ALTERNATIVE ENIG Search Results

Strain gage report

Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
Contextual Info: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.

JIS-C-6429

Abstract: MF-R110-2 USMD1210 MF-R110-2-99 MF-MSMD equivalent alternative ENIG PTC 965
Contextual Info: Bourns Lead Free ® Multifuse Polymer PTCs Circuit Protection Solutions 1 Table Of Contents Table Of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

IPC-9702

Abstract: ipc 9702 Strain gage report bga dye pry black pad strain gage strain gage test IPC9702 4 MUD FR4 1.6mm substrate
Contextual Info: FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Altera Corporation, San Jose, CA, USA abansal@altera.com ABSTRACT PCB assembly and handling operations involving excessive

EN53x0D

Abstract: AN-101 EN5310 an101 Teflon 25um
Contextual Info: Application Note EN53x0D AN-101 January 2006 Rev 1.2 Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules Introduction This applications note addresses the following topics: • PCB Design Recommendations: o Pad Layout

sma connector footprint

Abstract: 142-0761-881 SMA End Launch connectors ro4003* substrate midwest microwave Rogers RO4003* characteristic impedance 50 ohm SMA terminators hf combiners RO4003C IPC-4552
Contextual Info: Johnson High Frequency End Launch Connectors Emerson Network Power Connectivity Solutions E M E R S O N. C O N S I D E R I T S O LV E D . High Frequency SMA End Launch Connectors Applications High Frequency SMA End Launch Connectors for Microwave PC Board Substrates

Contextual Info: connectBlue CB-OWL355 ELECTRICAL AND MECHANICAL DATA SHEET Preliminary data sheet Document Revision Document number: 23035905 Release: May 12, 2014 15:00 Document version: 3 Copyright 2014 connectBlue AB. The contents of this document can be changed by connectBlue AB without prior notice and do not constitute any

Contextual Info: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE

QFN PACKAGE thermal resistance

Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXUI QFN Package Soldering Guidelines John D. Weld, Ph.D. 11/4/2008 1.0 INTRODUCTION Enpirion’s EP53XXXUI power converter packages are designed with a plastic leadframe

EP53F8QI

Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53F8QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53F8QI power converter packages are designed with a plastic leadframe

EP5368QI

Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5368QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 9/27/2007 1.0 INTRODUCTION Enpirion’s EP5368QI power converter package is designed with a plastic leadframe

pcb fabrication process

Abstract: EP53
Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXQI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53XXXQI power converter packages are designed with a plastic leadframe

EN5311Qi

Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
Contextual Info: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package

EN5364QI

Contextual Info: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5364QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5364QI power converter packages are designed with a plastic leadframe

en5337qi

Abstract: EN5337 qfn 32 stencil smd be
Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5337QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 2/3/2009 1.0 INTRODUCTION Enpirion’s EN5337QI power converter packages are designed with a plastic leadframe

EN5335QI

Abstract: qfn stencil EN5335Q qfn 32 stencil Thermal vias
Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5335QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5335QI power converter packages are designed with a plastic leadframe

QFN leadframe

Abstract: smt pcb ipc standard
Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5362QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5362QI power converter packages are designed with a plastic leadframe

QFN-6x6 0.5mm

Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
Contextual Info: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona

qfn 32 land pattern

Abstract: EN5396QI QFN footprint QFN leadframe qfn 32 stencil
Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5396QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 6/18/2008 1.0 INTRODUCTION Enpirion’s EN5396QI power converter packages are designed with a plastic leadframe

EN5336QI

Abstract: stencil qfn stencil
Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5336QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5336QI power converter packages are designed with a plastic leadframe

EP5382QI

Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5382QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5382QI power converter packages are designed with a plastic leadframe

EN5394QI

Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394
Contextual Info: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5394QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5394QI power converter packages are designed with a plastic leadframe

IPC-7095B

Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
Contextual Info: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package

qfn 6x6 foot print

Abstract: QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater sensors-free QFN footprint QFN-6x6 package qfn stencil QFN-48 LAND PATTERN
Contextual Info: Freescale Semiconductor Application Note AN3111 Rev 2, 06/2007 Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona

inspection mirror

Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn stencil
Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5395QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 6/18/2008 1.0 INTRODUCTION Enpirion’s EN5395QI power converter packages are designed with a plastic leadframe