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    AN-1107 Search Results

    AN-1107 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    98401-107-08LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 08 Positions, 2.54mm (0.100in) Pitch. PDF
    54121-107151050LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch. PDF
    10114829-11107LF
    		Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 7 Positions PDF
    54121-107031050LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. PDF
    54121-107030800LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. PDF

    AN-1107 Datasheets (2)

    Select Manufacturer
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    AN1107
    		Freescale Semiconductor Understanding RF Data Sheet Parameters Original PDF 655.73KB 16
    AN1107
    		Motorola AN1107 Application Note Understanding RF Data Sheet Parameters Original PDF 247.36KB 17