ASTRON 15 PIN Search Results

Contextual Info: REV. A B n oo o DESCRIPTION RELEASE 03*1056 DATE Jun 26. 2003 Oct 31, 2003 -4 2 .5 4 5 [1.675]- r~v'3 5 PIN 1 PIN ‘V # 3 4 PIN- \ # 6 8 PIN-a ' u s IO M- to A -4 4 .4 0 [1 .7 48]-4 7 .4 0 [1.866]- 13 00 Tv- CD tO CM o o o o — 0.30 ftg;i| [-0 1 2 ± ;gg|]

Contextual Info: REV. DESCRIPTION DATE Hay 15, 200C RELEASE — i 2 MATERIALS 1. HOUSING : F.B.T. CUL 9 4 V - 0 . 2. TERMINAL : COPPER ALLOY. 3. SHELL : STEEL. SPECIFICATION 1. CURRENT RATING : 5 AMP. MAX. 2. DIELECTRIC WITHSTANDING VOLTAGE : 1000V AC R.M.S. FDR ONE MINUTE.

Contextual Info: REV. DES C R IP TIO N — DATE RELEASE MATERIA L M O DIFT A p r, 0 1 , 2D 02 A p r. 0 9 , 2D 02 z MATERIALS 1. HOUSING : THERMOPLASTIC UL 9 4 V - 0 . 2. TERMINAL : COPPER ALLOY. (t=0.30mm) 3. SHELL : STEEL 4. GROUNDING BOARDLOCK ; COPPER ALLOY, TIN PLATING,

Contextual Info: REV. A B C D E F 6 ORDERING INFORMATION 6110018-001 1# PIN -18# PIN SERIES CODE n — SOLDER - FEMALE - FOLLOW NUMBER 3 # PIN 2 # PIN — •CONTACT PLATING: 0 : GOLD -8.0 [.31]2.30 [.091]- V b / t Dec 17,2003 Jun 04,2004 Nov 30,2004 Jan. 27,2005

Contextual Info: 1# PIN REV. A B C D E F G H ORDERING INFORMATION 61 0 0 2 4 -0 0 1 24# PIN SE R IE S CODE J FOLLOW NUMBER -CONTACT PLATING: 0: GOLD FLASH SOLDER FEMALE 3# PIN ECN NO. 02*0620 02*0723 02*0955 02*1106 03*0325 03*1220 04*0610 04*1133 Jun Jul Sep Nov Mar Dec Jun

Contextual Info: 8 REV. 22# PIN 1# PIN ORDER INFORMATION 3 # PIN 6 1 1 0 0 2 2 -X 0 1 -R J SERIES CODE­ SOLDER — I FEMALE — NUMBER OF POSITIONS L ,ROHS 2 # PIN - • -FOLLOW NUMBER — CONTACT PLATING: 0: GOLD FLASH 2: GOLD PLATED ECN NO. - RELEASE DATE Jul 18.2002 B

Contextual Info: REV. — DESCRIPTION DATE RELEASE Apr. 15, 2001 i 2 MATERIALS 1. HOUSING : THERMOPLASTIC UL 94V-0 , BLACK. 2. TERMINAL ; PHOSPHOR BRONZE. (t=0.30mm) 3. SHELL : STEEL, NICKEL PLATING. SPECIFICATION 1. CURRENT RATING ; 1 AMP. MAX. 2. DIELECTRIC WITHSTANDING VOLTAGE :

astron

Contextual Info: REV. DESCRIPTION DATE — RELEASE Oct 31, 20D2 1 S H E L L P L A T IN G M O D IFY Jan. 17, 2003 11, 2D03 2 DRAW MODIFY DRAW MODIFY *pr. OB, 2003 J DRAW MODIFY 4ug. 02, 20D3 4 MATERIALS 1. HOUSING : HI.-TEM P. PLASTIC UL 9 4 V - 0 , BLACK. 2. TERMINAL : COPPER ALLOY,

Contextual Info: REV. DESCRIPTION DATE — RELEASE Dec, 27, 2QD1 i DRAW MODIFY Jun. 07, 200 5 2 MATERIALS 1. HOUSING : POLYESTER (UL 9 4 V - 0 . BLACK. 2. TERMINAL : PHOSPHOR BRONZE. SILVER PLATING. 3. CENTER GROUNDING : BRASS. NICKEL PLATING. (t= 0 .4 0 m m ) SPECIFICATION

Contextual Info: REV. D E S C R I P T IO N — i RELEASE M A T E R IA L M O D IF Y DATE M ay 15, Jun. 1, 2000 2001 2 MATERIALS 1. HOUSING : THERMOPLASTIC UL 9 4 V -0 , BLACK. 2. TERMINAL : COPPER ALLOY. (t=0.30mm) 3. SHELL : ZINC ALLOY, NICKEL PLATING. SPECIFICATION 1. CURRENT RATING : 1 AMP. MAX.

Contextual Info: REV. DESCRIPTION DATE — RELEASE DRAW MODIFY Apr. 17, 2DOJ Apr. 21 , 2 X>5 i 2 RECOMMEND P.C.B. LAYOUT TOP VIEW MATERIALS 1. HOUSING : POLYESTER (U L 9 4 V - 0 . 2 . TERMINAL ; COPPER ALLOY. 3 . SHELL : STEEL SPECIFICATION 1. CURRENT RATING ; 5 AMP. MAX.

Contextual Info: REV. DESCRIPTION DATE RELEASE Dec, IB, 2001 Jan. 2 5 , 2D02 — i P /N MODIFY 2 MATERIALS 1. 2. 3. 4. HOUSING : THERMOPLASTIC UL 9 4 V - 0 . TERMINAL : COPPER ALLOY. ( t= 0 ,3 0 m m ) SHELL : STEEL. GROUNDING BOARDLOCK : BRASS, TIN PLATING. SPECIFICATION

Contextual Info: J _ : REV. — i 2 -15 .2 [.5 9 8 ]-14.Q [.5 5 1 ]- DESCRIPTION RELEASE DRAW MODIFY DATE 5tp. 1&F 2002 Jan. 02. 2003 MATERIALS 1. 2. 3. 4. 5. HOUSING : POLYESTER UL 9 4 V - 0 , BLACK. TERMINAL : PHOSPHOR BRONZE. TERM INAL(#9) : PHOSPHOR BRONZE, TIN PLATING.

Contextual Info: REV. DESCRIPTION DATE - RELEASE Feb 1 8. 2 003 B 0 3 '0 5 2 2 May 12. 2 003 C 0 3 '1 0 5 6 O ct 3 1 , 2003 -0.30'.+0.15 '-0.05 [-0 1 2 ± ;§ g |] #34PIN. #68PIN CD i 1.65 [.065]— 3.30 [.130]— MATERIALS: o o 1. HOUSING: H I-T E M P PLASTIC UL 2. TERMINAL: COPPER ALLOY,GOLD

Contextual Info: REV. — i D E S C R I P T IO N RELEA5E M A T E R IA L M O D IF Y DATE M <jy 15, Jun. 1, 2 0 Q 1 20DD 2 MATERIALS 1. HOUSING l THERMOPLASTIC UL 9 4 V -0 , BLACK. 2. TERMINAL : COPPER ALLOY. (t= 0 .3 0 m m ) 3. SHELL : ZINC ALLOY, NICKEL PLATING. SPECIFICATION

Contextual Info: REV. -A ± 0 .3 8 [.0 1 5 ]- B - C - - # 4 - 4 0 U N C -4 DESCRIPTION DATE RELEASE Jun, 27, 2000 J u n . 1 . 2D01 — MATERIALS i 1. HOUSING : P.B.T. UL 9 4 V - 0 . P /N MODIFY 2 2. TERMINAL : COPPER ALLOY.

100nF 10 50V X7R 0603

Abstract: Ceratech HH-1T2012-251 ceramic capacitor, .1uF MARK N2 SOT23-6 HH1T WPBH-T2012-251T N2 SOT23-6 C3216X7R1H105K MAX5943AEEE
Contextual Info: Maxim > App Notes > CIRCUIT PROTECTION HOT-SWAP AND POWER SWITCHING CIRCUITS Keywords: FireWire, IEEE-1394, UL, UL-recognized, MAX5943A, MAX5944, protective, protection, protective-circuit Feb 08, 2007 APPLICATION NOTE 3984 UL Recognized, IEEE 1394 Single- and Dual-Port FireWire Protective Circuits

MPC8240

Abstract: MPC8245 MPMC8245 39293206 20 pin
Contextual Info: Application Note AN2207/D Rev. 0, 12/2001 Using the MPMC8245 Card in Standalone Mode Gary Milliorn CPD Applications This document describes modifications that may be performed to convert the MPMC8245 “Unity” MPMC card in a Sandpoint/MPMC8245 system to standalone operation. The MPMC

idc10 connector datasheet

Abstract: transistor h5c idc10 AN2207 MPC8240 MPC8245 MPMC8245
Contextual Info: Freescale Semiconductor Application Note Document Number: AN2207 Rev. 2, 09/2006 Using the MPMC8245 Card in Standalone Mode by Gary Miiliorn CPD Application Freescale Semiconductor, Inc. Austin, TX This application note describes the modifications performed

idc10 connector datasheet

Abstract: transistor h5c IBM motherboard schematics motorola SEMICONDUCTOR APPLICATION NOTE POWER AMP MPC8240 MPC8245 MPMC8245 Motorola MPMC Schematics DINK32
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2207/D Rev. 2, 6/2003 Freescale Semiconductor, Inc. Using the MPMC8245 Card in Standalone Mode Gary Milliorn CPD Applications This application note describes modifications that may be performed to convert the

VULCAN-533-M64-F32

Abstract: IXP425 pin diagram of intel ixp425 processor RTC DS1302 Arcom Control Systems SBC GOLDCAP capacitor SUYIN Connector usb SUYIN RJ45 IXP425 mips molex IDC header connector
Contextual Info: VULCAN Intel IXP425 XScale based PC/104 Single Board Computer Technical Manual www.arcom.com VULCAN Technical Manual Definitions Arcom is the trading name for Arcom Control Systems Inc and Arcom Control Systems Ltd. This product was known as the MERCURY until 30th June 2005. The internal numeric product codes used to identify this

inverter ups pcb service manual

Abstract: i2c ds1307 PXA255 VIPER-400-M64-F32 VIPER-400-M64-F32-I ds1307 rtc VIPER 22 LED DRIVER PXA255 Single Board Computer 800X600 TI34
Contextual Info: VIPER VIPER Intel PXA255 XScale RISC based PC/104 Single Board Computer Technical Manual www.arcom.com Contents VIPER Contents Definitions Arcom is the trading name for Arcom Control Systems Inc and Arcom Control Systems Ltd. Disclaimer The information in this manual has been carefully checked and is believed to be accurate. Arcom assumes no responsibility

VIPER-400-M64-F32-I

Abstract: LVDS connector 20 pins LCD FUJITSU inverter ups pcb service manual VIPER-400-M64-F16 LVDS connector 40 pins LCD FUJITSU 17 VIPER-400-M64-F32 advanced VIPER LCD Display TI-34 LCD cable SDCFB-32
Contextual Info: VIPER VIPER Intel PXA255 XScale RISC based PC/104 Single Board Computer Technical Manual www.arcom.com VIPER Arcom is the trading name for Arcom Control Systems Inc and Arcom Control Systems Ltd. The information in this manual has been carefully checked and is believed to be accurate. Arcom assumes no responsibility

SCHEMATIC DIAGRAM OF WIFI RF POWER TRANSISTOR

Abstract: SCHEMATIC DIAGRAM OF 2.4 GHZ WIFI RF POWER wifi booster schematic simple fm transmitter mini project report for engineering students Wifi Booster Circuit Diagram wifi signal booster schematic smd-transistor DATA BOOK 2.4 ghz FM wifi RECEIVER CIRCUIT DIAGRAM fm transistor radio mini project 2.4 ghz 2 WATTS POWER AMPLIFIER SCHEMATIC DIAGRAM
Contextual Info: APRIL2008 ALSO PUBLISHED ONLINE: www.highfrequencyelectronics.com NEW SYNTHESIZED SIGNAL GENERATOR OFFERS LOW COST, HIGH VALUE INSIDE THIS ISSUE: Transmission Lines on Ion-Implanted Silicon Wafers Spatial Combining of Microwave Noise Radiators Tutorial—Performance Capabilities of Antenna Arrays