ASTM D2240, D412 Search Results

ASTM D2240, D412

Abstract: ASTM D2240 ASTM D412 MIL-A-46146 loctite 5145 D412 ASTM D412 for rubber D2240 MIL-46106 E1225
Contextual Info: Technical Data Sheet Product 5145 Worldwide Version, October 1995 PRODUCT DESCRIPTION LOCTITE Product 5145 is a non-corrosive, paste consistency, high strength, RTV silicone. When cured the elastomer resists weathering, moisture and ozone, and retains its flexibility up to 200°C. Meets requirements of

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

Contextual Info: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: H48-6S Thermal Conductive Pad Features Very good thermal conductivity Very soft and compressible Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6G Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: L37-3 Thermal Conductive Pad on rolls Features Good thermal conductivity Ultra soft and high compresibility Natural tack Easy to assemble Good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6G Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: GT20 High Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs

Contextual Info: TG2030 Ultra Soft Thermal Conductive Pad on rolls Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC - CPU - MOS LED - M/B - P/S - Heat Sink

ASTM D374

Abstract: ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374
Contextual Info: TG2030 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC - CPU - MOS LED - M/B - P/S - Heat Sink LCD-TV - Notebook PC - PC Telecom Device - Wireless Hub.etc.

Contextual Info: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: TG6050 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6C Thermal Conductive Pad Features Very good thermal conductivity Very soft and compressible Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6 Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6 Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6A Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: TG6050 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6A Thermal Conductive Pad Features Very good thermal conductivity Soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-6S Thermal Conductive Pad Features Very good thermal conductivity Very soft and compressible Natural tack Easy to assemble Very good insulator Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: L37-5 Thermal Conductive Pad Features Good thermal conductivity Ultra soft and high compresibility Natural tack Easy to assemble Good insulator Shock and vibration absorber Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: H48-2 Thermal Conductive Pad Features Good thermal conductivity Ultra soft and high compressibility Natural tack Easy to assemble Good insulator Shock and vibration absorber Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /