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61083-164402LF
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Amphenol Communications Solutions
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BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions. |
PDF
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131-6414-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
PDF
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131-6418-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP. |
PDF
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69133-164HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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61083-164429LF
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Amphenol Communications Solutions
|
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions. |
PDF
|
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