|
TLP2304
|
|
Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 3750 Vrms, 5pin SO6 |
Datasheet
|
|
|
89852-304LF
|
|
Amphenol Communications Solutions
|
Dubox®, Board to Board connector, 2.54mm (0.100in), Receptacle, Right Angle, Through Hole, Selective Loading, Double Row, 9 positions |
PDF
|
|
|
75168-323-04LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 04 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
65823-049
|
|
Amphenol Communications Solutions
|
Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating. |
PDF
|
|
|
76342-304HLF
|
|
Amphenol Communications Solutions
|
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 8 Positions, 2.54mm (0.100in) Pitch |
PDF
|
|
