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G861AD04511T1EU
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Amphenol Communications Solutions
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Wafer 2.54mm Pitch STR DIP, 1x4Pin, MATTE TIN, NY66, TAIL=3.4mm, Color-CREAM, Halogen Free, Friction |
PDF
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G861AD04101S1HR
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Amphenol Communications Solutions
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Wafer 2.54mm Pitch,STR SMT,1x4Pin,G/F,LCP,Color-Black, T&R W/CAP |
PDF
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68000-434HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail |
PDF
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68000-436HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail |
PDF
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68000-436H
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch |
PDF
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