AE 920 B Search Results

BF 195 pin configuration

Contextual Info: PEH 532 RoHS 105°C Compliant • Snap-In • Long Life Grade • PCB Mounting • Low ESR and ESL • High ripple current application Basic design Typical applications for PEH 532 would be SMPS, drives, welding equipment, UPS and other power electronic applications where

transistor Bc 540

Abstract: IEC 384-4 PEH532YCC3180M2 PEH532VAG3220M2 PEH532SCG4100M2 BD 140 transistor CD 910 IEC 384 1 bc 10.9 transistor bc 540
Contextual Info: PEH 532 105°C • • • • • Snap-In Long Life Grade PCB Mounting Low ESR and ESL High ripple current APPLICATION BASIC DESIGN Typical applications for PEH 532 would be SMPS, drives, welding equipment, UPS and other power electronic applications where

E178462

Abstract: 06CMR 06DFR E 178462 B107A Hypert
Contextual Info: Leistungsrundsteckverbinder Serie P / Größe 1.5 Circular power connectors series P / size 1.5 Bauformübersicht Type overview Größe 1.5i Size 1.5i PPAF / DPAF PPAF / DPAF PPCM PFFA DFFA PFDM DFDM PRAF / DRAF HYPERT AC GMBH HYPERTA Ulrichsbergerstraße 17 • D-94469 Deggendorf

IEC 384-4

Abstract: PEH506YCD3220M2 transistor Bc 540 BD 140 transistor PEH506 PEH506YCG3330M2 780 AC PEH506Y PEH506VBE3220M2 AD-2
Contextual Info: PEH 506 85°C • • • • • Snap-In Long Life Grade PCB Mounting Low ESR and ESL High ripple current APPLICATION BASIC DESIGN Typical applications for PEH 506 would be SMPS, drives, welding equipment, UPS and other power electronic applications where

PEH506YDG3470M2

Contextual Info: PEH 506 RoHS 85°C Compliant • Snap-In • Long Life Grade • PCB mounting • Low ERS and ESL • High ripple current application Basic design Typical applications for PEH 506 would be SMPS, drives, welding equipment, UPS and other power electronic applications where

Contextual Info: Product specification 3CB/' ? @Y\R>@Cb ' : .99' 64;.9 >.;?6?@<> % ><1 A0@' A: : .>E 7NJ\]ZN[ ) ;J U ) 8=6CC: A ' ;J"`_#$^Rh U C=6C8: B : CHB D9: U 0 AHF6 ' D<> 8 A: J: A  1 F6H: 9 *( M ) >J   1 *+ ^" ) >J  1 +* $; +&/ 7 U  J6A6C8=: F6H: 9 U !DDHEF>

55100

Abstract: Hamlin din mount 35mm hamlin 55100
Contextual Info: www.hamlin.com 55100 Mini Flange Mount Hall Effect Sensor Features and Benefits Features Benefits • Magnetically operated position sensor • Digital, latching or programmable analogue types available • Medium, high or programmable senisitivities • 3 wire voltage output or 2 wire

Contextual Info: J0':/990'7G3020!756AD3756A J0%0</?20"<B;A/093 J0+7230&/;530;=BA J09/@@003#<05?<B;20;332324  90%3-)50 )+/)05403022.,'%5,104 %<?A/0930"3271/90>B7=:3;A 3;3?/90!<D0%<D3?0=971/A7<;@ "0'3?73@ BF0A<0EA+0"3271/9070

BK 1085

Abstract: BD 37 931 s MIL-STD-681 bc 681 bD 37 931
Contextual Info: AirBorn, Inc, THE CO NNECTO R £ NM—212—0 2 5 —161—JCAC COM PANY • ROW Cable to Board Vertical SMT . 025 " NM, NK 9 thru 51 Contacts PLUG RECEPTACLE VERTICAL SMT I/O DIMENSIONS SIZE 9 15 21 25 31 37 51 65 69 I*« .» ç . r . N Series C on n e cto rs

UU 9.8 ferrite core

Abstract: 36x23x15 FUU-10.5 NC-7 FR-22x14x8 FR-14x8x4 FR-10x5x5T FR-36x23x15 NC-2H NC-2h ferrite material uu 9.8 ferrite
Contextual Info: TOROIDS & U - Type Ferrite Cores •Ordering Code System [ Toroids Cores ] F R - 10 x 5 × 5 NC-7 ① ② ③ ④ ⑤ ①Type of Core ②Outside Diameter ③Inside Diameter ④Height ⑤Material [ U Cores ] F UU - 9.8 - NC-5Y ① ② ③ ①Type of Core ②Size of Core

Contextual Info: KODENSHI CORP ’ 25E D HPI-23F Sn • T '- Lj-}-i 3 5242L0a G D Q O i n b ■ ftW * DIMENSIONS (Unit: mm) <n'> i; n > p m $ 7 * * ? ■ < * - KT'-fo m k n m x - m m ^ ^ •c to The HPI-23F is a high-speed, high-output silicon PIN photodiode mounted in a clear sideiooking package. The

T9FP3622A-16000

Abstract: T9FP2616A-7200 FP-221 f1rm FP26 RM1400B RM1000B RM0500 25kHz-20 RM0500B
Contextual Info: Soft Ferrites RM, FM and FP Cores KEY APPLICATIONS • SMPS • High Power HOW TO ORDER F 1 R M 0 6 0 0 B Material Model Shape Code Form Factor A 1 5 0 Finishing Ungapped core ⇒ –––– Core supplied with tolerated AL value: • A + AL value in nH ex: AL = 250 nH

Contextual Info: fiPB10474E 1024 X 4-Bit 10K EC L RAM NEC Electronics Inc. Description Pin Configurations The ji/PB10474E is a very-high-speed 10K interface ECL RAM organized as 1024 words by 4 bits and designed w ith noninverted, open-em itter ou tputs and low power consum ption.

SN74ACT7804

Abstract: SN74ACT7806 SN74ACT7814 fr0171
Contextual Info: SN74ACT7806 256 x 18 FIRST-IN, FIRST-OUT MEMORY SCAS436-APRIL 1992 DL PACKAGE TOP VIEW Member of the Texas Instruments W idebus Family Load Clock and Unload Clock Can Be Asynchronous or Coincident u RESET 1 D 17 2 55 ] Q 1 7 256 Words by 18 Bits D 16

MS-027

Abstract: 1404s JEDEC Jc-11 11321 AA
Contextual Info: b2 -H (b2) H H e/2 /8 \ 050 MAX-1 \ / I (b) EVEN L E A D S / S I D E .045 .035 050 MAX-i \ / T (b) - . (DATUM PLANE A) I .045 .035 ODD L E A D S / S I D E . (DATUM PLANE A) VIEW B JEDEC SOLID STATE P R O D U C T OUTLINES THIS STANDARD OUTLINE HAS BEEN PREPARED BY THE JEDEC JC-11

B66281G0000X192

Abstract: B66281 B66281G0000X149 B66281G0000X187 B66281G0000X197 B66281P0000X149 B66281P0000X192 ferrite TRANSFORMER calculation
Contextual Info: Ferrites and accessories EELP 14, EILP 14 Core set without clamp recess Series/Type: Date: B66281G, B66281P September 2006 Data Sheet  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited.

AE208

Contextual Info: Gemini Series Toggle Switches, AE Series, Process Sealed, Part Number Matrix "AE" SERIES DESIGN FEATURES ENVIRONMENTAL SPECIFICATIONS • MIL-STD-202 Method 112C Leak Test • Toggle – Machined brass, heavy nickel plated. • Bushing & Cover - Nylon, ultrasonically welded to case, with integral

SK22405B

Abstract: 750 271 sk224 MS-001 BI jedec MS-001 JEDEC 95 MS-001 BC
Contextual Info: JE D E C P u b lic a t io n P a g e _ No. 95 WITH LEAD FINISH 7 -B-l N — bl m r«i r«i AREA -Tff u El c> i 1 1 2 3 Z N/2 BASE METAL -<b>- SECTIDN Z-Z BASE PLANE SEATING PLANE A 4 A l A D1 — 1/2 LEAD PL A C E S 4 A A h - D1 F U L L LEAD 4 PLACES PLACES

KMM5361000

Abstract: KMM5361000/A
Contextual Info: SAMSUNG ELECTRONICS INC 42E ]> • T ^ b M m s GülGSlb Ô KMM5361000 DRAM MODULES 'T - % iï~ n 1 M X 36 DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM5361000 is a 1M bitsX36 Dynamic RAM high density memory module. The Samsung

Contextual Info: @ LG Semicon. Co. LTD. Description Features The GMM7402000CS/SG is a 2M x 40 bits D y n a m ic R A M M O D U L E w h ic h is assembled 20 pieces of 1M x 4 bit DRAMs in 20/26 pin SOJ package on both side the p rin te d c irc u it board w ith d e co u p lin g

Contextual Info: PM150CSD120 Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 724 925-7272 Intellimod Module Three Phase IGBT Inverter Output 150 Amperes/1200 Volts A B H AA - DIA. (4 TYP.) W W Y Z 12 3 4 5678 9 11 13 15 17 19 N Q 1. V UPC 2. UFO 3. U P

Contextual Info: M S - 0 15 .300, .400, .600, & .900" DUAL IN LINE .100 CENTER CERAMIC SIDE BRAZED STANDARD N -B E1 INOEX AREA 2 3 i .000 -.030 .76 MAX C | A CD L SHEET : 1 OF 10 NOTES: 1. CONTROLLING 0 1MENS IONS: INCH. IN CASE OF CONFLICT BETWEEN ENGLISH ANO METRIC DIMENSIONS.

Contextual Info: Laser Diode Technical Data PLD904-10-MG TEMPERATURE CHARACTERISTIS Features DESCRIPTION • MOCVD Pulsed Laser Diode Operation Temperature C • Wavelength : 904 nm (Typ.) Storage Temperature ( C) • Peak Power : 10 W (Pulsed Min) • Threshold Current : 400 mA ( Typ. )

pm200csa060

Abstract: MITSUBISHI INTELLIGENT POWER MODULES
Contextual Info: MITSUBISHI INTELLIGENT POWER MODULES PM200CSA060 FLAT-BASE TYPE INSULATED PACKAGE A B H AA - DIA. 4 TYP. W W Y Z 12 3 4 5678 9 11 13 15 17 19 N Q 1. V UPC 2. UFO 3. U P 4. V UPI 5. V VPC 6. VFO 7. V P 8. V VPI 9. V WPC 10. WFO V P T Y R Y AC W AC 10 12 14 16 18