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67292-013
|
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 26 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
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67292-013LF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 26 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
|
|
|
65692-013LF
|
|
Amphenol Communications Solutions
|
Quickie® Slimline Header, Wire To Board, Through Hole, Vertical, Double Row, 26 Positions, 2.54mm (0.100in) Pitch |
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54122-119201300LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch |
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|
65692-013
|
|
Amphenol Communications Solutions
|
Quickie® Slimline Header, Wire To Board, Through Hole, Vertical, Double Row, 26 Positions, 2.54mm (0.100in) Pitch |
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