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10131319-10111G0LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing. |
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10131319-1012200LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 10 Positions, LCP, Non GW Compatible, Tray Packing. |
PDF
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10114829-10105LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 5 Positions |
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68449-101HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 1 Positions, 2.54mm (0.100in) Pitch. |
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10034249-101LF
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Amphenol Communications Solutions
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AirMax VS®, Backplane Connectors, Header, Right Angle, Press-Fit, 3 Pair, 10 Column, 90 Position, 2.00mm (0.079in) Pitch |
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