B 2003 Search Results

ansi-j-std-006 a solder wire

Abstract: ansi-j-std-006 RPIP-824-00 J-STD-004 solder wire rom1 raychem termination kit J-STD-004 J-STD-006 B-155-2002 Sn42Bi58 Raychem termination kit procedure
Contextual Info: SPECIFICATION CONTROL DRAWING Product Revision Product Name Kit Sub-assemblies B-155-2001 B-155-2002 B-155-2003 B-155-2001-A A B-155-2001-B A B-155-2002-A A B-155-2002-B A B-155-2003-A A B-155-2003-B A Product Dimensions øA C L min max max 2.2 [0.085] 2.9

Contextual Info: P#9156R1_232PTC9-0812 - 1/2 B&B ELECTRONICS 2003 by B&B Electronics. All rights reserved. Model: 232PTC9 RS-232 Two-Port Combiner Introduction B&B Electronics’ Model 232PTC9 permits two or more serial devices to share a serial port on a host computer. When

Contextual Info: Uniti m P—TSDPC2M4/40—400—0.80C 10 13 22 18, 81 MAX 18, 41 ±0, 1 S S S S S O T B B B fOTT x +i o c OJ IO —'O ? in 1 Q=B=Q=fl=fl=fl=B=B=B=BZ in o o +i n. 5±o. 1 Nov,2003

rs232 bar code scanner

Abstract: 232PTC9 232PS
Contextual Info: B&B ELECTRONICS PRODUCT INFORMATION 232PTC9-5003 - 1/2 2003 by B&B Electronics. All rights reserved. Model: 232PTC9 CE RS-232 Two-Port Combiner Introduction B&B Electronics’ Model 232PTC9 permits two or more serial devices to share a serial port on a host computer. When

Contextual Info: IC INFORMATION NJM4580MD Function Op Amp Bipolar Type B OUTPUT 6 B -INPUT 5 B +INPUT + V+ 7 A GM-8337ZZT/E 8 2 A -INPUT 1 A OUTPUT Model J 1/1 E A +INPUT 3 V- 4 + B 2003.1

MO-217

Abstract: 132A-1
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm x B D b1 SOT560-1 v M C A B w M C ball A1 index area v M C A B w M C b b3 E v M C A B w M C b2 v M C A B w M C

HBCC24

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC24: plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm b1 x B D SOT564-1 v M C A B w M C v M C A B w M C b ball A1 index area b3 E v M C A B w M C b2 v M C A B w M C

HBCC16

Abstract: SOT639-2 sot639
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C v M C A B w M C

Contextual Info: 232SPHI4-0812 -1/2 2003 by B&B Electronics. All rights reserved. B&B ELECTRONICS Model 232SPHI4 High-Speed Port-Powered RS-232 Optical Isolator The Model 232SPHI4 isolates and protects RS-232 equipment from lightning surges, accidental high voltage shorts,

93lc46b1

Abstract: 93cxx C46B DS21929 A56A A86C L46B 93AA86A A-56-B 93AA86B
Contextual Info: 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 1K-16K Microwire Compatible Serial EEPROMs Features: Description: • Densities from 1 Kbits through 16 Kbits

93XX66B

Abstract: 93C46x l46c sot 86 marking CODE e3 93C86C 93AA86B 93AA86C
Contextual Info: 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 1K-16K Microwire Compatible Serial EEPROMs Features: Description: • Densities from 1 Kbits through 16 Kbits

processor

Abstract: surround amplifier 3d surround sound Audio Spectrum Analyzer Dolby B dolby C audio surround sound 3D surround processor Dolby NR
Contextual Info: DISCONTINUE PRODUCTS Mar.2003 Type No. Function NJM2063 Dolby B-Type NR Processor NJM2065 Dolby B/C-Type NR Processor NJM2065A Dolby B/C Type Noise Reduction Processor NJM2066 Dual Head Phone Driver Amplifier NJM2075A Dolby B/C Type NR Processor NJM2106 Active Bass Expander

k4h510438b-gccc

Abstract: DDR333 DDR400 k4h510838
Contextual Info: DDR SDRAM 512Mb B-die x4, x8, x16 Preliminary DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60Ball FBGA Revision 0.0 Rev. 0.0 September. 2003 DDR SDRAM 512Mb B-die (x4, x8, x16) Preliminary DDR SDRAM 512Mb B-die Revision History Revision 0.0 (September, 2003)

Contextual Info: IS32WV16100A/B IS32WV16200A/B ISSI 1M x 16 16-MBIT , 2M x16 (32-MBIT) PSEUDO STATIC RAM ADVANCED INFORMATION JANUARY 2003 FEATURES DESCRIPTION • Access time: 70ns The ISSI IS32WV16100A/B and IS32WV16200A/B are high-performance CMOS Pseudo Static RAM organized as

processor

Abstract: NJM2063 NJM2065 NJM2065A NJM2066 NJM2075A NJM2151 NJM2160 NJM2175 NJM2185
Contextual Info: DISCONTINUE PRODUCTS May.2003 Type No. Function NJM2063 Dolby B-Type NR Processor NJM2065 Dolby B/C-Type NR Processor NJM2065A Dolby B/C Type Noise Reduction Processor NJM2066 Dual Head Phone Driver Amplifier NJM2075A Dolby B/C Type NR Processor NJM2106 Active Bass Expander

485DRC

Abstract: 485LDRC dipswitch tda 4800 DIN 8 rs232 RS485 optical baud rate converter
Contextual Info: B&B ELECTRONICS PRODUCT INFORMATION Integrate – Expand – Simplify 485LDRC-4003-1/3 2003 by B&B Electronics. All rights reserved. Models 485DRC and 485LDRC Industrial DIN Rail Mounted Optically Isolated RS-232 to RS-422/485 Converters 485DRC With Surge Suppression

93cxx

Abstract: L66C pic 93Cxx l46A TSSOP-6 a86a 93C46x l86a L46C A56A
Contextual Info: 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 1K-16K Microwire 串行 EEPROM 特征： 概述： • 容量从 1 Kb 到 16 Kb

93CXX

Abstract: l46a 93lc46b1 L46C l86a eeprom 93cxx C04-120 MC 342 transistor MC 139 transistor C66A
Contextual Info: 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C 1K~16K 용량의 마이크로 와이어 직렬 EEPROMs 특징 : 기능 설명 :

38436

Contextual Info: I SL 9 L80£0PS 'ON QN I MVÜQ -é -HÆIH %-n B REV. D E S I G N A T I O N M M 3 0 - 1 ^ U S ER IES 4 4 B * CONTACT PREFIX ]$£ -M-w/ NO. OF HEIGHT B : L0W 2 9 . JU 1. 1996 38436 6 . F e b . 1997 39531 CHANGED 1 7 . F e b . 1998 41 5 3 7 ADDED 1 4 . F e b . 2003

Contextual Info: DDR400 SDRAM 512Mb B-die FBGA x4, x8, x16 DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60Ball FBGA Revision 1.2 November, 2004 Revision 1.2 November, 2004 DDR400 SDRAM 512Mb B-die FBGA (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (September, 2003)

DDR266

Abstract: DDR333
Contextual Info: DDR SDRAM 512Mb B-die x4, x8 Preliminary DDR SDRAM 512Mb B-die DDR SDRAM Specification sTSOP(II) (400mil x 441mil) Revision 0.1 Rev. 0.1 Agust. 2003 DDR SDRAM 512Mb B-die (x4, x8) Preliminary DDR SDRAM 512Mb B-die Revision History Revision 0.0 (February, 2003)

Contextual Info: DDR SDRAM 512Mb B-die x4, x8 Preliminary DDR SDRAM 512Mb B-die DDR SDRAM Specification sTSOP(II) (400mil x 441mil) Revision 0.0 Rev. 0.0 Feb. 2003 DDR SDRAM 512Mb B-die (x4, x8) Preliminary DDR SDRAM 512Mb B-die Revision History Revision 0.0 (February, 2003)

"Frequency Generators"

Abstract: CY25811 CY25812 CY25814 ASM3P2811
Contextual Info: September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 Low Power EMI Reduction IC Features FCC approved method of EMI attenuation. Provides up to 15dB EMI reduction. Generates a 1X, 2X and 4X low EMI spread spectrum clock of the input frequency. o 1X: ASM3P2811A/B

ddr266

Contextual Info: DDR SDRAM 512Mb B-die x4, x8, x16 DDR SDRAM 512Mb B-die DDR SDRAM Specification Revision 1.1 Rev. 1.1 August 2003 DDR SDRAM 512Mb B-die (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (February, 2003) - First version for internal review