AJ MARKING Search Results

Contextual Info: LESHAN RADIO COMPANY, LTD. General Purpose Transistors NPN Silicon LBCX70GLT1G LBCX70JLT1G LBCX70KLT1G Featrues Pb-Free Package is Available. Ordering Information Device Marking LBCX70GLT1G LBCX70GLT3G LBCX70JLT1G LBCX70JLT3G LBCX70KLT1G AG AG AJ AJ AK Shipping

AJ-100EVB

Abstract: pir chip PIR sensor PR 161A 29861 block diagram of datasheet of infrared sensor LS 5208 pinout TMS 320 C 6X processor datasheet IEEE-1284 JEM2
Contextual Info: aJ-100TM Reference Manual December 6, 2001 Version 2.1 aJ-100 Real-time Low Power JavaTM Processor aJile Systems, Inc. aJ-100 is a trademark of aJile Systems, Inc. Sun, Sun Microsystems and Java are all trademarks of Sun Microsystems in the United States and other countries. All other trademarks are the property of their

aJ-200

Abstract: ycl pcb 452 SDC 2921 TT 2146 ph163539 D2318 LTS 543 seven segment display RGB888 to CCIR656 PIR based human motion DETECTOR CIRCUIT DIAGRAM aJ-102
Contextual Info: Technical Reference Manual Real-time, Low Power Network, Multimedia Direct Execution Microprocessor For The JME Platform aJ-200TTMM . Trade marks aJ-200 is trademark of aJile Systems, Inc. Sun, Sun Microsystems and Java are all trademarks of Sun Microsystems in the United States and other countries. All other trademarks are the property of

NLSX5011

Abstract: NLSX5011AMX1TCG NLSX5011BMX1TCG NLSX5011MUTCG UDFN6
Contextual Info: NLSX5011 1-Bit 100 Mb/s Configurable Dual-Supply Level Translator UDFN6 MU SUFFIX CASE 517AA P M G − VL may be greater than, equal to, or less than VCC = Specific Device Code = Date Code = Pb−Free Package ULLGA6 AMX1 SUFFIX CASE 613AE 1 AJ M G AJ M G = Specific Device Code

3164165

Abstract: TSOP-II-32 GPJ05855 hyb3165165 cmos dram 8m x 16 TSOPII-50 3165165AT 64M-DRAM marking AJ 7 3164805
Contextual Info: HYB 3164 5 400/5 AJ/AT -40/-50/-60 64M x 4 - Bit Dynamic RAM HYB 3164(5)800/5 AJ/AT -40/-50/-60 8M x 8 - Bit Dynamic RAM HYB 3164(5,6)160/5 AT -40/-50/-60 4M x 16 -Bit Dynamic RAM INFORMATION NOTE 64M - Bit DYNAMIC MEMORIES (Second Generation) General Information

848G-02

Abstract: marking 848G
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP 64 LEAD EXPOSED PAD 848G-02 ISSUE A DATE 12/03/2001 SCALE 1:1 4 PL M M/2 -Z- 0.20 0.008 T X−Y Z AJ AJ 64 49 1 48 PLATING -X- ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ AA -Y- L B J AB B/2 L/2 D REF 16 33 0.08 (0.003)

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP 52 LEAD EXPOSED PAD CASE 848H–01 ISSUE A DATE 11/14/2001 SCALE 1:1 4 PL M M/2 –Z– 0.20 0.008 T X-Y Z AJ AJ 52 40 1 39 PLATING –X– ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ AA –Y– L B J AB B/2 L/2 D

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP 52 LEAD EXPOSED PAD CASE 848H-01 ISSUE A DATE 11/14/2001 SCALE 1:1 4 PL M M/2 -Z- 0.20 0.008 T X−Y Z AJ AJ 52 40 1 39 PLATING -X- ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ AA -Y- L B J AB B/2 L/2 D REF 13 27 0.08 (0.003)

AH-64

Abstract: 848G-02
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP 64 LEAD EXPOSED PAD 848G–02 ISSUE A DATE 12/03/2001 SCALE 1:1 4 PL M M/2 –Z– 0.20 0.008 T X-Y Z AJ AJ 64 49 1 48 PLATING –X– ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ AA –Y– L B J AB B/2 L/2 D REF 16

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP 64 LEAD EXPOSED PAD 848G–01 ISSUE O DATE 06/14/2001 SCALE 1:1 4 PL M M/2 –Z– 0.20 0.008 T X-Y Z AJ AJ 64 49 1 48 PLATING –X– ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ AA –Y– L B J AB B/2 L/2 D REF 16

lqfp 52

Abstract: AJ52 LQFP PACKAGE footprint
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP 52 CASE 848H−01 ISSUE B DATE 16 FEB 2010 SCALE 1:1 4 PL M M/2 −Z− 0.20 0.008 T X-Y Z AJ AJ 52 40 39 1 PLATING −X− AA −Y− L ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ B AB B/2 L/2 13 D REF 27 0.08 (0.003)

BCX70G

Abstract: BCX70H BCX70J BCX70K SMD AJ aj smd npn
Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company SOT-23 Formed SMD Package BCX70G BCX70H BCX70J BCX70K SILICON PLANAR EPITAXIAL TRANSISTORS N–P–N silicon transistors Marking BCX70G = AG BCX70H = AH BCX70J = AJ

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company SOT-23 Formed SMD Package BCX70G BCX70H BCX70J BCX70K SILICON PLANAR EPITAXIAL TRANSISTORS N–P–N silicon transistors Marking BCX70G = AG BCX70H = AH BCX70J = AJ

Contextual Info: CDIIL BCX70G BCX70H BCX70J BCX70K SILICON PLANAR EPITAXIAL TRANSISTORS N-P-N silicon transistors Marking BCX70G = AG BCX70H = AH BCX70J = AJ BCX70K = AK PACKAGE OUTLINE DETAILS ALL DIMENSIONS IN mm 3.0 2.8 0.14 0.48 0.38 3 2.6 Pin configuration 2.4 1 = QASE

BCX70G

Abstract: BCX70H BCX70J BCX70K
Contextual Info: BCX70G BCX70H BCX70J BCX70K CDU SILICON PLANAR EPITAXIAL TRANSISTORS N -P -N Silicon transistors Marking BCX70G = AG BCX70H = AH BCX70J = AJ BCX70K = AK PACKAGE OUTLINE DETAILS ALL DIMENSIONS IN mm 3.0 2.8 0.14 0.48 i l 0.38 [I3 * I I I« 2.6 Pin configuration

Contextual Info: BCX70J NPN Silicon Plastic-Encapsulate Transistor Elektronische Bauelemente A suffix of "-C" specifies halogen & lead-free SOT-23 FEATURES A *Low Voltage L 3.COLLECTOR *Low Current 3 *RoHS Compliant Product Top View 1.BASE 1 B S 2 2.EMITTER MARKING V G *AJ

Contextual Info: L BCX70G BCX70H BCX7ÓJ BCX70K SILICON PLANAR EPITAXIAL TRANSISTORS N -P -N silicon transistors Marking PACKAGE O UTLINE DETAILS A LL DIM ENSIONS IN m m BCX70G = AG BCX70H = AH BCX70J = AJ BCX70K = AK 3.0_ 2.8 0.14 0.46 038 3 Pin configuration 1 = BASE 2 = EMITTER

BCX70J

Abstract: marking aj 17nF
Contextual Info: BCX70J NPN Silicon Plastic-Encapsulate Transistor Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free SOT-23 FEATURES   A Low Current Low Voltage 3 C B Top View 1 Collector 1 K  MARKING : AJ L 3 2

Contextual Info: Transistor, NPN 2SD1782K Features • available in SMT3 SMT, SC-59 package • package marking: 2SD1782K; AJ-fr, where ★ is hFE code • low collector saturation voltage, typically VCE(sat) = 0.2 V at lc/lB =0.5 A/50 mA • high breakdown voltage BV qeo =

BCW60

Abstract: BCX70
Contextual Info: BCW60 BCX70 SMALL SIGNAL NPN TRANSISTORS Type Marking BCW 60A AA BCW 60B AB BCW 60C AC BCX70G AG BCX70H AH BCX70J AJ 2 3 • ■ ■ ■ SILICON EPITAXIAL PLANAR NPN TRANSISTORS MINIATURE PLASTIC PACKAGE FOR APPLICATION IN SURFACE MOUNTING CIRCUITS LOW LEVEL AF AMPLIFICATION AND

Contextual Info: BAT54DW DUAL SURFACE MOUNT SCHOTTKY BARRIER DIODE Features • • • • Low Forward Voltage Drop Fast Switching Ultra-Small Surface Mount Package PN Junction Guard Ring for Transient and ESD Protection SOT-363 H A h FI H aJ t Mechanical Data_

SKE300CA

Abstract: SKE350 5KE400C 5KE56C 5KE24C 6283A 5KE200C 5KE170C 5KE51CA SKE300c
Contextual Info: 1.5KE SERIES Unidirectional or Bidirectional 'ají? TEL: 805-498-2111 FAX: 805-498-3804 1500 Watt Axial Leaded FEATURES: MECHANICAL CHARACTERISTICS: 1500 watts Peak Pulse Power Voltage R a n g e : 6.8V to 440V Each device 100% surge tested to Ipp Unidirectional & Bidirectional

AYWW marking code IC

Abstract: marking AJ 7 88XXXXX
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AJ 8 1 SCALE 1:1 DATE 19 SEP 2007 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.

3x18AWG

Abstract: E55943 E315167 LL81924 LL81924 Type SVT 60C 300V SP-305 ul e315167 LL81924 3X18AW
Contextual Info: MARKING: SP-305 E55943 60i0. 10A l o/ m 125V 10A 125 V aj C -i—i 0 i^H nl • 200±30 E-GREEN L-BLACK N-WHITE UL) E315167 SVT 60'C CSA LL81924 TYPE ITEM NO RoHS Com pliant TITLE SVT 3X18AWG(0.824mm) 60‘C 300V VW-1 3X0.824mm2 (18AWG) 300V VW-1 ASSMANN