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50009-1256CLF
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Amphenol Communications Solutions
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High Pin Count, Backplane Connectors, Header, Vertical, 4 Row, 0 Guide Pin, Solder-less Press-Fit, 256 Positions, 2.54mm (0.100in) Pitch |
PDF
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TPS61256CYFFR
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Texas Instruments
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3.5-MHz High Efficiency Step-Up Converter in Chip Scale Package 9-DSBGA -40 to 85 |
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TPS61256CYFFT
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Texas Instruments
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3.5-MHz High Efficiency Step-Up Converter in Chip Scale Package 9-DSBGA -40 to 85 |
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10129381-950004BLF
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Amphenol Communications Solutions
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EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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10128492-119500ULF
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Amphenol Communications Solutions
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ExaMEZZ® 56Gb/s High Speed Mezzanine 4-pair, 19 column, 19.5mm stacking height, 266contacts |
PDF
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