|
10118615-503003LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 3 Positions ,2.54mm (0.100in) Pitch. |
PDF
|
|
|
69155-030LF
|
|
Amphenol Communications Solutions
|
Quickie Slimline Header, Wire to Board connector, Through Hole, Right Angle, Double Row, 30 Positions, 2.54mm (0.100in) Pitch |
PDF
|
|
|
5962-8515503SA
|
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Texas Instruments
|
High-Performance Impact PAL Circuits 20-CFP -55 to 125 |
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|
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5962-85155032A
|
|
Texas Instruments
|
High-Performance Impact PAL Circuits 20-LCCC -55 to 125 |
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|
|
5962-8515503RA
|
|
Texas Instruments
|
High-Performance Impact PAL Circuits 20-CDIP -55 to 125 |
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