SIDC38D65C8 Search Results
SIDC38D65C8 Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIDC38D65C8X1SA1Fast switching diode chip in EMCON 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D65C8X1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIDC38D65C8X1SA1 | Waffle Pack | 20 Weeks | 6,246 |
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SIDC38D65C8X1SA1 | 21 Weeks | 1 |
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SIDC38D65C8 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: SIDC38D65C8 Fast switching diode chip in EMCON 3 -Technology Features: • 650V EMCON 3 technology 65 µm chip • Soft, fast switching • Low reverse recovery charge • Small temperature coefficient • Qualified according to JEDEC for target applications |
Original |
SIDC38D65C8 L4030C, |