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2SC6026MFV
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Toshiba Electronic Devices & Storage Corporation
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NPN Bipolar Transistor / VCEO=50 V / IC=0.15 A / hFE=120~400 / VCE(sat)=0.25 V / SOT-723 |
Datasheet
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65846-026LF
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Amphenol Communications Solutions
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PV® Wire-to-Board Connector System, Mini Latching, Double Row, 46 Positions, Polarized, 2.54 mm (0.100in) Pitch, Housing. |
PDF
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69916-026LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 60 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating. |
PDF
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90516-026
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Header,Through Hole, Double Row, 44 Positions, 2.00mm (0.079in) Pitch.. |
PDF
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10145226-0261P13LF
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Amphenol Communications Solutions
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DDR4 Memory Module Sockets, Storage and Server System, Through Hole, 288 Position, 0.85mm (0.033in) Pitch. |
PDF
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