASE 646-06 14 1 14 1 D SUFFIX SOIC CASE 751A-02 ORDERING INFORMATION |
Original |
51A-02 MC74FXXJ MC74FXXN MC74FXXD MC74F38 | |
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Contextual Info: Product Number: 150-10-632-00-001000 Description: DIP Header Standard Header Solder Tail Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C Qty. per Tube Mill-Max Part |
Original |
C36000) C/885 2002/95Annex | |
Beckman resistor network
Abstract: MP1514 Beckman Industrial Beckman Industrial 330 beckman resistor de 27k ohm 2N08G Beckman tech 330 EIA "J" code marking Beckman RESISTOR NETWORKS
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OCR Scan |
133ht T-62-05 632B330 2B330 632B330JTR 2B330J 632J221/331 632N221/331GTR 2N08G J25555 Beckman resistor network MP1514 Beckman Industrial Beckman Industrial 330 beckman resistor de 27k ohm 2N08G Beckman tech 330 EIA "J" code marking Beckman RESISTOR NETWORKS | |
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Contextual Info: Product Number: 151-10-632-00-003000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 151-10-632-00-011000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 151-10-632-00-004000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 142-90-632-00-591000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 90 Shell Plating: 200 " Tin/Lead 93/7 over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 150-90-632-00-001000 Description: DIP Header Standard Header Solder Tail Open Frame Through Hole Plating Code: 90 Shell Plating: 200 " Tin/Lead 93/7 over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C Qty. per Tube Mill-Max |
Original |
C36000) C/885 2002/95Annex | |
2sc5480
Abstract: 2SC5480 equivalent damper 2SC548 Hitachi DSA001650
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Original |
2SC5480 ADE-208-632 2sc5480 2SC5480 equivalent damper 2SC548 Hitachi DSA001650 | |
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Contextual Info: Product Number: 142-10-632-00-592000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 134-10-632-00-010000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 183-10-632-00-001000 Description: DIP Header Solder Cup Header 3 Level Wrappost Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max |
Original |
C36000) C/885 2002/95regulation | |
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Contextual Info: Product Number: 134-10-632-00-020000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 160-90-632-00-001000 Description: DIP Header Slotted Header Solder Tail Open Frame Through Hole Plating Code: 90 Shell Plating: 200 " Tin/Lead 93/7 over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C Qty. per Tube Mill-Max |
Original |
C36000) C/885 2002/95Annex | |
ShrinkContextual Info: Product Number: 142-90-632-00-592000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 90 Shell Plating: 200 " Tin/Lead 93/7 over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number |
Original |
C36000) C/885 2002/95Annex Shrink | |
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Contextual Info: Product Number: 162-10-632-00-001000 Description: DIP Header Slotted Header 2 Level Wrapost Tail Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max |
Original |
C36000) C/885 2002/95regulation | |
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Contextual Info: Product Number: 153-10-632-00-001000 Description: DIP Header Standard Header 3 Level Wrapost Tail Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C Qty. per Tube Mill-Max |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 134-10-632-00-050000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 142-90-632-00-593000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 90 Shell Plating: 200 " Tin/Lead 93/7 over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 134-10-632-00-000000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |
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Contextual Info: Product Number: 142-10-632-00-594000 Description: DIP Header Interconnect Open Frame Through Hole Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins A B C L Qty. per Tube Mill-Max Part Number 32 1.6 |
Original |
C36000) C/885 2002/95Annex | |