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    AN11113 Search Results

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    AN11113 Price and Stock

    IDEC Corporation

    IDEC Corporation NRAN1111-3A-AA

    CIRCUIT PROTECTOR 3A
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    DigiKey NRAN1111-3A-AA Bulk 1
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    Mouser Electronics NRAN1111-3A-AA
    • 1 $35.37
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    Newark NRAN1111-3A-AA Bulk 1
    • 1 $33.72
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    Master Electronics NRAN1111-3A-AA
    • 1 $27.03
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    Sager NRAN1111-3A-AA 1
    • 1 $28.48
    • 10 $26.29
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    IDEC Corporation NRAN1111-30A-AD

    CIRCUIT PROTECTOR 30A
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    DigiKey NRAN1111-30A-AD Bulk 1
    • 1 $39.38
    • 10 $39.38
    • 100 $39.38
    • 1000 $39.38
    • 10000 $39.38
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    Mouser Electronics NRAN1111-30A-AD
    • 1 $35.37
    • 10 $31.03
    • 100 $27.94
    • 1000 $27.12
    • 10000 $27.12
    		Get Quote
    Newark NRAN1111-30A-AD Bulk 1
    • 1 $33.72
    • 10 $33.72
    • 100 $27.76
    • 1000 $26.82
    • 10000 $26.82
    		Buy Now
    Master Electronics NRAN1111-30A-AD
    • 1 $27.03
    • 10 $24.12
    • 100 $21.48
    • 1000 $20.59
    • 10000 $20.59
    		Buy Now
    Sager NRAN1111-30A-AD 1
    • 1 $28.48
    • 10 $26.29
    • 100 $23.74
    • 1000 $23.74
    • 10000 $23.74
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    IDEC Corporation NRAN1111-3A-ED

    Circuit Breakers C.B. Obsolete No Replacement
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    Sager NRAN1111-3A-ED
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    IDEC Corporation NRAN1111-30A-EA

    Circuit Breakers C.B. Obsolete No Replacement
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    Sager NRAN1111-30A-EA
    • 1 -
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    IDEC Corporation NRAN1111-30A-ED

    Circuit Breakers C.B. Obsolete No Replacement
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Sager NRAN1111-30A-ED
    • 1 -
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    Find more AN11113 price and stock on Findchips.com

    AN11113 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: AN11113 LFPAK MOSFET thermal design guide - Part 2 Rev. 2 — 16 November 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, thermal vias, SMD, surface-mount,


    Original     		AN11113 AN10874) PDF

    Contextual Info: AN11113 LFPAK MOSFET 热设计指南 - 第二部分 修订版：2 — 2011 年 11 月 16 日 应用笔记 文档信息 项目 内容 关键字 LFPAKMOSFET、热分析、设计与性能、散热考虑、热阻、散热孔、SMD、 表面贴装， PCB 设计、密封壳体、底部冷却、顶部冷却。


    Original     		AN11113 AN10874ï PDF