AVANTEK UTO 544 Search Results

Avantek* UTC 524

Abstract: Avantek* UTO Avantek UTC5 Avantek UTC 518 avantek UTO 511 Avantek* UTC 2025 AVANTEK utc10 UTC572 Avantek* UTC-1023 Avantek UTC 519
Contextual Info: W ti3 % H E W L E T T W L'fiM P A C K A R D Avantek Products IF/RF Cascadable Amplifiers Selection Guide UTO Series UTC Series PPA Series Description HP UTO/UTC/PPA cascadable amplifiers are offered in TO-8 packages, TC-1 connectorized cases, and surface-m ount

Contextual Info: Thal LETT mL'HMHEW PACKARD Avantek Products Thin-Film Cascadable Amplifier 10 to 500 MHz Technical Data UTO/UTC/PPA 544 Series Features Description Applications The 544 Series is a thin-film RF bipolar amplifier using lossless feedback for optimum noise figure

SN62PRMAB3

Contextual Info: H Avantek Products Thin-Film Cascadable Amplifier 10 to 500 MHz Technical Data UTO/UTC/PPA 544 Series Features Description Pin Configuration • Frequency Range: 10 to 500␣MHz The 544 Series is a thin-film RF bipolar amplifier using lossless feedback for optimum noise figure

avantek uto 544

Contextual Info: Whot H EW LETT mLtim PACKARD Avantek Products Thin-Film Cascadable Amplifier 10 to 500 MHz Technical Data UTO/UTC/PPA 544 Series Pin Configuration Features Description • Frequency Range: 10 to 500 MHz The 544 Series is a thin-film RF bip o lar am plifier using lo ssless

CA850

Abstract: AVANTEK utc transistor 16299 avantek uto 544 AVANTEK TO-8 Avantek amplifier UTC AVANTEK utc 544 Avantek rf amplifier
Contextual Info: AVANTEK Q a MME INC v a n t e D • llMl'ibt. □ Ü Ü Ö Ü 0 7 4 U T O /U T C /P P A 54 4 S eries T h in -F ilm C a sc ad ab le A m p lifie r 10 to 500 M H z •• • k FEATURES APPLICATIONS • • • • • System Front Ends • IF/RF Amplification

UTC2025

Abstract: UTC5-210 AVANTEK utc 211 Avantek UTC 1023 UTC-101-1 Avantek rf AVANTEK utc 544 UTC20-211 avantek utc5 avantek utc 10-220
Contextual Info: Q IF/RF Amplifiers Selection Guide avantek PRODUCT DESCRIPTION S i o r G a A s M M IC s a n d d is c re te c o m p o n e n ts on a lu m in a s u b ­ A v a n te k U T O /U T C /P P A c a s c a d a b le a m p lifie rs is o ffe re d in T O - 8 p a c k a g e s , T C -1

RCA SK CROSS-REFERENCE

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Contextual Info: 1969 o < 00 x ic e uo <r\ *—4 rO O CM u J 'r < o o o CO r aJ. rfrr.~> y -< z X— < P“ -J Sem iconductor Annual At .0008" Dia. . . . there is no second source phire orifice insert. Tempress also created and supplied the tungsten carbide ultrasonic bonding tool and pioneered