SIGC186T170R3E Search Results
SIGC186T170R3E Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIGC186T170R3EX1SA4- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC186T170R3EX1SA4) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC186T170R3EX1SA4 | Waffle Pack | 1,233 |
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Buy Now | ||||||
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SIGC186T170R3EX1SA4 | 540 |
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SIGC186T170R3E Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: SIGC186T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling Chip Type SIGC186T170R3E VCE IC 1700V 150A This chip is used for: power modules |
Original |
SIGC186T170R3E L7797M, L7797T, L7797E, | |
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Contextual Info: SIGC186T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC186T170R3E VCE IC 1700V 150A This chip is used for: • power modules |
Original |
SIGC186T170R3E L7791T, |