SIGC101T170R3E Search Results
SIGC101T170R3E Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIGC101T170R3EX1SA2- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC101T170R3EX1SA2) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC101T170R3EX1SA2 | Waffle Pack | 2,340 |
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SIGC101T170R3EX1SA2 | 71 Weeks | 1 |
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SIGC101T170R3E Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
tsc 1003Contextual Info: SIGC101T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives |
Original |
SIGC101T170R3E L7771T, tsc 1003 | |
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Contextual Info: SIGC101T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling This chip is used for: power modules C Applications: drives |
Original |
SIGC101T170R3E L7777M, L7777T, L7777E, |