AMCO TEC INTERNATIONAL Search Results

COLOR t

Contextual Info: SD / MMC Case. Series NOTE: 1.METRIAL:PP AMCO How To Order ANTISeries Number 9 7 1 Type Number 1 . AMCO STATIC N N : Without Y : With Plastic Color T T:TRANSPARENT U:BLUE AMCO TEC INTERNATIONAL INC.

AMCO Tec International

Contextual Info: 440 Series DVI Conn. Series METRIAL: 1.HOUSING:THERMPOPLASTIC PBT GLASS FILLED NATURAL UL94V-0. 2.CONTACT : PHOSPHOR BRONZE. 3.SHELL : ZINC, NICKEL PLATED. 4.BOARDLOCK : COPPER ALLOY , TIN PLATED. ELECTRICAL : 1.RATED : 1.5A AT 40V AC ms . 2.INSULATION RESISTANCE : 1000 MEGOHMS MIN.

Contextual Info: CF Card 50Pin Receptacle . Material: Housing Material : LCP UL94V-0 Contact Material : Brass C268OR-EH Mount Ear : Brass (C268OR-H) , Tin Plated. Contact Pltaing : Gold Flash Plating Over 40u" Nickel. Solder Plating : 100u" Tin Plating Over 40u" Nickel Male

Contextual Info: CF Card 50PinConn . Material: Housing Material : LCP UL94V-0 Contact Material : Phosphor Bronze Color : Black Finsh: Contact : Nickel 50u" Min . Plated All Over Tin-Lead 100u"Min. Plated in Solder Area Au 2u" Min. Over Pd-Ni 30u" Min in Contact Area. Female

mini USB B 5pin

Abstract: S6 mark MARK 4B Mini USB B 5pin SMT mini USB A 5pin contact
Contextual Info: Mini USB 640- 4B Series SHELL B Type AMCO View A -A' Recommened PCB LAYOUT SC 2 : 1 //Vie w A -A' How To Order Series Number 6 4 Single Port SMT Type Number of Contacts Shell Type 5 B 4Pin 5Pin A B C D . AMCO Contact Plate S 1 S1 : Gold Flash S2 : 3u"Gold

PBT GF15

Abstract: Ultrasonic welding circuit ULTRASONIC Datasheet Hirose modem ultrasonic
Contextual Info: PC Card Frame Kit Shell Material : Stainless Steel Frame Material : PBT UL94V-0 Color : Black Note : Lan or Modem 15Pin Conn Apply Honde & Hirose How To Order Series No. P C C 50Pin Connector Pitch=1.27mm Thinkness 1 1:3.3mm 2:5.0mm Mounting Type Type Number

Contextual Info: 403/D-SUB solder Type MATERIAL: 1.CONTACT HOUSING : PBT + 30% GLASS FIBER UL 94V-0 , COLOR : WHITE. 2.CONTACT : BRASS. SPECIFICATION: 1.CURRENT RATING : 5 AMP. 2.CONTACT RESISTANCE : 30 MILLIOHMS MAX. AT DC 100mA. 3.INSULATOR RESISTANCE : 1000 MEGOHMS MIN. AT DC 500V.

pillar

Contextual Info: 210/ATX MATERIAL: 1. INSULATOR : NYLON 66 UL 94V-0. 2. CONTACT : PHOSPHOR BRONZE. 3. CONTACT PLATED : TIN OVER NICKEL. ELECTRICAL: 1. CURRENT RATING : 9 AMPS PER CIRCUIT MAX. 2. WITHSTANDING VOLTAGE : AC 600 V RMS. 3. CONTACT RESISTANCE : 10 MILLIOHMS MAX.

H4 94V-0

Contextual Info: 430/D-Sub Dual Port Type MATERIAL: 1. INSULOTOR : PBT +30% GLASS FIBER UL 94V-0 . 2. CONTACT : BRASS. 3. CONTACT : G/F OVER NICKEL. 4. SHELL : STEEL NICKEL PLATED. ELECTRICAL SPECIFICATION: 1. CURRENT RATING : 1 AMP. 2. DIELECTRIC WITHSTANDING VOLTAGE : 1000V AC.

Contextual Info: _11_ 10_ 8 REV ECN NO DESCRIPTION LOCATIONS DATE • fflK A Ê Â iE ïïH fi* DESIGN / 05 21'08 m m POM — RECOMMENDED PCB LAYOUT TOLERANCE:±0.05 -I § (§)(§) 2.45:+ 0.05 8 .2 ± 0 .1 0 (°D A § 0 .6 5 LO LO % L ei V ( ° D 4 .7 5 -0 .0 8 A r \ c /y t-O .O O

Contextual Info: _11_ 10_ 8 REV ECN NO DESCRIPTION LOCATIONS AO DATE DESIGN / 05 23*08 INITIAL RELEASE m m POM 8 .2 ± 0 .1 0 °D — RECOMMENDED PCB LAYOUT TOLERANCE:±0.05 -I (§ (§)(§) 2.45:+ 0.05 A § 0 .6 5 LO 0 =D b LO % Lei V 4 .7 5 5.9REF -A —0.0 8 C3T)

Contextual Info: _11_ 10_ 8 REV ECN NO DESCRIPTION LOCATIONS DATE • fflK A Ê Â iE ïïH fi* DESIGN / m m 05 21'08 POM 8.2±0.10 °D — RECOMMENDED PCB LAYOUT TOLERANCE:±0.05 -I A § (§ (§ )(§ ) 2.45:+ 0 .0 5 W fis ) 0 -6 3 0 .6 5 LO LO Lei - 0 .0 8 (29) -A r\ co+0.00 _ _

C5210H

Abstract: micro usb b C5210-H
Contextual Info: _11_ 10_ 8 REV ECN NO DESCRIPTION LOCATIONS DATE DESIGN m m / 05 21'08 POM oowv TYP*5 0 .2 4 ± 0 .0 3 2o W (§ )(§)(§) 2.45:+ 0 .0 5 TOLERANCE:±0.05 — I - 0 .0 8 (28) r \ c /y t-O .O O _ U -5 U - 0 .0 8 (2 9 )W ,+0.03 0.02 (30)W SECTION A - A N OTES

Contextual Info: _ _11 10_ 8 REV ECN NO DESCRIPTION LOCATIONS DATE DESIGN m m / 05 21'08 POM TYP*5 0.24±0.03 TOLERANCE:±0.05 — I -0 .0 8 r \ c /y t-O .O O 26 _ U -5 U - 0.0 8 (2 7 ) W ,+0.03 0.02 (28)W SECTION A - A N OTES 1. : MATERIA L M O L D IN G : L C P + 3 0 % G F ; C O L O R , B L A C K .

Contextual Info: 650/IEEE 1394 MATERIALS : 1. HOUSING : PBT UL 94V-O RATED 2. SHELL : COPPER ALLOY OR STEEL. 3. CONTACT : BRASS. PLATING : 1. SHELL : 150u" MIN TIN OVER 50u" NICKEL. 2. CONTACT : 20u" Pd/Ni 2u" AU. ELECTRICAL : 1. RATED VOLTAGE : 30V AC R.M.S . 2. RATED CURRENT : 1A / CONNTACT.

Contextual Info: _11_ 10_ 8 REV ECN NO DESCRIPTION LOCATIONS AO DATE DESIGN m m / 05 23*08 INITIAL RELEASE POM TYP*5 0 .2 4 ± 0 .0 3 2o W (§ )(§)(§) 2.45:+ 0.05 TOLERANCE:±0.05 — I - 0 . 0 8 (28) r \ c /y t-O .O O _ U -5 U - 0.0 8 (2 9 ) W ,+0.03 0.02 (30)W SECTION A - A

Contextual Info: _11_ 10_ 8 REV ECN NO DESCRIPTION LOCATIONS DATE • fflK A Ê Â iE ïïH fi* DESIGN / 05 21'08 m m POM 8 .2 ± 0 .1 0 °D — RECOMMENDED PCB LAYOUT TOLERANCE:±0.05 A I3=D -I (§ (§)(§) 2.45:+ 0.05 § 0 .6 5 LO b LO % —0.0 8 C3T) Lei V 4 .7 5

Contextual Info: 763/Modular Jack MATERIAL: 1. HOUSING : P.B.T. POLYESTER UL 94V-0 MIXED GLASS FIBER. STANDARD COLOR : BLACK. 2. CONTACTS : 0.35mm THICKNESS PHOSPHOR BRONZE, UNDER PLATED NICKEL ALL OVER, GOLD PLATED IN CONTACT AREA, TIN-LEAD IN SOLDER AREA. 3. SHIELDED : SUS301 STAINLESS, BRIGHT TIN-LEAD PLATED.

Contextual Info: 765/Modular Jack 765. MODULAR JACK Series No. 1 2 3 7 6 5 4 Style 5 A Number ofNo. of Ground Positions Contacts Type 6 7 8 8 8 A No. of Port 9 1 1~9 Boardlock Type 10 P Housing Color 11 B P: Plastic Pin+ B: Black Contact Plated 12 13 S 1 A 6 2 N: None FRONT SHIELD

Contextual Info: 504/Mini Din Single Type MATERIAL : 1. HOUSING : THERMOPLASTIC PBT UL 94V-0. 2. CONTACT : PHOSPHOR BRONZE. 3. SHIELD : COPPER ALLOY. FINISH : 1. CONTACT : UNDER PLATED 50u" MIN. NICKEL ALL OVER 120u" MIN. TIN/LEAD IN SOLDERING AREA SELECTIVE GOLD PLATED IN CONTACT AREA.

T2140

Contextual Info: T 214 HDMI F R/A A TYPE DIP SH ELL W - L / K 2.6 W / O - F TYPE 2 NOTES: 9 .0 0 ± 0 .2 0 1. MATERIAL: HOUSING: LCP ,UL 9 4 V -0 , COLOR IN BLACK SHIELD: COPPER ALLOY PLATING: 5 0 u ” MIN. SOLDERALBLE NICKEL PLATING OVERALL CONTACT: COPPER ALLOY PLATING: 15u” GOLD PLATING ON CONTACT AREA

Contextual Info: 652/IEEE 1394 SMT Type MATERIALS : 1. HOUSING : PBT UL 94V-O RATED. 2. SHELL : COPPER ALLOY OR STEEL. 3. CONTACT : BRASS. PLATING : 1. SHELL : 150u" MIN TIN OVER 50u" NICKEL. 2. CONTACT : 20u" Pd/Ni 2u" AU. ELECTRICAL : 1. RATED VOLTAGE : 30V AC R.M.S . 2. RATED CURRENT : 1A / CONNTACT.

Contextual Info: 761/Modular Jack MATERIAL: 1. HOUSING : P.B.T. POLYESTER UL 94V-0 MIXED GLASS FIBER. STANDARD COLOR : BLACK. 2. CONTACTS : 0.35mm THICKNESS PHOSPHOR BRONZE, UNDER PLATED NICKEL ALL OVER, GOLD PLATED IN CONTACT AREA, TIN-LEAD IN SOLDER AREA. 3. SHIELDED : SUS301 STAINLESS, BRIGHT TIN-LEAD PLATED.

Contextual Info: 414/D-Sub HD 5.08mm Type MATERIAL: 1. INSULATOR : PBT + 30% GLASS FIBER UL 94V-0. COLOR-BLUE. 2. CONTACT : BRASS. 3. CONTACT PLATED : GOLD-FLASH OVER NICKEL. DIP AREA PLATED : TIN. 4. SHELL : STEEL WITH NICKEL PLATED. SPECIFICATION: 1. DIELECTRIC STRENGTH : 1000V FOR ONE MINUTE.