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XAPP425 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Lead Free reflow soldering profile BGA Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile Contextual Info: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 v1.0 December 9, 2002 Summary The primary purpose of solder reflow process is to wet the surfaces to be joined to form a strong metallurgical bond between the component and the PC board.	Original	XAPP425 Lead Free reflow soldering profile BGA XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile	PDF

Catalog Datasheet

Type

Document Tags

PDF

Lead Free reflow soldering profile BGA

Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile
Contextual Info: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 v1.0 December 9, 2002 Summary The primary purpose of solder reflow process is to wet the surfaces to be joined to form a strong metallurgical bond between the component and the PC board.

Original

XAPP425 Lead Free reflow soldering profile BGA XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile

PDF