AN-140 UNDERSTANDING LITELINK Search Results

tip 117 gyrator

Abstract: AN-147 clare PSTN DAA hybrid AN-117 circuit diagram of surge protector for data network AN-140 Understanding LITELINK single line telephone hybrid AN-140 CPC5602C CPC5610
Contextual Info: Understanding LITELINK II CPC5610 and CPC5611 Silicon DAA Application Note AN-140 1. Introduction This application note serves as a primer for designing with the Clare, Inc. LITELINK II Silicon Data Access Arrangement DAA . LITELINK II circuit functions are

BLM11A601S

Abstract: Jerald Graeme
Contextual Info: CPC5601 LITELINK Family Auxiliary Programmable Driver IC INTEGRATED CIRCUITS DIVISION Features Description • • • • The CPC5601 is a serially-programmed driver IC for use with IXYS Integrated Circuits Division’s LITELINK Silicon Data Access Arrangement DAA ICs. The

Contextual Info: CPC5601 LITELINK Family Auxiliary Programmable Driver IC Features • • • • Description Meets PC Card PCMCIA height requirements Zero standby current PCB real estate and cost savings Can be used with LITELINK II and LITELINK III parts Compliance

AN-147 clare

Abstract: SIDAC CPC5602C AN-140 equivalent diode S1ZB60 CPC5601 EN55022B TBR-21 380HB-221 S1ZB60
Contextual Info: CPC5601 LITELINK Family Auxiliary Programmable Driver IC Features • • • • Description Meets PC Card PCMCIA height requirements Zero standby current PCB real estate and cost savings Can be used with LITELINK II and LITELINK III parts Compliance

7493 IC

Abstract: ztx 483 rh-tx transistor ztx transistor code R74 68 1.5uF 140m CPC5601 Jerald Graeme
Contextual Info: CPC5601 LITELINK Family Auxiliary Programmable Driver IC Features Description • Meets PC Card PCMCIA height requirements • Zero standby current • PCB real estate and cost savings The CPC5601 is a serially programmed driver IC for use with Clare, Inc. LITELINK Silicon Data Access

SIZB60

Abstract: EN55022B TBR-21 AN-147 clare EN-55024 AN-140 Understanding LITELINK
Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with high power option, low noise, no automatic gain control circuit, and excellent part-to-part gain accuracy • Data access arrangement (DAA) solution for modems at

SIZB60

Abstract: brc1815 CPC5621ATR EN55022B TBR-21 AN-117 AN117 c151 Amp op AN-140 Understanding LITELINK IS-96
Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with high power option, low noise, no automatic gain control circuit, and excellent part-to-part gain accuracy • Data access arrangement (DAA) solution for modems at

Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise, excellent part-to-part gain accuracy, and no automatic gain control circuit • Transmit power of up to +10 dBm into 600 Ω • Data access arrangement (DAA) solution for modems at

SIZB60

Abstract: EN55022B TBR-21 AN-143 brc1815
Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with high power option, low noise, no automatic gain control circuit, and excellent part-to-part gain accuracy • Data access arrangement (DAA) solution for modems at

ring ferrite inductor design

Abstract: CPC5620 CPC5621 EN55022B brc1815
Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise, excellent part-to-part gain accuracy, and no automatic gain control circuit • Transmit power of up to +10 dBm into 600 Ω • Data access arrangement (DAA) solution for modems at

Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise, excellent partto-part gain accuracy, and no automatic gain control circuit • Transmit power of up to +10 dBm into 600 Ω • Data access arrangement (DAA) solution for modems at

Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise, excellent partto-part gain accuracy, and no automatic gain control circuit • Transmit power of up to +10 dBm into 600 Ω • Data access arrangement (DAA) solution for modems at

SIZB60

Abstract: TBR-21 ZTX A11 3000 pf 30 kv CPC5610 CPC5611 EN55022B AN117 CPC5602 TBR21
Contextual Info: CPC5610/CPC5611 LITELINK II Silicon Data Access Arrangement DAA IC Features • • • • • • • • • • • • • • • Description Full-duplex data and voice transmission Transformerless telephone line isolation interface Operates at all modem speeds, including V.90 (56K)

AN-117

Abstract: CPC5622
Contextual Info: CPC5622 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise and excellent part-to-part gain accuracy • 3 kVRMS line isolation • Simultaneous ringing detection and CID monitoring for worldwide applications

CPC5620

Abstract: S1ZB60 CPC5620A CPC5621 EN55022B TBR-21
Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise, excellent part-to-part gain accuracy • 3 kVrms line isolation • Transmit power of up to +10 dBm into 600 Ω • Data access arrangement (DAA) solution for

Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise, excellent part-to-part gain accuracy • 3 kVrms line isolation • Transmit power of up to +10 dBm into 600 Ω • Data access arrangement (DAA) solution for

AN-117

Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise, excellent part-to-part gain accuracy • 3 kVrms line isolation • Transmit power of up to +10 dBm into 600 Ω • Data access arrangement (DAA) solution for

Contextual Info: CPC5622 LITELINK III Phone Line Interface IC DAA Features Description • Superior voice solution with low noise and excellent part-to-part gain accuracy • 3 kVRMS line isolation • Simultaneous ringing detection and CID monitoring for worldwide applications

IPC-9502

Abstract: ZTX 351 CPC5620
Contextual Info: CPC5620/CPC5621 RMS 3kV Isolation LITELINK III Phone Line Interface IC DAA Features LITELINK III is a single-package silicon phone line interface (PLI) DAA used in voice and data communication applications to make connections between host equipment and telephone networks.

IPC9502

Abstract: IPC-9502
Contextual Info: CPC5620/CPC5621 RMS 3kV Isolation LITELINK III Phone Line Interface IC DAA Features LITELINK III is a single-package silicon phone line interface (PLI) DAA used in voice and data communication applications to make connections between host equipment and telephone networks.

Contextual Info: CPC5620/CPC5621 LITELINK III Phone Line Interface IC DAA INTEGRATED CIRCUITS DIVISION Features Description • Superior voice solution with low noise, excellent part-to-part gain accuracy • 3 kVrms line isolation • Transmit power of up to +10 dBm into 600 

BRR76

Abstract: CPC5622
Contextual Info: CPC5622 LITELINK III Phone Line Interface IC DAA INTEGRATED CIRCUITS DIVISION Features Description • Superior voice solution with low noise and excellent part-to-part gain accuracy • 3 kVRMS line isolation • Simultaneous ringing detection and CID monitoring

CPC5622A

Abstract: CPC5622 schematic diagram ac-dc converter full wave schematic diagram washing machines VOIP phone schematic EN55022B TBR-21 AN-117 CPC5622ATR AN117
Contextual Info: CPC5622 RMS 3kV Isolation LITELINK III Phone Line Interface IC DAA Features • Embedded modems for POS terminals, automated banking, remote metering, vending machines, security, and surveillance • Superior voice solution with low noise and excellent

LCA717

Abstract: 0-10v to 4-20ma cpc9909 IX2127 PM1206 en50130-4 CPC1020 CPC1002N deutsch relays inc 35v, 1amp smps circuits
Contextual Info: Clare, a wholly owned subsidiary of IXYS Corporation, located 20 miles north of Boston, Massachusetts, USA, designs, manufactures, and markets a wide variety of semiconductor devices. Clare’s wafer fabrication facility features a 600V BCDMOS process on a bonded-wafer, silicon-on-insulator, trench-isolated