SIGC128T170R3E Search Results
SIGC128T170R3E Price and Stock
Infineon Technologies AG SIGC128T170R3EX1SA1IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC128T170R3EX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC128T170R3EX1SA1 | Waffle Pack | 1,809 |
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SIGC128T170R3EX1SA1 | 71 Weeks | 1 |
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SIGC128T170R3E Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: SIGC128T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC128T170R3E VCE IC 1700V 100A This chip is used for: • power modules |
Original |
SIGC128T170R3E L7781T, | |
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Contextual Info: SIGC128T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC128T170R3E VCE IC 1700V 100A This chip is used for: • power modules |
Original |
SIGC128T170R3E L7781T, | |
|
Contextual Info: SIGC128T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling Chip Type SIGC128T170R3E VCE IC 1700V 100A This chip is used for: power modules |
Original |
SIGC128T170R3E L7787M, L7787T, L7787E, |