ASTM D374 Search Results

Contextual Info: Bond-Ply 660P Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape Features and Benefits Configurations Available: Polyimide Film Polyimide Film — Thickness inch / (mm) 0.008 0.203 ASTM D374 Glass Transition (°F) / (°C) TEST METHOD

Contextual Info: DC0036/01/PC99-0.06 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99 Unit Tolerance Test Method Colour Yellow - - Visual Thickness 0.06 mm - ASTM D374

Contextual Info: DC0037/01/PC99-0.06 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99 Unit Tolerance Test Method Colour Yellow - - Visual Thickness 0.06 mm - ASTM D374

Contextual Info: DC0038/01/PC99-0.06 Die Cut PCM Relay Pad Features Low thermal resistance Natural tack Applications Relay Pad REACH Compliant Properties RoHS Compliant Property PC99 Unit Tolerance Test Method Colour Yellow - - Visual Thickness 0.06 mm - ASTM D374 Phase Change Softening Point

Contextual Info: DC0037/01/PC99AL-0.10-0.1 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

Contextual Info: DC0041/01/PC99AL-0.10-0.1 Die Cut PCM Resistor Pad Features Low thermal resistance Natural tack Applications Resistor Pad REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

Contextual Info: DC0036/01/PC99AL-0.10-0.1 Die Cut PCM Rectifier Bridge Features Low thermal resistance Natural tack Applications Rectifier Bridge REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

Contextual Info: DC0040/01/PC99AL-0.10-0.1 Die Cut PCM SCR Darlington Module Features Low thermal resistance Natural tack Applications SCR Darlington Module REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374

bergquist

Abstract: astm D149 ASTM-D-3386 D149 BP100 D1002 D374 D412
Contextual Info: Bond-Ply 100 Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape Features and Benefits Fiberglass Fiberglass — 0.005, 0.008, 0.011 0.127, 0.203, 0.279 ASTM D374 Temp. Resistance, 30 sec. °F / (°C) 392 200 — Elongation (%45° to Warp & Fill)

Contextual Info: DC0041/01/PC99-0.06 Die Cut PCM Resistor Pad Features Low thermal resistance Natural tack Applications Resistor Pad REACH Compliant Properties RoHS Compliant Property PC99 Unit Tolerance Test Method Colour Yellow - - Visual Thickness 0.06 mm - ASTM D374 Phase Change Softening Point

Contextual Info: DC0038/01/PC99AL-0.10-0.1 Die Cut PCM Relay Pad Features Low thermal resistance Natural tack Applications Relay Pad REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374 Total Mass Loss

Contextual Info: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

Contextual Info: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: Li-2000 Thermal Tape on rolls Features Good adhesion Low contact thermal impedance High thermal conductivity High bond strength High temp-long term stability Electrically insulating Applications Electronic components: IC / CPU / MOS / LED / M/B / P/S / Heat Sink

Contextual Info: Ti900 Thermally Conductive Insulators on rolls Features High Insulation Strength Low thermal resistance Easy to assemble Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,

Contextual Info: Li-2000A Thermal Tape on rolls Features Good adhesion Low contact thermal impedance High thermal conductivity High bond strength High temp-long term stability Electrically insulating Applications Electronic components: IC / CPU / MOS / LED / M/B / P/S / Heat Sink

Contextual Info: H48-6S Thermal Conductive Pad Features Very good thermal conductivity Very soft and compressible Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6G Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: L37-3 Thermal Conductive Pad on rolls Features Good thermal conductivity Ultra soft and high compresibility Natural tack Easy to assemble Good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6G Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6C Thermal Conductive Pad Features Very good thermal conductivity Very soft and compressible Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6 Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /