95278-801-44LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating |
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10138980-1411LF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 14 Positions, Black Color, LCP, GW Compatible, Tray packing, With Kink Tails. |
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10076801-406-10LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 10 Positions, 2.54mm (0.100in) Pitch, Pin In Paste |
PDF
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10076801-405T18LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 18 Positions, 2.54mm (0.100in) Pitch, Pin In Paste |
PDF
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10076801-404T06LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 6 Positions, 2.54mm (0.100in) Pitch, Pin In Paste |
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