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2SA1162
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Toshiba Electronic Devices & Storage Corporation
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PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346 |
Datasheet
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79821-162HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail. |
PDF
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131-5116-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
PDF
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131-4116-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
PDF
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77311-162-36LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch. |
PDF
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