XAPP623
Abstract: XC3S500E-FT256 simulation model electrolytic capacitor XC3S500E FG256 FT256 UG112 XAPP489 hyperlynx PCB echo sound
Contextual Info: Application Note: Spartan-3E Family R Four- and Six-Layer, High-Speed PCB Design for the Spartan-3E FT256 BGA Package XAPP489 v1.0 October 31, 2006 Summary This application note addresses low-cost, four- to six-layer, high-volume printed circuit board (PCB) layout for a Spartan -3E FPGA in the FT256 1 mm BGA package. The impact of highspeed signals and signal integrity (SI) considerations for low layer count PCB layouts is also
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ft256xapp489fg256guideliug112+8ds312xapp623xc3s500e-ft256simulation model electrolytic capacitorxc3s500eug112hyperlynxpcb echo sound
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