|
TCTH022BE
|
|
Toshiba Electronic Devices & Storage Corporation
|
Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function |
Datasheet
|
|
|
TCTH021BE
|
|
Toshiba Electronic Devices & Storage Corporation
|
Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type |
Datasheet
|
|
|
75844-156-10LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
131-5618-11D
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
PDF
|
|
|
75160-156-14LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,14 position, 2.54mm pitch |
PDF
|
|
